1272729 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種可應用於指紋感測或是影像感 測之感測器封裝構造，特別係有關於一種無模封膠體（lack of molding compound)之多晶片感測器封裝構造。 【先前技術】 在目前技術中，應用於指紋感測或是影像感測之感測 器封裝構造均是利用一模封膠體（molding compound)局部 包覆感測晶片。但此一局部模封包覆之方式在製程上會產 生因溢膠導致感測晶片之感測區域被覆蓋，使得封裝失 敗。 請參閱第1圖，一種習知指紋感測器封裝構造1 〇〇係 主要包含有一基板110、一感測晶片12 0、複數個銲線13 0 以及一模封膠體140。該感測晶片120係設置於該基板uo 之一上表面111。該感測晶片120係具有一主動面m及 一背面122，利用積體電路製程將指紋感測元件形成於該 主動面121之一感測區124，複數個銲墊123係形成於該 主動面121。藉由該些打線形成之銲線13 0電性連接該些 銲墊123與該基板11〇。該模封膠體14〇係利用壓模技術 形成於該基板110之該上表面111，以密封該些銲線130 並局部包覆該感測晶片1 20，但必須顯露該感測區1 24。 在壓模時上模具係緊密壓貼於該感測晶片12 0之該感測區 124，以防止該模封膠體140之溢膠流入。通常會在該上 模具與該感測晶片120之間插置一脫模片（release film)， 5 1272729 是故此一指紋感測器封裝構造100係具有較差的封裝效率 及較低之良品率。並且，模具凹穴之深度為固定，無法再 額外疊設晶片於基板之上。 【發明内容】 本發明之主要目的係在於提供一種多晶片感測器封 裝構造，主要包含一感測晶片、一半導體裝置以及一軟性 電路板’該感測晶片係設置於該半導體裝置上，其中該半 導體裝置係包含有複數個凸塊，該半導體裝置係藉由該些 凸塊接合至該軟性電路板，且該軟性電路板係往上延伸彎 折至該感測晶片之該主動面，並電性連接至該感測晶片之 該些銲墊，使該軟性電路板具有保護該半導體裝置之側面 與該感測晶片之側面之功效。因此，該多晶片感測器封裝 構造係不需使用習知感測器封裝構造中之模封膠體、銲線 與硬質承載基板。此外，更可具有增加感測器資料儲存之 功效。 本發明之次一目的係在於提供一種多晶片感測器封 裝構造，其另包含有一底部填充膠材，其係形成於一半導 體裝置與一軟性電路板之間，且該底部填充膠材係更形成 在一感測晶片之複數個側面與該軟性電路板之間，以增進 對該感測晶片之保護。 本發明之再一目的係在於提供一種多晶片感測器封 裝構造，其另包含有一異方性導電膠膜（Antis〇⑽ Conductive Film，ACF)，其係形成於一軟性電路板之一第 一表面，且一感測晶片之複數個銲墊上係接合有複數個凸 1272729 / 9由忒異方性導電膠膜與該些凸塊，以電性連接該感 測晶片與該教性電路板。 心 一康本發明，一種多晶片感測器封裝構造係主要包含 一 裝置一感測晶片以及一軟性電路板。該半導體 裝置係包含有至少一晶片並具有複數個凸塊，例如覆晶晶 片/农袼_列封裝構造、或晶片尺寸封裝構造。該感測晶 片係具有一主動面以及一背面，該主動面係形成有一感測 區與複數個銲墊’該背面係貼附於該半導體裝置上，以構 成一疊晶結構。該軟性電路板係具有一第一表面。其中， 該些凸塊係接合至該教性電路板之該第一表面，且該軟性 電路板係往上延伸彎折至該感測晶片之該主動面，並電性 連接至該些銲墊。 【實施方式】 請參閱第2圖，在本發明之一具體實施例中，一種多 晶片感測器封裝構造200係主要包含一半導體裝置21〇、 一感測晶片220以及一軟性電路板23〇。該半導體装置21〇 係可為一覆晶晶片、球格陣列封裝構造、或晶片尺寸封裝 構造’其包含有至少一可為記憶體晶片之晶片21 i並具有 複數個凸塊213。在本實施例中，該半導體裝置21 〇係為 一晶片尺寸封裝構造，該半導體裝置210係更可包含有一 基板212，其中該基板212係用以承載該晶片211，並且 該基板212與該晶片211尺寸相近，該些凸塊213係可為 錫錯凸塊或是無錯凸塊（例如鍚銀銅）。 該感測晶片220係具有二主動面221、一背面222以 1272729 及複數個在該主動面221與該背面222間之侧面223。該 主動面221係形成有一感測區224與複數個銲墊225，可 藉由黏晶材料將該背面222貼附於該半導體裝置21 0上， 以使該半導體裝置210與該感測晶片22〇構成一疊晶結構 (chip stack)。該感測晶片220係可為一指紋感測晶片或是 一影像感測晶片。在本實施例中，該感測晶片220係為觸 滑式（swipe type)指紋感測晶片。 φ 該軟性電路板230係具有一第一表面231以及一第二 表面232，其係具有可電性傳遞該感測晶片22〇與該半導 體裝置2 10之線路結構。由該丰導體裝置2 1 〇與該感測晶 片220所構成之該疊晶結構係經由該半導體裝置21〇之該 些凸塊213接合至該軟性電路板23〇之該第一表面23 i， 並且’該軟性電路板230係往上延伸彎折至該感測晶片220 之该主動面221，並且電性連接至該些銲塾225。在本實 施例中，該感測晶片220之該些銲墊225上係接合有複數 鲁 個凸塊226，例如金凸塊、銅凸塊或鋁凸塊等等，該軟性 電路板230之該第一表面231形成有一異方性導電膠膜 240(AntiS〇tr〇pic Conductive Film，ACF)，藉由該異方性導 電膠膜240與該些凸塊226以電性連接該感測晶片22〇與 該軟性電路板230。 因此’本發明之多晶片感測器封裝構造2〇0係利用該 半導體裝置210承載該感測晶片22〇,並利用往上延伸並 彎折之該軟性電路板230包覆該半導體裝置210之侧面與 該感測晶片220之該些侧面223並電性連接至該感測晶片 1272729 220，且該軟性電路板23〇係暴露出該感測區224，故能同 時置換習知感測器封裝構造中之模封膠體、銲線與基板， 並且可使該多晶片感測器封裝構造2〇〇具有資料儲存之功 效01272729 IX. Description of the Invention: [Technical Field] The present invention relates to a sensor package structure that can be applied to fingerprint sensing or image sensing, and more particularly to a dieless molding (lack of molding) Compound) multi-chip sensor package construction. [Prior Art] In the prior art, the sensor package structure applied to fingerprint sensing or image sensing is to partially cover the sensing wafer by using a molding compound. However, this partial overmolding method causes a sensing area of the sensing wafer to be covered due to the overflow of the glue, so that the package fails. Referring to FIG. 1 , a conventional fingerprint sensor package structure 1 includes a substrate 110 , a sensing wafer 120 , a plurality of bonding wires 130 , and a molding compound 140 . The sensing wafer 120 is disposed on an upper surface 111 of the substrate uo. The sensing chip 120 has an active surface m and a back surface 122. The fingerprint sensing component is formed on one of the sensing regions 124 of the active surface 121 by an integrated circuit process, and a plurality of solder pads 123 are formed on the active surface. 121. The pads 123 and the substrate 11 are electrically connected by the bonding wires 130 formed by the wires. The molding compound 14 is formed on the upper surface 111 of the substrate 110 by a stamper technique to seal the bonding wires 130 and partially cover the sensing wafer 120, but the sensing region 124 must be exposed. The upper mold is tightly pressed against the sensing region 124 of the sensing wafer 120 during the molding to prevent the overflow of the molding compound 140. A release film is usually interposed between the upper mold and the sensing wafer 120, so that the fingerprint sensor package structure 100 has poor packaging efficiency and a low yield. Moreover, the depth of the mold pocket is fixed, and it is no longer possible to additionally stack the wafer on the substrate. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a multi-chip sensor package structure, which mainly includes a sensing chip, a semiconductor device, and a flexible circuit board. The sensing chip system is disposed on the semiconductor device. The semiconductor device includes a plurality of bumps, the semiconductor device is bonded to the flexible circuit board by the bumps, and the flexible circuit board is extended upwardly and bent to the active surface of the sensing chip, and The pads are electrically connected to the sensing chip, so that the flexible circuit board has the function of protecting the side of the semiconductor device and the side of the sensing chip. Thus, the multi-chip sensor package construction eliminates the need to use molding cavities, bond wires, and rigid carrier substrates in conventional sensor package configurations. In addition, it can increase the efficiency of sensor data storage. A second object of the present invention is to provide a multi-chip sensor package structure, further comprising an underfill material formed between a semiconductor device and a flexible circuit board, and the underfill material is further Formed between a plurality of sides of a sensing wafer and the flexible circuit board to enhance protection of the sensing wafer. A further object of the present invention is to provide a multi-chip sensor package structure, which further comprises an anisotropic conductive film (ACF), which is formed on one of the first flexible circuit boards. The surface of the plurality of pads of the sensing chip is bonded with a plurality of protrusions 1272729 / 9 by an anisotropic conductive film and the bumps to electrically connect the sensing chip and the teaching circuit board. According to the invention, a multi-chip sensor package structure mainly comprises a device-sensing chip and a flexible circuit board. The semiconductor device includes at least one wafer and has a plurality of bumps, such as a flip chip/Nano-column package structure, or a wafer size package configuration. The sensing wafer has an active surface and a back surface, and the active surface is formed with a sensing region and a plurality of pads attached to the semiconductor device to form a stacked structure. The flexible circuit board has a first surface. The bumps are bonded to the first surface of the teaching circuit board, and the flexible circuit board is extended upwardly to the active surface of the sensing chip, and is electrically connected to the pads. . [Embodiment] Referring to FIG. 2, in a specific embodiment of the present invention, a multi-chip sensor package structure 200 mainly includes a semiconductor device 21, a sensing wafer 220, and a flexible circuit board. . The semiconductor device 21 can be a flip chip, a ball grid array package structure, or a wafer size package structure. The wafer device 21 includes at least one wafer 21 i which can be a memory chip and has a plurality of bumps 213. In this embodiment, the semiconductor device 21 is a wafer-sized package structure, and the semiconductor device 210 further includes a substrate 212, wherein the substrate 212 is used to carry the wafer 211, and the substrate 212 and the wafer are The 211s are similar in size, and the bumps 213 can be tin bumps or error-free bumps (for example, silver and copper). The sensing wafer 220 has two active surfaces 221, a back surface 222 to 1272729, and a plurality of side surfaces 223 between the active surface 221 and the back surface 222. The active surface 221 is formed with a sensing region 224 and a plurality of pads 225. The back surface 222 can be attached to the semiconductor device 210 by a die bonding material, so that the semiconductor device 210 and the sensing wafer 22 are 〇 constitutes a chip stack. The sensing chip 220 can be a fingerprint sensing chip or an image sensing wafer. In this embodiment, the sensing wafer 220 is a swipe type fingerprint sensing wafer. φ The flexible circuit board 230 has a first surface 231 and a second surface 232, and has a line structure for electrically transmitting the sensing wafer 22 and the semiconductor device 20. The stacked structure formed by the conductive device 2 1 〇 and the sensing wafer 220 is bonded to the first surface 23 i of the flexible circuit board 23 via the bumps 213 of the semiconductor device 21, And the flexible circuit board 230 is bent upward to the active surface 221 of the sensing wafer 220 and electrically connected to the solder pads 225. In the embodiment, the pads 225 of the sensing wafer 220 are bonded with a plurality of bumps 226, such as gold bumps, copper bumps or aluminum bumps, etc., and the flexible circuit board 230 The first surface 231 is formed with an anisotropic conductive film 240 (ACF). The anisotropic conductive film 240 and the bumps 226 are electrically connected to the sensing wafer 22 . 〇 with the flexible circuit board 230. Therefore, the multi-chip sensor package structure of the present invention carries the sensing wafer 22 by using the semiconductor device 210, and covers the semiconductor device 210 with the flexible circuit board 230 extending upward and bent. The side surfaces 223 of the sensing chip 220 are electrically connected to the sensing wafer 1272729 220, and the flexible circuit board 23 exposes the sensing region 224, so that the conventional sensor package can be replaced at the same time. The mold encapsulant, the bonding wire and the substrate in the construction, and the multi-chip sensor package structure 2 can have the function of data storage.
此外，該多晶片感測器封裝構造200係可另包含有一 底部填充膠材250，其係形成於該半導體裝置21〇與該軟 性電路板230之間。較佳地，該底部填充膠材25〇係更可 形成在該感測晶片220之該些侧面223與該軟性電路板 230之間’以增進該軟性電路板咖之包覆保護能力。該 多晶片感測器封裝構造200係可另包含有複數個銲球 260,其係設置於該軟性電路板23〇之該第二表面232，以 供對外電性接合。 關於該多晶片感測器封裝構造2〇〇之一種具體製造過 程可參閱第3A至3D圖。首先，請參閱第3入圖，其係提 供該具有該些凸塊2U之半導體裝置21〇，再將該感測晶 片220之該月面222以黏晶材料貼附於該半導體裝置2 w 上，以構成一疊晶結構，該感測晶片22〇之該感測區224 係朝上，而該感測晶片220之該些銲墊225係可預先接合 有該些凸塊226。接著，請參閱第3B圖，其係以回銲或熱 壓合等技術使將該半導體裝置21G與該感測晶片22〇所構 成之疊晶結構藉由該半導體裝置21〇之該些凸塊213接合 至該軟性電路板230之該第一表面231。而該軟性以 230之該第一表面231之側邊則可貼附有該異方性導$ 膜240。之後，請參閱第3C圖，其係形成該底部填充用 1272729In addition, the multi-chip sensor package structure 200 can further include an underfill material 250 formed between the semiconductor device 21 and the flexible circuit board 230. Preferably, the underfill material 25 is formed between the side surfaces 223 of the sensing wafer 220 and the flexible circuit board 230 to enhance the coating protection capability of the flexible circuit board. The multi-chip sensor package structure 200 can further include a plurality of solder balls 260 disposed on the second surface 232 of the flexible circuit board 23 for external electrical bonding. A specific manufacturing process for the multi-chip sensor package construction 2 can be found in Figures 3A through 3D. First, referring to the third drawing, the semiconductor device 21 having the bumps 2U is provided, and the moon surface 222 of the sensing wafer 220 is attached to the semiconductor device 2w by a die bonding material. To form a stacked structure, the sensing region 224 of the sensing wafer 22 is facing upward, and the pads 225 of the sensing wafer 220 are pre-bonded with the bumps 226. Next, referring to FIG. 3B, the stacked structure formed by the semiconductor device 21G and the sensing wafer 22 is soldered by the semiconductor device 21 by a technique such as reflow soldering or thermocompression bonding. 213 is bonded to the first surface 231 of the flexible circuit board 230. The side of the first surface 231 of the softness 230 may be attached to the anisotropic film 240. After that, please refer to Figure 3C, which forms the underfill 1272729
250於該半導體裝置210與該軟性電路板230之間，且該 卓人（·生電路板230係往上延伸彎折至該感測晶片220之該主 動面221。接著，請參閱第3D圖，藉由熱壓合該軟性電 路板230以及烘烤該異方性導電膠膜24〇，該軟性電路板 230係能藉由該異方性導電膠膜鳩與該些凸塊226而電 性連接至該感測晶片220之該些銲墊225，以使該半導體 裝置210與該感測晶片22〇電性連接。最後，如第2圖所 示，設置該些銲球260於該軟性電路板23〇之該第二表面 232，以形成該多晶片感測器封裝構造2〇〇。 本發明之保護制當視後附之中請專利範圍所界定 料準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修柃 1A ^ L ^ 』文化興修改，均屬於本發明之保護範 圍。 【圖式簡單說明】 、 圖.習知指紋感測器封I構造之截面示意圖。 圖：依據本發明之-具體實施例，一種多晶片 感測器封裝構造之截面示意圖。 第 1 第 2 第3A至3D圖：依據本發明之—具體實施例，該多晶^ ㈣器封裝構造在製程中之載面。 【主要元件符號說明】 1 〇 〇指紋感測器封裝構造 110基板 U1上表面 122背面 120感測晶片 m主動面 123銲墊 124感測區 1272729 130 銲線 140 模 封 膠 體 200 多晶 片 感 測器 封裝構造 210 半導 體 裝 置 211 記 憶 體 晶片 212 基板 213 凸塊 220 感測 晶 片 221 主 動 面 222 背面 223 側面 224 感 測 區 225 銲墊 226 凸塊 230 軟性 電 路板 231 第 _|一 表 面 232 第二表面 240 異方 性 導 電膠 膜 250底部填充膠材 260銲球 11250 between the semiconductor device 210 and the flexible circuit board 230, and the sturdy circuit board 230 is extended upward to the active surface 221 of the sensing wafer 220. Next, please refer to the 3D The flexible circuit board 230 can be electrically connected by the anisotropic conductive film and the bumps 226 by thermally pressing the flexible circuit board 230 and baking the anisotropic conductive film 24A. The solder pads 225 are connected to the sensing pads 220 to electrically connect the semiconductor device 210 to the sensing wafers 22. Finally, as shown in FIG. 2, the solder balls 260 are disposed on the flexible circuit. The second surface 232 of the board 23 is formed to form the multi-chip sensor package structure 2〇〇. The protection system of the present invention is defined by the scope of the patent application, and any person skilled in the art, Any changes and modifications made without departing from the spirit and scope of the present invention are within the scope of protection of the present invention. [Simplified Schematic Description], Fig. Conventional Fingerprint Sensor Seal Schematic cross-sectional view of the I configuration. Figure: In accordance with the present invention, A cross-sectional view of a multi-wafer sensor package construction. 1st, 2nd, 3rd, and 3Dth views: According to the embodiment of the present invention, the polycrystalline (4-) package is constructed to carry the surface in the process. Description 1 〇〇 Fingerprint sensor package structure 110 Substrate U1 Upper surface 122 Back surface 120 Sensing wafer m Active surface 123 Pad 124 Sensing area 1272729 130 Wire bonding 140 Molding paste 200 Multi-chip sensor package structure 210 Semiconductor Device 211 Memory Chip 212 Substrate 213 Bump 220 Sensing Wafer 221 Active Surface 222 Back Side 223 Side 224 Sensing Area 225 Pad 226 Bump 230 Flexible Circuit Board 231 _|One Surface 232 Second Surface 240 Anisotropic Conduction Film 250 is filled with glue 260 solder ball 11