JP3904585B2 - 半導体素子の製造方法 - Google Patents

半導体素子の製造方法 Download PDF

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Publication number
JP3904585B2
JP3904585B2 JP2005293340A JP2005293340A JP3904585B2 JP 3904585 B2 JP3904585 B2 JP 3904585B2 JP 2005293340 A JP2005293340 A JP 2005293340A JP 2005293340 A JP2005293340 A JP 2005293340A JP 3904585 B2 JP3904585 B2 JP 3904585B2
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groove
broken
line
substrate
group iii
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JP2005293340A
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Japanese (ja)
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JP2006135309A5 (https=
JP2006135309A (ja
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健次 薬師寺
克輝 楠木
久幸 三木
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Resonac Holdings Corp
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Showa Denko KK
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JP2005293340A 2004-10-07 2005-10-06 半導体素子の製造方法 Expired - Lifetime JP3904585B2 (ja)

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JP2005293340A JP3904585B2 (ja) 2004-10-07 2005-10-06 半導体素子の製造方法

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JP2004294934 2004-10-07
JP2005293340A JP3904585B2 (ja) 2004-10-07 2005-10-06 半導体素子の製造方法

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JP2006104396A Division JP2006203251A (ja) 2004-10-07 2006-04-05 半導体素子の製造方法

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JP2006135309A JP2006135309A (ja) 2006-05-25
JP2006135309A5 JP2006135309A5 (https=) 2006-07-06
JP3904585B2 true JP3904585B2 (ja) 2007-04-11

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Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100189289A1 (en) * 2006-06-29 2010-07-29 Yusuke Takeuchi Capacitor microphone chip, capacitor microphone, and manufacturing method thereof
JP2008311404A (ja) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd ウエーハの加工方法
WO2011007816A1 (ja) * 2009-07-15 2011-01-20 三菱化学株式会社 半導体発光素子、半導体発光装置、半導体発光素子の製造方法、および半導体発光装置の製造方法
JP2011124323A (ja) * 2009-12-09 2011-06-23 Disco Abrasive Syst Ltd 発光デバイス、発光デバイスの製造方法および発光デバイス素材の加工装置
JP2013118277A (ja) * 2011-12-02 2013-06-13 Mitsuboshi Diamond Industrial Co Ltd Ｌｅｄパターン付き基板の加工方法
WO2014108777A1 (en) * 2013-01-08 2014-07-17 Koninklijke Philips N.V. Shaped led for enhanced light extraction efficiency
JP6464877B2 (ja) * 2014-05-21 2019-02-06 日亜化学工業株式会社 発光装置の製造方法
JP6444754B2 (ja) 2015-02-05 2018-12-26 日亜化学工業株式会社 発光装置
JP6142883B2 (ja) 2015-02-05 2017-06-07 日亜化学工業株式会社 発光装置
JP6156402B2 (ja) 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
JP6407056B2 (ja) * 2015-02-20 2018-10-17 株式会社ディスコ 分割装置と分割方法
EP3062354B1 (en) 2015-02-26 2020-10-14 Nichia Corporation Light emitting element
JP6146460B2 (ja) * 2015-02-26 2017-06-14 日亜化学工業株式会社 発光素子
JP6428467B2 (ja) * 2015-04-24 2018-11-28 日亜化学工業株式会社 発光素子
JP6265175B2 (ja) 2015-06-30 2018-01-24 日亜化学工業株式会社 半導体素子の製造方法
JP6696298B2 (ja) * 2015-07-30 2020-05-20 日亜化学工業株式会社 発光素子及びそれを用いた発光装置
JP6468113B2 (ja) * 2015-07-31 2019-02-13 日亜化学工業株式会社 発光素子の製造方法
JP6575282B2 (ja) * 2015-10-08 2019-09-18 日亜化学工業株式会社 発光装置
JP6361645B2 (ja) 2015-12-22 2018-07-25 日亜化学工業株式会社 発光装置
JP2017188603A (ja) * 2016-04-07 2017-10-12 三菱電機株式会社 半導体装置
JP6874288B2 (ja) 2016-06-30 2021-05-19 日亜化学工業株式会社 発光装置及びバックライト光源
JP6327382B2 (ja) * 2017-05-10 2018-05-23 日亜化学工業株式会社 発光装置及びその製造方法
JP6489159B2 (ja) * 2017-06-06 2019-03-27 日亜化学工業株式会社 発光装置
JP6402809B2 (ja) * 2017-07-05 2018-10-10 日亜化学工業株式会社 発光装置
JP6750653B2 (ja) * 2017-09-29 2020-09-02 日亜化学工業株式会社 発光素子
JP7107436B2 (ja) * 2019-05-23 2022-07-27 三菱電機株式会社 ダイシングテープの貼付方法
JP7364860B2 (ja) 2019-07-01 2023-10-19 日亜化学工業株式会社 発光素子の製造方法
EP3772748B1 (en) 2019-08-07 2025-10-15 Nichia Corporation Method of manufacturing light emitting element
JP6869393B1 (ja) 2020-03-12 2021-05-12 シチズン千葉精密株式会社 位置変換器、および検出器の製造方法
JP7716305B2 (ja) * 2021-10-11 2025-07-31 株式会社デンソー 半導体装置の製造方法
JP7243899B1 (ja) 2022-04-27 2023-03-22 信越半導体株式会社 発光素子及びその製造方法
CN115274424B (zh) * 2022-06-24 2024-01-19 安徽安芯电子科技股份有限公司 半导体晶片切割工艺

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