JPH11121586A5 - - Google Patents

Info

Publication number
JPH11121586A5
JPH11121586A5 JP1997286327A JP28632797A JPH11121586A5 JP H11121586 A5 JPH11121586 A5 JP H11121586A5 JP 1997286327 A JP1997286327 A JP 1997286327A JP 28632797 A JP28632797 A JP 28632797A JP H11121586 A5 JPH11121586 A5 JP H11121586A5
Authority
JP
Japan
Prior art keywords
wafers
boat
cassette
wafer
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997286327A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11121586A (ja
JP3889868B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP28632797A priority Critical patent/JP3889868B2/ja
Priority claimed from JP28632797A external-priority patent/JP3889868B2/ja
Publication of JPH11121586A publication Critical patent/JPH11121586A/ja
Publication of JPH11121586A5 publication Critical patent/JPH11121586A5/ja
Application granted granted Critical
Publication of JP3889868B2 publication Critical patent/JP3889868B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP28632797A 1997-10-20 1997-10-20 ウェーハボート管理システム Expired - Lifetime JP3889868B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28632797A JP3889868B2 (ja) 1997-10-20 1997-10-20 ウェーハボート管理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28632797A JP3889868B2 (ja) 1997-10-20 1997-10-20 ウェーハボート管理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006289608A Division JP4762111B2 (ja) 2006-10-25 2006-10-25 半導体製造装置

Publications (3)

Publication Number Publication Date
JPH11121586A JPH11121586A (ja) 1999-04-30
JPH11121586A5 true JPH11121586A5 (enExample) 2005-06-16
JP3889868B2 JP3889868B2 (ja) 2007-03-07

Family

ID=17702961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28632797A Expired - Lifetime JP3889868B2 (ja) 1997-10-20 1997-10-20 ウェーハボート管理システム

Country Status (1)

Country Link
JP (1) JP3889868B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007108470A1 (ja) * 2006-03-23 2007-09-27 Hitachi Kokusai Electric Inc. 基板処理装置システム
JP4503088B2 (ja) * 2007-11-05 2010-07-14 株式会社日立国際電気 基板処理装置及び基板処理装置の表示方法
JP5193244B2 (ja) * 2008-03-14 2013-05-08 株式会社日立国際電気 基板処理装置、基板処理装置の表示方法、及び半導体装置の製造方法
JP4486692B2 (ja) 2008-03-14 2010-06-23 株式会社日立国際電気 基板処理装置
JP5420850B2 (ja) * 2008-03-25 2014-02-19 株式会社日立国際電気 基板処理装置、基板処理システムおよび半導体装置の製造方法
JP5897531B2 (ja) * 2013-10-24 2016-03-30 株式会社日立国際電気 基板処理装置、基板処理システム、半導体装置の製造方法及び基板移載方法
PL3601511T3 (pl) * 2017-03-30 2021-06-14 Dow Global Technologies Llc Układ środków dyspergujących dla preparatów do automatycznego mycia naczyń
EP4220691A4 (en) * 2020-09-25 2025-01-15 Kokusai Electric Corporation METHOD FOR DISPLAYING SUBSTRATE POSITIONING DATA, METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT, SUBSTRATE PROCESSING APPARATUS AND PROGRAM

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04157753A (ja) * 1990-10-22 1992-05-29 Shinko Electric Co Ltd 表面処理装置
JP3914273B2 (ja) * 1995-01-09 2007-05-16 株式会社日立国際電気 半導体製造装置及びそれにおける表示方法
JP3973238B2 (ja) * 1995-01-11 2007-09-12 株式会社日立国際電気 半導体製造装置における表示方法
JP3364390B2 (ja) * 1995-12-30 2003-01-08 東京エレクトロン株式会社 検査装置

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