JP3872776B2 - 半導体製造装置及び半導体製造方法 - Google Patents

半導体製造装置及び半導体製造方法 Download PDF

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Publication number
JP3872776B2
JP3872776B2 JP2003197936A JP2003197936A JP3872776B2 JP 3872776 B2 JP3872776 B2 JP 3872776B2 JP 2003197936 A JP2003197936 A JP 2003197936A JP 2003197936 A JP2003197936 A JP 2003197936A JP 3872776 B2 JP3872776 B2 JP 3872776B2
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Japan
Prior art keywords
flow rate
mass flow
flow controller
unit
output
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Expired - Fee Related
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JP2003197936A
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English (en)
Japanese (ja)
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JP2005038058A (ja
Inventor
庸之 岡部
健吾 金子
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Priority to JP2003197936A priority Critical patent/JP3872776B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to KR1020057007816A priority patent/KR101116979B1/ko
Priority to CNB2004800043393A priority patent/CN100462887C/zh
Priority to EP04747499A priority patent/EP1653312A4/en
Priority to PCT/JP2004/010033 priority patent/WO2005008350A1/ja
Priority to US10/564,558 priority patent/US7510884B2/en
Priority to TW093121383A priority patent/TW200504822A/zh
Publication of JP2005038058A publication Critical patent/JP2005038058A/ja
Application granted granted Critical
Publication of JP3872776B2 publication Critical patent/JP3872776B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/02—Compensating or correcting for variations in pressure, density or temperature
    • G01F15/022—Compensating or correcting for variations in pressure, density or temperature using electrical means
    • G01F15/024—Compensating or correcting for variations in pressure, density or temperature using electrical means involving digital counting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
  • Measuring Volume Flow (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2003197936A 2003-07-16 2003-07-16 半導体製造装置及び半導体製造方法 Expired - Fee Related JP3872776B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2003197936A JP3872776B2 (ja) 2003-07-16 2003-07-16 半導体製造装置及び半導体製造方法
CNB2004800043393A CN100462887C (zh) 2003-07-16 2004-07-14 半导体制造装置和半导体制造方法
EP04747499A EP1653312A4 (en) 2003-07-16 2004-07-14 SEMICONDUCTOR PRODUCTION SYSTEM AND SEMICONDUCTOR PRODUCTION METHOD
PCT/JP2004/010033 WO2005008350A1 (ja) 2003-07-16 2004-07-14 半導体製造装置及び半導体製造方法
KR1020057007816A KR101116979B1 (ko) 2003-07-16 2004-07-14 반도체 제조 장치 및 반도체 제조 방법
US10/564,558 US7510884B2 (en) 2003-07-16 2004-07-14 Semiconductor production system and semiconductor production process
TW093121383A TW200504822A (en) 2003-07-16 2004-07-16 Semiconductor manufacturing device and semiconductor manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003197936A JP3872776B2 (ja) 2003-07-16 2003-07-16 半導体製造装置及び半導体製造方法

Publications (2)

Publication Number Publication Date
JP2005038058A JP2005038058A (ja) 2005-02-10
JP3872776B2 true JP3872776B2 (ja) 2007-01-24

Family

ID=34074361

Family Applications (1)

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JP2003197936A Expired - Fee Related JP3872776B2 (ja) 2003-07-16 2003-07-16 半導体製造装置及び半導体製造方法

Country Status (7)

Country Link
US (1) US7510884B2 (enExample)
EP (1) EP1653312A4 (enExample)
JP (1) JP3872776B2 (enExample)
KR (1) KR101116979B1 (enExample)
CN (1) CN100462887C (enExample)
TW (1) TW200504822A (enExample)
WO (1) WO2005008350A1 (enExample)

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JP4718274B2 (ja) 2005-08-25 2011-07-06 東京エレクトロン株式会社 半導体製造装置，半導体製造装置の流量補正方法，プログラム
JP2007214406A (ja) * 2006-02-10 2007-08-23 Hitachi Metals Ltd 流量検定機能付質量流量制御装置を搭載した半導体製造装置
US7869888B2 (en) * 2006-05-31 2011-01-11 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
JP5134841B2 (ja) * 2007-03-16 2013-01-30 Ｃｋｄ株式会社 ガス供給ユニット
JP2009004479A (ja) * 2007-06-20 2009-01-08 Panasonic Corp 装置状態監視方法および装置状態監視装置
JP5459895B2 (ja) * 2007-10-15 2014-04-02 Ｃｋｄ株式会社 ガス分流供給ユニット
DE102007062977B4 (de) * 2007-12-21 2018-07-19 Schott Ag Verfahren zur Herstellung von Prozessgasen für die Dampfphasenabscheidung
JP2010169657A (ja) * 2008-12-25 2010-08-05 Horiba Stec Co Ltd 質量流量計及びマスフローコントローラ
JP5558871B2 (ja) * 2010-03-15 2014-07-23 株式会社ダイヘン アーク溶接装置
JP2012033150A (ja) * 2010-06-30 2012-02-16 Toshiba Corp マスフローコントローラ、マスフローコントローラシステム、基板処理装置およびガス流量調整方法
JP6047308B2 (ja) * 2012-05-28 2016-12-21 日精エー・エス・ビー機械株式会社 樹脂容器用コーティング装置
AU2014281351B2 (en) * 2013-06-19 2020-03-12 Fontem Holdings 4 B.V. Device and method for sensing mass airflow
JP6216601B2 (ja) * 2013-10-09 2017-10-18 旭有機材株式会社 流量制御装置
JP6246606B2 (ja) * 2014-01-31 2017-12-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR20160012302A (ko) * 2014-07-23 2016-02-03 삼성전자주식회사 기판 제조 방법 및 그에 사용되는 기판 제조 장치
KR102628015B1 (ko) * 2017-12-01 2024-01-23 삼성전자주식회사 질량 유량 제어기, 반도체 소자의 제조장치 및 그의 관리방법
KR102066776B1 (ko) * 2017-12-11 2020-01-15 임용일 통합 분석 제어기에 의한 질량 유량 제어기 최적화 통합 시스템
KR102101068B1 (ko) * 2017-12-11 2020-04-14 조북룡 통합 분석기에 의한 질량 유량 최적화 제어 시스템
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
SG11202110276WA (en) * 2019-03-25 2021-10-28 Kokusai Electric Corp Substrate processing apparatus, method of manufacturing semiconductor device, and program
JP7270489B2 (ja) * 2019-07-10 2023-05-10 東京エレクトロン株式会社 性能算出方法および処理装置
CN113552909A (zh) * 2020-04-26 2021-10-26 长鑫存储技术有限公司 阀控制系统及阀控制方法
CN115454153A (zh) * 2022-10-26 2022-12-09 北京七星华创流量计有限公司 质量流量控制器及其流量控制方法

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JPH07263350A (ja) 1994-03-18 1995-10-13 Fujitsu Ltd 半導体製造方法
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JP2802246B2 (ja) 1995-06-29 1998-09-24 久 高橋 遅れ補償機能付流量制御弁
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JP3684307B2 (ja) 1998-10-19 2005-08-17 シーケーディ株式会社 ガス供給制御装置
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JP2001077267A (ja) * 1999-09-08 2001-03-23 Mitsubishi Electric Corp 半導体製造装置及び半導体装置の製造方法
JP2001197936A (ja) 2000-01-19 2001-07-24 Fuairudo Kk ヘア−スタイリングの改良された方法

Also Published As

Publication number Publication date
US7510884B2 (en) 2009-03-31
WO2005008350A1 (ja) 2005-01-27
TW200504822A (en) 2005-02-01
US20060172442A1 (en) 2006-08-03
EP1653312A1 (en) 2006-05-03
JP2005038058A (ja) 2005-02-10
EP1653312A4 (en) 2009-05-27
CN1751280A (zh) 2006-03-22
TWI305372B (enExample) 2009-01-11
CN100462887C (zh) 2009-02-18
KR101116979B1 (ko) 2012-03-15
KR20060035575A (ko) 2006-04-26

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