JP2004179677A5 - - Google Patents

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Publication number
JP2004179677A5
JP2004179677A5 JP2004025535A JP2004025535A JP2004179677A5 JP 2004179677 A5 JP2004179677 A5 JP 2004179677A5 JP 2004025535 A JP2004025535 A JP 2004025535A JP 2004025535 A JP2004025535 A JP 2004025535A JP 2004179677 A5 JP2004179677 A5 JP 2004179677A5
Authority
JP
Japan
Prior art keywords
inner lead
electrode pad
bonded
semiconductor chip
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004025535A
Other languages
English (en)
Japanese (ja)
Other versions
JP3702963B2 (ja
JP2004179677A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004025535A priority Critical patent/JP3702963B2/ja
Priority claimed from JP2004025535A external-priority patent/JP3702963B2/ja
Publication of JP2004179677A publication Critical patent/JP2004179677A/ja
Publication of JP2004179677A5 publication Critical patent/JP2004179677A5/ja
Application granted granted Critical
Publication of JP3702963B2 publication Critical patent/JP3702963B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004025535A 1997-01-07 2004-02-02 半導体集積回路装置の製造方法 Expired - Fee Related JP3702963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004025535A JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1206697 1997-01-07
JP1739597 1997-01-14
JP2004025535A JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP27393997A Division JP3534583B2 (ja) 1997-01-07 1997-09-19 半導体集積回路装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005142458A Division JP4004513B2 (ja) 1997-01-07 2005-05-16 半導体集積回路装置の製造方法

Publications (3)

Publication Number Publication Date
JP2004179677A JP2004179677A (ja) 2004-06-24
JP2004179677A5 true JP2004179677A5 (enExample) 2005-06-16
JP3702963B2 JP3702963B2 (ja) 2005-10-05

Family

ID=32718590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004025535A Expired - Fee Related JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JP3702963B2 (enExample)

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