JP2003282605A5 - - Google Patents

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Publication number
JP2003282605A5
JP2003282605A5 JP2002077891A JP2002077891A JP2003282605A5 JP 2003282605 A5 JP2003282605 A5 JP 2003282605A5 JP 2002077891 A JP2002077891 A JP 2002077891A JP 2002077891 A JP2002077891 A JP 2002077891A JP 2003282605 A5 JP2003282605 A5 JP 2003282605A5
Authority
JP
Japan
Prior art keywords
solder bump
electrode pad
electric component
solder
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002077891A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003282605A (ja
JP3902037B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002077891A priority Critical patent/JP3902037B2/ja
Priority claimed from JP2002077891A external-priority patent/JP3902037B2/ja
Publication of JP2003282605A publication Critical patent/JP2003282605A/ja
Publication of JP2003282605A5 publication Critical patent/JP2003282605A5/ja
Application granted granted Critical
Publication of JP3902037B2 publication Critical patent/JP3902037B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002077891A 2002-03-20 2002-03-20 半導体装置の製造方法 Expired - Fee Related JP3902037B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002077891A JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002077891A JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2003282605A JP2003282605A (ja) 2003-10-03
JP2003282605A5 true JP2003282605A5 (enExample) 2005-08-25
JP3902037B2 JP3902037B2 (ja) 2007-04-04

Family

ID=29228159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002077891A Expired - Fee Related JP3902037B2 (ja) 2002-03-20 2002-03-20 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3902037B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108990A (ja) * 2009-11-20 2011-06-02 Shibuya Kogyo Co Ltd ボンディング装置
DE102018109229A1 (de) * 2018-04-18 2019-10-24 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Lötwerkzeug mit einer düsenartigen Lötspitze und einem in der Lötspitze verlaufenden Kanal zur Heißgaszuführung
KR102568388B1 (ko) * 2018-06-04 2023-08-18 한화정밀기계 주식회사 본딩 장치

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