JP3892906B2 - 透明な構造における三次元の欠陥位置を検出するための技術 - Google Patents

透明な構造における三次元の欠陥位置を検出するための技術 Download PDF

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JP3892906B2
JP3892906B2 JP51444197A JP51444197A JP3892906B2 JP 3892906 B2 JP3892906 B2 JP 3892906B2 JP 51444197 A JP51444197 A JP 51444197A JP 51444197 A JP51444197 A JP 51444197A JP 3892906 B2 JP3892906 B2 JP 3892906B2
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plate
planar medium
defocus
light
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JP2001519890A (ja
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ヘンリイ，フランソア・ジェイ
ブライアン，マイケル・エイ
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フォトン・ダイナミクス・インコーポレーテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
JP51444197A 1995-10-06 1996-10-04 透明な構造における三次元の欠陥位置を検出するための技術 Expired - Lifetime JP3892906B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US505895P 1995-10-06 1995-10-06
US60/005,058 1995-10-06
US08/721,332 1996-09-26
US08/721,332 US5790247A (en) 1995-10-06 1996-09-26 Technique for determining defect positions in three dimensions in a transparent structure
PCT/US1996/015907 WO1997013140A1 (en) 1995-10-06 1996-10-04 Technique for determining defect positions in three dimensions in a transparent structure

Publications (3)

Publication Number Publication Date
JP2001519890A JP2001519890A (ja) 2001-10-23
JP2001519890A5 JP2001519890A5 (https=) 2004-09-16
JP3892906B2 true JP3892906B2 (ja) 2007-03-14

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JP51444197A Expired - Lifetime JP3892906B2 (ja) 1995-10-06 1996-10-04 透明な構造における三次元の欠陥位置を検出するための技術

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US (1) US5790247A (https=)
JP (1) JP3892906B2 (https=)
KR (1) KR19990064058A (https=)
WO (1) WO1997013140A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017538117A (ja) * 2014-12-05 2017-12-21 ケーエルエー−テンカー コーポレイション ワークピース欠陥検出用の装置、方法及びコンピュータプログラム製品

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392683B1 (en) * 1997-09-26 2002-05-21 Sumitomo Heavy Industries, Ltd. Method for making marks in a transparent material by using a laser
US6297879B1 (en) * 1998-02-27 2001-10-02 Micron Technology, Inc. Inspection method and apparatus for detecting defects on photomasks
DE19929118C2 (de) * 1999-06-25 2001-05-10 Basler Ag Verfahren zum optischen Prüfen der Zwischenschicht eines wenigstens dreischichtigen flächigen Gegenstandes
JP2001118766A (ja) * 1999-10-15 2001-04-27 Canon Inc Ｘ線マスク及びそれを用いたデバイスの製造方法
US6862142B2 (en) * 2000-03-10 2005-03-01 Kla-Tencor Technologies Corporation Multi-detector microscopic inspection system
US6404489B1 (en) * 2000-03-29 2002-06-11 Corning Incorporated Inclusion detection
WO2002018980A2 (en) * 2000-09-01 2002-03-07 Applied Process Technologies Optical system for imaging distortions in moving reflective sheets
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6946394B2 (en) * 2000-09-20 2005-09-20 Kla-Tencor Technologies Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6965685B1 (en) * 2001-09-04 2005-11-15 Hewlett-Packard Development Company, Lp. Biometric sensor
US6657714B2 (en) * 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
TWI264532B (en) * 2001-11-05 2006-10-21 Olympus Corp Substrate inspection device
US7105848B2 (en) * 2002-04-15 2006-09-12 Wintriss Engineering Corporation Dual level out-of-focus light source for amplification of defects on a surface
JP2004150971A (ja) * 2002-10-31 2004-05-27 Nitto Denko Corp フィルムの検査方法および検査装置
US20040196454A1 (en) * 2003-04-03 2004-10-07 Takayuki Ishiguro Optical system, detector and method for detecting peripheral surface defect of translucent disk
DE10316707B4 (de) * 2003-04-04 2006-04-27 Schott Ag Verfahren und Vorrichtung zur Erkennung von Fehlern in transparentem Material
IES20030443A2 (en) * 2003-06-16 2004-12-01 Fraudhalt Ltd A method and apparatus for determining if an optical disk originated from a valid source
KR100541449B1 (ko) * 2003-07-23 2006-01-11 삼성전자주식회사 패널검사장치
US7511807B2 (en) * 2003-12-30 2009-03-31 Agency For Science, Technology And Research Method and apparatus for detection of inclusion in glass
JP2005308725A (ja) * 2004-03-26 2005-11-04 Sumitomo Osaka Cement Co Ltd 透明板欠陥検査装置
WO2005116617A1 (en) * 2004-05-21 2005-12-08 Corning Incorporated Apparatus and process for detecting inclusions
GB2415776B (en) * 2004-06-28 2009-01-28 Carglass Luxembourg Sarl Zug Investigation of vehicle glazing panels
JP4480009B2 (ja) * 2004-12-06 2010-06-16 Ｈｏｙａ株式会社 欠陥検査装置及び方法、並びにフォトマスクの製造方法
DK1947617T3 (en) * 2005-01-25 2016-11-28 Tomra Systems Asa Polet system for installation in return slot
JP4688150B2 (ja) * 2005-08-03 2011-05-25 Ｈｏｙａ株式会社 マスクブランク用ガラス基板の製造方法、マスクブランクの製造方法、露光用マスクの製造方法、及び欠陥検査装置
WO2010058759A1 (ja) * 2008-11-20 2010-05-27 旭硝子株式会社 透明体検査装置
CN102023164B (zh) * 2009-09-23 2015-09-16 法国圣-戈班玻璃公司 用于检测透明平板的局部缺陷的装置和方法
US9035673B2 (en) 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
US8875562B2 (en) 2010-02-17 2014-11-04 Dow Global Technologies Llc Filter and membrane defect detection system
BR112013004675A2 (pt) 2010-10-01 2016-07-26 Dow Global Technologies Llc sistema para determinar se um substrato tem um tamanho de poro ou uniformidade aceitavel,método e método para identificar se os poros de um substrato estão fora de uma faixa definida ou acima ou abaixo de um tamanho definido
US8866899B2 (en) * 2011-06-07 2014-10-21 Photon Dynamics Inc. Systems and methods for defect detection using a whole raw image
ES2717882T3 (es) * 2011-06-24 2019-06-26 Tomra Systems Asa Máquina de retorno de envases y método de detección de suciedad en una máquina de retorno de envases
DE102011111545B3 (de) * 2011-08-24 2012-10-18 Carl Zeiss Ag Anordnung zur Inspektion von transparenten Proben
WO2014055962A1 (en) * 2012-10-05 2014-04-10 Seagate Technology Llc Imaging a transparent article
US9207190B2 (en) * 2013-04-10 2015-12-08 Technology Assessment & Transfer, Inc. Method for nondestructive testing of optical discontinuities in monolithic transparent polycrystalline ceramic articles
DE102014005932A1 (de) * 2014-04-25 2015-10-29 Boraident Gmbh Verfahren und Vorrichtung zur Selektion und Detektion von Nickelsulfid-Einschlüssen in Glas
KR102200691B1 (ko) * 2014-06-02 2021-01-13 삼성디스플레이 주식회사 검사장치
CN106248684B (zh) 2015-06-03 2019-12-17 法国圣戈班玻璃公司 用于检测透明基底的内部瑕疵的光学装置及方法
CN105259181A (zh) * 2015-10-26 2016-01-20 华为技术有限公司 显示屏的显示缺陷检测方法、装置及设备
CN105866129A (zh) * 2016-05-16 2016-08-17 天津工业大学 一种基于数字投影的产品表面质量在线检测方法
DE102016112159A1 (de) * 2016-07-04 2018-01-04 Krones Aktiengesellschaft Vorrichtung und Verfahren zum Inspizieren von Objekten mit Schutzglas
WO2019157271A2 (en) * 2018-02-09 2019-08-15 Massachusetts Institute Of Technology Systems and methods for crack detection
CN114166864B (zh) * 2021-12-08 2024-11-12 成都南方电子仪表有限公司 一种透明屏幕缺陷的定位检测系统和定位检测方法
WO2024218763A1 (en) * 2023-04-19 2024-10-24 Lumus Ltd. Systems and methods for testing optical plates
CN116156328B (zh) * 2023-04-23 2023-07-04 湖南省迈德威视科技有限公司 一种应用于产品缺陷检测的工业相机

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3985454A (en) * 1975-03-14 1976-10-12 Nasa Window defect planar mapping technique
JPS5444587A (en) * 1977-09-14 1979-04-09 Nec Corp Flaw inspecting system of transparent objects
US4456374A (en) * 1981-12-11 1984-06-26 Johnson & Johnson Detecting the presence or absence of a coating on a substrate
US4808813A (en) * 1986-05-05 1989-02-28 Hughes Aircraft Company Self contained surface contamination sensor for detecting external particulates and surface discontinuities
JPH0760136B2 (ja) * 1990-05-01 1995-06-28 三井金属鉱業株式会社 内部欠陥検査方法および装置
JPH0776757B2 (ja) * 1990-12-14 1995-08-16 インターナショナル・ビジネス・マシーンズ・コーポレイション 光学的検査装置
JP2948353B2 (ja) * 1991-04-19 1999-09-13 日立電子エンジニアリング株式会社 ガラス板の表面欠陥検査方法および検査装置
US5177559A (en) * 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
JPH0518900A (ja) * 1991-07-12 1993-01-26 Ricoh Co Ltd レンズ欠陥検査方法及び検査装置
US5196901A (en) * 1991-08-22 1993-03-23 Eos Technologies, Inc. Discriminating surface contamination monitor
IL100443A (en) * 1991-12-20 1995-03-30 Dotan Gideon Inspection system for detecting surface flaws
JPH06294749A (ja) * 1993-04-09 1994-10-21 Nippon Electric Glass Co Ltd 板ガラスの欠点検査方法
US5631733A (en) * 1995-01-20 1997-05-20 Photon Dynamics, Inc. Large area defect monitor tool for manufacture of clean surfaces
US5515159A (en) * 1995-02-10 1996-05-07 Westinghouse Electric Corporation Package seal inspection system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017538117A (ja) * 2014-12-05 2017-12-21 ケーエルエー−テンカー コーポレイション ワークピース欠陥検出用の装置、方法及びコンピュータプログラム製品
JP2021175987A (ja) * 2014-12-05 2021-11-04 ケーエルエー コーポレイション 個片化半導体デバイスの欠陥検出装置
JP2021182005A (ja) * 2014-12-05 2021-11-25 ケーエルエー コーポレイション ワークピースの欠陥検出装置及び方法
US11726126B2 (en) 2014-12-05 2023-08-15 Kla Corporation Apparatus, method and computer program product for defect detection in work pieces
JP7373527B2 (ja) 2014-12-05 2023-11-02 ケーエルエー コーポレイション ワークピースの欠陥検出装置及び方法
US11892493B2 (en) 2014-12-05 2024-02-06 Kla Corporation Apparatus, method and computer program product for defect detection in work pieces
JP2024026780A (ja) * 2014-12-05 2024-02-28 ケーエルエー コーポレイション 個片化半導体デバイスの欠陥検出装置
JP7755668B2 (ja) 2014-12-05 2025-10-16 ケーエルエー コーポレイション 個片化半導体デバイスの欠陥検出装置

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US5790247A (en) 1998-08-04
KR19990064058A (ko) 1999-07-26
JP2001519890A (ja) 2001-10-23
WO1997013140A1 (en) 1997-04-10

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