JP3902037B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP3902037B2
JP3902037B2 JP2002077891A JP2002077891A JP3902037B2 JP 3902037 B2 JP3902037 B2 JP 3902037B2 JP 2002077891 A JP2002077891 A JP 2002077891A JP 2002077891 A JP2002077891 A JP 2002077891A JP 3902037 B2 JP3902037 B2 JP 3902037B2
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Japan
Prior art keywords
solder
suction
electronic component
solder bump
electrode pad
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Expired - Fee Related
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JP2002077891A
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Japanese (ja)
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JP2003282605A5 (enExample
JP2003282605A (ja
Inventor
彰 牛島
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Toshiba Corp
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Toshiba Corp
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Priority to JP2002077891A priority Critical patent/JP3902037B2/ja
Publication of JP2003282605A publication Critical patent/JP2003282605A/ja
Publication of JP2003282605A5 publication Critical patent/JP2003282605A5/ja
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    • H10W72/0711—

Landscapes

  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2002077891A 2002-03-20 2002-03-20 半導体装置の製造方法 Expired - Fee Related JP3902037B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002077891A JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002077891A JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003282605A JP2003282605A (ja) 2003-10-03
JP2003282605A5 JP2003282605A5 (enExample) 2005-08-25
JP3902037B2 true JP3902037B2 (ja) 2007-04-04

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ID=29228159

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JP2002077891A Expired - Fee Related JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

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JP (1) JP3902037B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108990A (ja) * 2009-11-20 2011-06-02 Shibuya Kogyo Co Ltd ボンディング装置
DE102018109229A1 (de) * 2018-04-18 2019-10-24 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Lötwerkzeug mit einer düsenartigen Lötspitze und einem in der Lötspitze verlaufenden Kanal zur Heißgaszuführung
KR102568388B1 (ko) * 2018-06-04 2023-08-18 한화정밀기계 주식회사 본딩 장치

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Publication number Publication date
JP2003282605A (ja) 2003-10-03

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