JP3889868B2 - ウェーハボート管理システム - Google Patents
ウェーハボート管理システム Download PDFInfo
- Publication number
- JP3889868B2 JP3889868B2 JP28632797A JP28632797A JP3889868B2 JP 3889868 B2 JP3889868 B2 JP 3889868B2 JP 28632797 A JP28632797 A JP 28632797A JP 28632797 A JP28632797 A JP 28632797A JP 3889868 B2 JP3889868 B2 JP 3889868B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- slot
- boat
- cassette
- wafer boat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28632797A JP3889868B2 (ja) | 1997-10-20 | 1997-10-20 | ウェーハボート管理システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28632797A JP3889868B2 (ja) | 1997-10-20 | 1997-10-20 | ウェーハボート管理システム |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006289608A Division JP4762111B2 (ja) | 2006-10-25 | 2006-10-25 | 半導体製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11121586A JPH11121586A (ja) | 1999-04-30 |
| JPH11121586A5 JPH11121586A5 (enExample) | 2005-06-16 |
| JP3889868B2 true JP3889868B2 (ja) | 2007-03-07 |
Family
ID=17702961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28632797A Expired - Lifetime JP3889868B2 (ja) | 1997-10-20 | 1997-10-20 | ウェーハボート管理システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3889868B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007108470A1 (ja) * | 2006-03-23 | 2007-09-27 | Hitachi Kokusai Electric Inc. | 基板処理装置システム |
| JP4503088B2 (ja) * | 2007-11-05 | 2010-07-14 | 株式会社日立国際電気 | 基板処理装置及び基板処理装置の表示方法 |
| JP5193244B2 (ja) * | 2008-03-14 | 2013-05-08 | 株式会社日立国際電気 | 基板処理装置、基板処理装置の表示方法、及び半導体装置の製造方法 |
| JP4486692B2 (ja) | 2008-03-14 | 2010-06-23 | 株式会社日立国際電気 | 基板処理装置 |
| JP5420850B2 (ja) * | 2008-03-25 | 2014-02-19 | 株式会社日立国際電気 | 基板処理装置、基板処理システムおよび半導体装置の製造方法 |
| JP5897531B2 (ja) * | 2013-10-24 | 2016-03-30 | 株式会社日立国際電気 | 基板処理装置、基板処理システム、半導体装置の製造方法及び基板移載方法 |
| PL3601511T3 (pl) * | 2017-03-30 | 2021-06-14 | Dow Global Technologies Llc | Układ środków dyspergujących dla preparatów do automatycznego mycia naczyń |
| EP4220691A4 (en) * | 2020-09-25 | 2025-01-15 | Kokusai Electric Corporation | METHOD FOR DISPLAYING SUBSTRATE POSITIONING DATA, METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, SUBSTRATE PROCESSING APPARATUS AND PROGRAM |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04157753A (ja) * | 1990-10-22 | 1992-05-29 | Shinko Electric Co Ltd | 表面処理装置 |
| JP3914273B2 (ja) * | 1995-01-09 | 2007-05-16 | 株式会社日立国際電気 | 半導体製造装置及びそれにおける表示方法 |
| JP3973238B2 (ja) * | 1995-01-11 | 2007-09-12 | 株式会社日立国際電気 | 半導体製造装置における表示方法 |
| JP3364390B2 (ja) * | 1995-12-30 | 2003-01-08 | 東京エレクトロン株式会社 | 検査装置 |
-
1997
- 1997-10-20 JP JP28632797A patent/JP3889868B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11121586A (ja) | 1999-04-30 |
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