JP3839030B2 - 露光及び現像方法 - Google Patents
露光及び現像方法 Download PDFInfo
- Publication number
- JP3839030B2 JP3839030B2 JP2004179032A JP2004179032A JP3839030B2 JP 3839030 B2 JP3839030 B2 JP 3839030B2 JP 2004179032 A JP2004179032 A JP 2004179032A JP 2004179032 A JP2004179032 A JP 2004179032A JP 3839030 B2 JP3839030 B2 JP 3839030B2
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
- G03F7/343—Lamination or delamination methods or apparatus for photolitographic photosensitive material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
13 キャリアフィルム
20 枚葉基板
MR 枚葉基板連結体
Claims (4)
- 表裏両面側に回路パターンを備える両面回路基板を枚葉基板から製造する際の露光及び現像方法であって、供給された複数の枚葉基板が互いに隣り合う枚葉基板同士で連結するように前記枚葉基板の表裏各面に長尺帯状のドライフィルムレジストを貼り付けることにより、複数の枚葉基板の連結体である長尺帯状の枚葉基板連結体を形成し、該枚葉基板連結体に対して露光を行った後、上記連結部分におけるドライフィルムレジストを溶解して分断可能な現像液を用いて現像を行うことを特徴とする露光及び現像方法。
- 露光された前記枚葉基板連結体に対し該枚葉基板連結体の表裏両面に貼り付けられたドライフィルムレジストにおけるキャリアフィルムを剥離し、該キャリアフィルムを剥離した枚葉基板連結体に現像を行う請求項1記載の露光及び現像方法。
- 前記現像の後段の処理が、互いに連結していない枚葉基板であることを要する処理である請求項1または請求項2記載の露光及び現像方法。
- 前記複数の枚葉基板の連結体である枚葉基板連結体を形成する前段の処理が、互いに連結していない枚葉基板であることを要する処理である請求項1から請求項3のいずれかに記載の露光及び現像方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004179032A JP3839030B2 (ja) | 2004-06-17 | 2004-06-17 | 露光及び現像方法 |
KR1020050040862A KR101097115B1 (ko) | 2004-06-17 | 2005-05-16 | 노광 및 현상방법 |
TW094119758A TWI341698B (en) | 2004-06-17 | 2005-06-15 | Exposure and image developing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004179032A JP3839030B2 (ja) | 2004-06-17 | 2004-06-17 | 露光及び現像方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006003575A JP2006003575A (ja) | 2006-01-05 |
JP3839030B2 true JP3839030B2 (ja) | 2006-11-01 |
Family
ID=35772018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004179032A Expired - Lifetime JP3839030B2 (ja) | 2004-06-17 | 2004-06-17 | 露光及び現像方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3839030B2 (ja) |
KR (1) | KR101097115B1 (ja) |
TW (1) | TWI341698B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010087396A (ja) * | 2008-10-02 | 2010-04-15 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板シートの製造方法およびフレキシブルプリント配線板シートの製造装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002223055A (ja) * | 2001-01-26 | 2002-08-09 | Matsushita Electric Works Ltd | 配線板の製造方法 |
-
2004
- 2004-06-17 JP JP2004179032A patent/JP3839030B2/ja not_active Expired - Lifetime
-
2005
- 2005-05-16 KR KR1020050040862A patent/KR101097115B1/ko not_active IP Right Cessation
- 2005-06-15 TW TW094119758A patent/TWI341698B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200607412A (en) | 2006-02-16 |
KR101097115B1 (ko) | 2011-12-22 |
JP2006003575A (ja) | 2006-01-05 |
TWI341698B (en) | 2011-05-01 |
KR20060046053A (ko) | 2006-05-17 |
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