KR100483411B1 - 연마제, 연마 방법 및 반도체 장치의 제조 방법 - Google Patents

연마제, 연마 방법 및 반도체 장치의 제조 방법 Download PDF

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Publication number
KR100483411B1
KR100483411B1 KR10-2001-0010428A KR20010010428A KR100483411B1 KR 100483411 B1 KR100483411 B1 KR 100483411B1 KR 20010010428 A KR20010010428 A KR 20010010428A KR 100483411 B1 KR100483411 B1 KR 100483411B1
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KR
South Korea
Prior art keywords
acid
abrasive
dispersion medium
polishing
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-0010428A
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English (en)
Korean (ko)
Other versions
KR20010109071A (ko
Inventor
가쯔히로 오따
아끼오 사이또
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20010109071A publication Critical patent/KR20010109071A/ko
Application granted granted Critical
Publication of KR100483411B1 publication Critical patent/KR100483411B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR10-2001-0010428A 2000-06-01 2001-02-28 연마제, 연마 방법 및 반도체 장치의 제조 방법 Expired - Fee Related KR100483411B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-164650 2000-06-01
JP2000164650A JP3945964B2 (ja) 2000-06-01 2000-06-01 研磨剤、研磨方法及び半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-0076924A Division KR100468988B1 (ko) 2000-06-01 2004-09-24 연마제, 연마 방법 및 반도체 장치의 제조 방법

Publications (2)

Publication Number Publication Date
KR20010109071A KR20010109071A (ko) 2001-12-08
KR100483411B1 true KR100483411B1 (ko) 2005-04-15

Family

ID=18668241

Family Applications (2)

Application Number Title Priority Date Filing Date
KR10-2001-0010428A Expired - Fee Related KR100483411B1 (ko) 2000-06-01 2001-02-28 연마제, 연마 방법 및 반도체 장치의 제조 방법
KR10-2004-0076924A Expired - Fee Related KR100468988B1 (ko) 2000-06-01 2004-09-24 연마제, 연마 방법 및 반도체 장치의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR10-2004-0076924A Expired - Fee Related KR100468988B1 (ko) 2000-06-01 2004-09-24 연마제, 연마 방법 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
US (3) US6758872B2 (https=)
JP (1) JP3945964B2 (https=)
KR (2) KR100483411B1 (https=)
SG (1) SG100632A1 (https=)
TW (1) TWI236498B (https=)

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KR100445757B1 (ko) * 2001-12-28 2004-08-25 제일모직주식회사 금속배선 연마용 슬러리 조성물
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KR20100079441A (ko) * 2008-12-31 2010-07-08 주식회사 동진쎄미켐 금속막에 대한 연마율 및 선택비가 향상된 화학-기계적 연마 슬러리 조성물
US9368367B2 (en) * 2009-04-13 2016-06-14 Sinmat, Inc. Chemical mechanical polishing of silicon carbide comprising surfaces
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US9305851B2 (en) * 2013-11-19 2016-04-05 Taiwan Semiconductor Manufacturing Company Limited Systems and methods for chemical mechanical planarization with fluorescence detection
JP6557243B2 (ja) * 2014-09-26 2019-08-07 株式会社フジミインコーポレーテッド 研磨用組成物
CN105525318A (zh) * 2016-01-18 2016-04-27 苏州市华婷特种电镀有限公司 一种电镀工艺中对镀件预处理的方法
US11498182B2 (en) * 2016-02-26 2022-11-15 Fujimi Incorporated Polishing method and polishing pad
JP7252712B2 (ja) * 2017-03-31 2023-04-05 ナガセケムテックス株式会社 エッチング液
US10510601B2 (en) * 2017-09-28 2019-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method for reducing metal plug corrosion and device
CN109352430B (zh) * 2018-12-12 2020-12-04 中国电子科技集团公司第四十六研究所 一种减小锗磨削片弯曲度的加工方法
CN112500302A (zh) * 2020-12-30 2021-03-16 沧州华晨生物科技有限公司 一种工业甘氨酸的生产方法
CN114029511A (zh) * 2021-11-10 2022-02-11 成都先进金属材料产业技术研究院股份有限公司 钛合金slm成型件支撑结构及其去除方法
CN121399219A (zh) * 2023-06-01 2026-01-23 圣戈本陶瓷及塑料股份有限公司 用于进行材料移除操作的抛光组合物和方法
CN116924453A (zh) * 2023-06-15 2023-10-24 中国科学院福建物质结构研究所 一种稀土碘酸盐材料及其制备方法和应用

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Also Published As

Publication number Publication date
KR20010109071A (ko) 2001-12-08
US20020090894A1 (en) 2002-07-11
US20020034925A1 (en) 2002-03-21
US6656022B2 (en) 2003-12-02
JP3945964B2 (ja) 2007-07-18
JP2001342454A (ja) 2001-12-14
SG100632A1 (en) 2003-12-26
KR20040089044A (ko) 2004-10-20
KR100468988B1 (ko) 2005-02-02
US20020004360A1 (en) 2002-01-10
US6656021B2 (en) 2003-12-02
TWI236498B (en) 2005-07-21
US6758872B2 (en) 2004-07-06

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