TW200504822A - Semiconductor manufacturing device and semiconductor manufacturing method - Google Patents

Semiconductor manufacturing device and semiconductor manufacturing method

Info

Publication number
TW200504822A
TW200504822A TW093121383A TW93121383A TW200504822A TW 200504822 A TW200504822 A TW 200504822A TW 093121383 A TW093121383 A TW 093121383A TW 93121383 A TW93121383 A TW 93121383A TW 200504822 A TW200504822 A TW 200504822A
Authority
TW
Taiwan
Prior art keywords
fluid
cut
voltage
valve
setup
Prior art date
Application number
TW093121383A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305372B (enExample
Inventor
Tsuneyuki Okabe
Kengo Kaneko
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200504822A publication Critical patent/TW200504822A/zh
Application granted granted Critical
Publication of TWI305372B publication Critical patent/TWI305372B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/02—Compensating or correcting for variations in pressure, density or temperature
    • G01F15/022—Compensating or correcting for variations in pressure, density or temperature using electrical means
    • G01F15/024—Compensating or correcting for variations in pressure, density or temperature using electrical means involving digital counting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Flow Control (AREA)
  • Measuring Volume Flow (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW093121383A 2003-07-16 2004-07-16 Semiconductor manufacturing device and semiconductor manufacturing method TW200504822A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003197936A JP3872776B2 (ja) 2003-07-16 2003-07-16 半導体製造装置及び半導体製造方法

Publications (2)

Publication Number Publication Date
TW200504822A true TW200504822A (en) 2005-02-01
TWI305372B TWI305372B (enExample) 2009-01-11

Family

ID=34074361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121383A TW200504822A (en) 2003-07-16 2004-07-16 Semiconductor manufacturing device and semiconductor manufacturing method

Country Status (7)

Country Link
US (1) US7510884B2 (enExample)
EP (1) EP1653312A4 (enExample)
JP (1) JP3872776B2 (enExample)
KR (1) KR101116979B1 (enExample)
CN (1) CN100462887C (enExample)
TW (1) TW200504822A (enExample)
WO (1) WO2005008350A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404115B (zh) * 2005-08-25 2013-08-01 Tokyo Electron Ltd Semiconductor manufacturing apparatus, flow correction method for semiconductor manufacturing apparatus, program
TWI476377B (zh) * 2008-12-25 2015-03-11 Horiba Stec Co 質量流量計及質量流量控制器

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* Cited by examiner, † Cited by third party
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JP2007214406A (ja) * 2006-02-10 2007-08-23 Hitachi Metals Ltd 流量検定機能付質量流量制御装置を搭載した半導体製造装置
US7869888B2 (en) * 2006-05-31 2011-01-11 Tokyo Electron Limited Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
JP5134841B2 (ja) * 2007-03-16 2013-01-30 Ｃｋｄ株式会社 ガス供給ユニット
JP2009004479A (ja) * 2007-06-20 2009-01-08 Panasonic Corp 装置状態監視方法および装置状態監視装置
JP5459895B2 (ja) * 2007-10-15 2014-04-02 Ｃｋｄ株式会社 ガス分流供給ユニット
DE102007062977B4 (de) * 2007-12-21 2018-07-19 Schott Ag Verfahren zur Herstellung von Prozessgasen für die Dampfphasenabscheidung
JP5558871B2 (ja) * 2010-03-15 2014-07-23 株式会社ダイヘン アーク溶接装置
JP2012033150A (ja) * 2010-06-30 2012-02-16 Toshiba Corp マスフローコントローラ、マスフローコントローラシステム、基板処理装置およびガス流量調整方法
JP6047308B2 (ja) * 2012-05-28 2016-12-21 日精エー・エス・ビー機械株式会社 樹脂容器用コーティング装置
AU2014281351B2 (en) * 2013-06-19 2020-03-12 Fontem Holdings 4 B.V. Device and method for sensing mass airflow
JP6216601B2 (ja) * 2013-10-09 2017-10-18 旭有機材株式会社 流量制御装置
JP6246606B2 (ja) * 2014-01-31 2017-12-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR20160012302A (ko) * 2014-07-23 2016-02-03 삼성전자주식회사 기판 제조 방법 및 그에 사용되는 기판 제조 장치
KR102628015B1 (ko) * 2017-12-01 2024-01-23 삼성전자주식회사 질량 유량 제어기, 반도체 소자의 제조장치 및 그의 관리방법
KR102066776B1 (ko) * 2017-12-11 2020-01-15 임용일 통합 분석 제어기에 의한 질량 유량 제어기 최적화 통합 시스템
KR102101068B1 (ko) * 2017-12-11 2020-04-14 조북룡 통합 분석기에 의한 질량 유량 최적화 제어 시스템
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
SG11202110276WA (en) * 2019-03-25 2021-10-28 Kokusai Electric Corp Substrate processing apparatus, method of manufacturing semiconductor device, and program
JP7270489B2 (ja) * 2019-07-10 2023-05-10 東京エレクトロン株式会社 性能算出方法および処理装置
CN113552909A (zh) * 2020-04-26 2021-10-26 长鑫存储技术有限公司 阀控制系统及阀控制方法
CN115454153A (zh) * 2022-10-26 2022-12-09 北京七星华创流量计有限公司 质量流量控制器及其流量控制方法

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US4335605A (en) * 1980-05-14 1982-06-22 Thermal Instrument Company Mass flow meter
GB2077434B (en) * 1980-05-30 1984-04-26 Millar John Ascertaining flow rate through valves or pumps
US4655089A (en) * 1985-06-07 1987-04-07 Smith Meter Inc. Mass flow meter and signal processing system
US5062446A (en) * 1991-01-07 1991-11-05 Sematech, Inc. Intelligent mass flow controller
EP0547617B1 (en) * 1991-12-18 1996-07-10 Pierre Delajoud Mass flow meter and method
JPH05289751A (ja) 1992-04-15 1993-11-05 Hitachi Metals Ltd マスフローコントローラのゼロ点シフト及びスパンシフトを自動補正する方法及びその自動補正機能付きマスフローコントローラ
EP0711430A1 (en) 1992-06-12 1996-05-15 Unit Instruments, Inc. Mass flow controller
JP2982003B2 (ja) * 1992-07-28 1999-11-22 コマツ電子金属株式会社 気相成長装置および気相成長装置におけるマスフローコントローラの校正方法
JP2692770B2 (ja) * 1992-09-30 1997-12-17 シーケーディ株式会社 マスフローコントローラ流量検定システム
JPH07263350A (ja) 1994-03-18 1995-10-13 Fujitsu Ltd 半導体製造方法
JP2635929B2 (ja) * 1994-04-12 1997-07-30 シーケーディ株式会社 マスフローコントローラ絶対流量検定システム
US5594180A (en) * 1994-08-12 1997-01-14 Micro Motion, Inc. Method and apparatus for fault detection and correction in Coriolis effect mass flowmeters
JP2802246B2 (ja) 1995-06-29 1998-09-24 久 高橋 遅れ補償機能付流量制御弁
JP3367811B2 (ja) 1996-01-05 2003-01-20 シーケーディ株式会社 ガス配管系の検定システム
US6185469B1 (en) * 1997-05-28 2001-02-06 Board Of Regents, The University Of Texas System Method and apparatus for testing and controlling a flexible manufacturing system
JP3932389B2 (ja) * 1998-01-19 2007-06-20 Ｓｍｃ株式会社 マスフローコントローラの自己診断方法
JP3684307B2 (ja) 1998-10-19 2005-08-17 シーケーディ株式会社 ガス供給制御装置
US6339727B1 (en) * 1998-12-21 2002-01-15 Recot, Inc. Apparatus and method for controlling distribution of product in manufacturing process
US6119710A (en) * 1999-05-26 2000-09-19 Cyber Instrument Technologies Llc Method for wide range gas flow system with real time flow measurement and correction
JP3513437B2 (ja) * 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
JP2001077267A (ja) * 1999-09-08 2001-03-23 Mitsubishi Electric Corp 半導体製造装置及び半導体装置の製造方法
JP2001197936A (ja) 2000-01-19 2001-07-24 Fuairudo Kk ヘア−スタイリングの改良された方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404115B (zh) * 2005-08-25 2013-08-01 Tokyo Electron Ltd Semiconductor manufacturing apparatus, flow correction method for semiconductor manufacturing apparatus, program
TWI476377B (zh) * 2008-12-25 2015-03-11 Horiba Stec Co 質量流量計及質量流量控制器

Also Published As

Publication number Publication date
US7510884B2 (en) 2009-03-31
JP3872776B2 (ja) 2007-01-24
WO2005008350A1 (ja) 2005-01-27
US20060172442A1 (en) 2006-08-03
EP1653312A1 (en) 2006-05-03
JP2005038058A (ja) 2005-02-10
EP1653312A4 (en) 2009-05-27
CN1751280A (zh) 2006-03-22
TWI305372B (enExample) 2009-01-11
CN100462887C (zh) 2009-02-18
KR101116979B1 (ko) 2012-03-15
KR20060035575A (ko) 2006-04-26

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees