JP3702963B2 - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法 Download PDF

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Publication number
JP3702963B2
JP3702963B2 JP2004025535A JP2004025535A JP3702963B2 JP 3702963 B2 JP3702963 B2 JP 3702963B2 JP 2004025535 A JP2004025535 A JP 2004025535A JP 2004025535 A JP2004025535 A JP 2004025535A JP 3702963 B2 JP3702963 B2 JP 3702963B2
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Japan
Prior art keywords
inner lead
bonding
bonding tool
electrode pad
chip
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Expired - Fee Related
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JP2004025535A
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Japanese (ja)
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JP2004179677A5 (enExample
JP2004179677A (ja
Inventor
達行 大久保
啓祐 灘本
善文 片山
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Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2004025535A priority Critical patent/JP3702963B2/ja
Publication of JP2004179677A publication Critical patent/JP2004179677A/ja
Publication of JP2004179677A5 publication Critical patent/JP2004179677A5/ja
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    • H10W72/701—
    • H10W74/00—

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  • Wire Bonding (AREA)
JP2004025535A 1997-01-07 2004-02-02 半導体集積回路装置の製造方法 Expired - Fee Related JP3702963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004025535A JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1206697 1997-01-07
JP1739597 1997-01-14
JP2004025535A JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP27393997A Division JP3534583B2 (ja) 1997-01-07 1997-09-19 半導体集積回路装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005142458A Division JP4004513B2 (ja) 1997-01-07 2005-05-16 半導体集積回路装置の製造方法

Publications (3)

Publication Number Publication Date
JP2004179677A JP2004179677A (ja) 2004-06-24
JP2004179677A5 JP2004179677A5 (enExample) 2005-06-16
JP3702963B2 true JP3702963B2 (ja) 2005-10-05

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ID=32718590

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Application Number Title Priority Date Filing Date
JP2004025535A Expired - Fee Related JP3702963B2 (ja) 1997-01-07 2004-02-02 半導体集積回路装置の製造方法

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JP (1) JP3702963B2 (enExample)

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Publication number Publication date
JP2004179677A (ja) 2004-06-24

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