JP3846584B2 - 部品類の洗浄装置及び洗浄方法 - Google Patents

部品類の洗浄装置及び洗浄方法 Download PDF

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Publication number
JP3846584B2
JP3846584B2 JP2002310179A JP2002310179A JP3846584B2 JP 3846584 B2 JP3846584 B2 JP 3846584B2 JP 2002310179 A JP2002310179 A JP 2002310179A JP 2002310179 A JP2002310179 A JP 2002310179A JP 3846584 B2 JP3846584 B2 JP 3846584B2
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JP
Japan
Prior art keywords
cleaning
hole
cleaned
liquid
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002310179A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004141778A (ja
Inventor
純一 前野
嘉一 増成
和貴 善福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arakawa Chemical Industries Ltd
Original Assignee
Arakawa Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chemical Industries Ltd filed Critical Arakawa Chemical Industries Ltd
Priority to JP2002310179A priority Critical patent/JP3846584B2/ja
Priority to KR1020057006911A priority patent/KR100988294B1/ko
Priority to CNB2003801020750A priority patent/CN100336611C/zh
Priority to PCT/JP2003/012935 priority patent/WO2004037452A1/ja
Priority to TW092128411A priority patent/TWI247632B/zh
Publication of JP2004141778A publication Critical patent/JP2004141778A/ja
Priority to HK06102724A priority patent/HK1082930A1/xx
Application granted granted Critical
Publication of JP3846584B2 publication Critical patent/JP3846584B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
JP2002310179A 2002-10-24 2002-10-24 部品類の洗浄装置及び洗浄方法 Expired - Lifetime JP3846584B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002310179A JP3846584B2 (ja) 2002-10-24 2002-10-24 部品類の洗浄装置及び洗浄方法
KR1020057006911A KR100988294B1 (ko) 2002-10-24 2003-10-09 부품류의 세정장치 및 세정방법
CNB2003801020750A CN100336611C (zh) 2002-10-24 2003-10-09 零件类的清洗装置及清洗方法
PCT/JP2003/012935 WO2004037452A1 (ja) 2002-10-24 2003-10-09 部品類の洗浄装置及び洗浄方法
TW092128411A TWI247632B (en) 2002-10-24 2003-10-14 Apparatus and method for cleaning parts
HK06102724A HK1082930A1 (en) 2002-10-24 2006-03-02 Equipment and method for washing parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002310179A JP3846584B2 (ja) 2002-10-24 2002-10-24 部品類の洗浄装置及び洗浄方法

Publications (2)

Publication Number Publication Date
JP2004141778A JP2004141778A (ja) 2004-05-20
JP3846584B2 true JP3846584B2 (ja) 2006-11-15

Family

ID=32171042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002310179A Expired - Lifetime JP3846584B2 (ja) 2002-10-24 2002-10-24 部品類の洗浄装置及び洗浄方法

Country Status (6)

Country Link
JP (1) JP3846584B2 (ko)
KR (1) KR100988294B1 (ko)
CN (1) CN100336611C (ko)
HK (1) HK1082930A1 (ko)
TW (1) TWI247632B (ko)
WO (1) WO2004037452A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393595B (zh) * 2006-03-17 2013-04-21 Michale Goodson J 具有頻率掃描的厚度模式轉換器之超高頻音波處理設備
JP2009071201A (ja) * 2007-09-18 2009-04-02 Nec Electronics Corp 洗浄装置
JP2009160483A (ja) * 2007-12-28 2009-07-23 Nec Electronics Corp 循環型洗浄装置
CN101912853B (zh) * 2010-09-03 2011-11-02 任保林 超声波脉冲水射流管壁除锈清洗装置
CN102274838A (zh) * 2011-05-06 2011-12-14 湘潭大众整流器制造有限公司 超声波清洗机
CN102522322A (zh) * 2011-12-15 2012-06-27 华东光电集成器件研究所 一种半导体芯粒的清洗装置
WO2015162699A1 (ja) 2014-04-22 2015-10-29 富士機械製造株式会社 ノズル洗浄装置および、ノズル乾燥方法
CN106540917B (zh) * 2015-09-16 2020-03-31 泰科电子(上海)有限公司 超声波清洗系统
CN106541329B (zh) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 集成设备
JP6861427B2 (ja) * 2015-10-16 2021-04-21 株式会社Ｆｕｊｉ ノズル洗浄装置およびノズル乾燥方法
CN107185870A (zh) * 2017-07-25 2017-09-22 安徽瑞泰汽车零部件有限责任公司 一种铝合金零件清洗装置及清洗方法
CN108580424B (zh) * 2018-03-22 2024-01-09 温州医科大学附属口腔医院 一种电动牙洁治器手柄清洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478978U (ko) * 1990-11-19 1992-07-09
JP3988320B2 (ja) * 1999-06-18 2007-10-10 荒川化学工業株式会社 物品の洗浄方法および洗浄装置
JP2001162237A (ja) * 1999-12-09 2001-06-19 Totoku Electric Co Ltd エナメル線用塗料塗布ダイスの洗浄装置
JP3494293B2 (ja) * 2000-10-25 2004-02-09 株式会社カイジョー 密閉型容器の洗浄方法及び洗浄装置
CN2514947Y (zh) * 2001-11-23 2002-10-09 亚智科技股份有限公司 盲导孔及小孔清洗装置

Also Published As

Publication number Publication date
CN1708365A (zh) 2005-12-14
TWI247632B (en) 2006-01-21
CN100336611C (zh) 2007-09-12
KR20050055031A (ko) 2005-06-10
HK1082930A1 (en) 2006-06-23
TW200416075A (en) 2004-09-01
KR100988294B1 (ko) 2010-10-18
WO2004037452A1 (ja) 2004-05-06
JP2004141778A (ja) 2004-05-20

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