JP3945964B2 - 研磨剤、研磨方法及び半導体装置の製造方法 - Google Patents

研磨剤、研磨方法及び半導体装置の製造方法 Download PDF

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Publication number
JP3945964B2
JP3945964B2 JP2000164650A JP2000164650A JP3945964B2 JP 3945964 B2 JP3945964 B2 JP 3945964B2 JP 2000164650 A JP2000164650 A JP 2000164650A JP 2000164650 A JP2000164650 A JP 2000164650A JP 3945964 B2 JP3945964 B2 JP 3945964B2
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JP
Japan
Prior art keywords
acid
abrasive
polishing
compounds
dispersion medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000164650A
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English (en)
Japanese (ja)
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JP2001342454A (ja
JP2001342454A5 (https=
Inventor
勝啓 太田
昭男 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2000164650A priority Critical patent/JP3945964B2/ja
Priority to TW090104426A priority patent/TWI236498B/zh
Priority to KR10-2001-0010428A priority patent/KR100483411B1/ko
Priority to SG200101322A priority patent/SG100632A1/en
Priority to US09/797,940 priority patent/US6758872B2/en
Priority to US09/940,881 priority patent/US6656022B2/en
Priority to US09/940,880 priority patent/US6656021B2/en
Publication of JP2001342454A publication Critical patent/JP2001342454A/ja
Priority to KR10-2004-0076924A priority patent/KR100468988B1/ko
Publication of JP2001342454A5 publication Critical patent/JP2001342454A5/ja
Application granted granted Critical
Publication of JP3945964B2 publication Critical patent/JP3945964B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2000164650A 2000-06-01 2000-06-01 研磨剤、研磨方法及び半導体装置の製造方法 Expired - Fee Related JP3945964B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000164650A JP3945964B2 (ja) 2000-06-01 2000-06-01 研磨剤、研磨方法及び半導体装置の製造方法
TW090104426A TWI236498B (en) 2000-06-01 2001-02-27 Abrasive, method for polishing and method for manufacturing semiconductor
KR10-2001-0010428A KR100483411B1 (ko) 2000-06-01 2001-02-28 연마제, 연마 방법 및 반도체 장치의 제조 방법
US09/797,940 US6758872B2 (en) 2000-06-01 2001-03-05 Polishing slurry
SG200101322A SG100632A1 (en) 2000-06-01 2001-03-05 Polishing slurry, polishing method and processes for fabricating semiconductor devices
US09/940,881 US6656022B2 (en) 2000-06-01 2001-08-29 Method for polishing a semiconductor substrate member
US09/940,880 US6656021B2 (en) 2000-06-01 2001-08-29 Process for fabricating a semiconductor device
KR10-2004-0076924A KR100468988B1 (ko) 2000-06-01 2004-09-24 연마제, 연마 방법 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000164650A JP3945964B2 (ja) 2000-06-01 2000-06-01 研磨剤、研磨方法及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2001342454A JP2001342454A (ja) 2001-12-14
JP2001342454A5 JP2001342454A5 (https=) 2004-11-11
JP3945964B2 true JP3945964B2 (ja) 2007-07-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000164650A Expired - Fee Related JP3945964B2 (ja) 2000-06-01 2000-06-01 研磨剤、研磨方法及び半導体装置の製造方法

Country Status (5)

Country Link
US (3) US6758872B2 (https=)
JP (1) JP3945964B2 (https=)
KR (2) KR100483411B1 (https=)
SG (1) SG100632A1 (https=)
TW (1) TWI236498B (https=)

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Also Published As

Publication number Publication date
KR20010109071A (ko) 2001-12-08
US20020090894A1 (en) 2002-07-11
US20020034925A1 (en) 2002-03-21
US6656022B2 (en) 2003-12-02
KR100483411B1 (ko) 2005-04-15
JP2001342454A (ja) 2001-12-14
SG100632A1 (en) 2003-12-26
KR20040089044A (ko) 2004-10-20
KR100468988B1 (ko) 2005-02-02
US20020004360A1 (en) 2002-01-10
US6656021B2 (en) 2003-12-02
TWI236498B (en) 2005-07-21
US6758872B2 (en) 2004-07-06

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