JP3811697B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP3811697B2 JP3811697B2 JP2003389262A JP2003389262A JP3811697B2 JP 3811697 B2 JP3811697 B2 JP 3811697B2 JP 2003389262 A JP2003389262 A JP 2003389262A JP 2003389262 A JP2003389262 A JP 2003389262A JP 3811697 B2 JP3811697 B2 JP 3811697B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- film
- btbas
- sin film
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 90
- 238000000034 method Methods 0.000 claims description 63
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 33
- 229910052710 silicon Inorganic materials 0.000 description 33
- 239000010703 silicon Substances 0.000 description 33
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 23
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 22
- 239000002245 particle Substances 0.000 description 22
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 14
- 125000006850 spacer group Chemical group 0.000 description 13
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 12
- 238000002955 isolation Methods 0.000 description 11
- 238000007796 conventional method Methods 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 8
- 229910017052 cobalt Inorganic materials 0.000 description 8
- 239000010941 cobalt Substances 0.000 description 8
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000012634 fragment Substances 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000011550 stock solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- CGRVKSPUKAFTBN-UHFFFAOYSA-N N-silylbutan-1-amine Chemical compound CCCCN[SiH3] CGRVKSPUKAFTBN-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 125000006309 butyl amino group Chemical group 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004347 surface barrier Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/0209—Cleaning of wafer backside
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
Description
次に、本発明に係る第1の実施形態の製造方法を図1〜図2に基づいて説明する。ここで、図1は図17で示したようなゲート製造工程などを含む本発明に係る製造方法の流れ図である。図2はゲート形成後のウエハ断面図(a)と、基板裏面側のBTBAS−SiN膜および酸化膜を除去した後のウエハ断面図(b)である。
次に、本発明に係る第2の実施形態の製造方法を説明する。
次に、本発明に係る第3の実施形態の製造方法を図3〜図4と図16に基づいて説明する。ここで図3は図16で示したようなゲート製造工程などを含む本発明に係る製造方法の流れ図である。図4はゲート形成後のウエハ断面図(a)と、基板裏面側のBTBAS−SiN膜のみを除去した後のウエハ断面図(b)である。
次に、本発明に係る第4の実施形態の製造方法を図5,図6と図16に基づいて説明する。ここで図5は図16で示したようなゲート製造工程などの流れ図である。図6はゲート形成後のウエハ断面図(a)と、シリコン基板裏面側のBTBAS−SiN膜などを除去した後のウエハ断面図(b)である。
次に、本発明に係る第5の実施形態の製造方法を図7〜図9と図17に基づいて説明する。ここで図7は図17で示したような素子分離製造工程の流れ図である。図8も同様に図17で示したようなゲート(トランジスタ)製造工程などの流れ図である。図9は素子分離とゲート形成後のウエハ断面図(a)と、基板裏面側のBTBAS−SiN膜などを除去した後のウエハ断面図(b)である。
次に、本発明に係る第6の実施形態の製造方法を図10,図11に基づいて説明する。
次に、本発明に係る第7の実施形態の製造装置を図12,図13に基づいて説明する。図12(a)は従来方法における真空チャックを用いたハンドリングをウエハ裏面側から見た平面図、図12(b)は図12(a)におけるA−A矢視断面図である。図13(a)は、第7の実施形態における支持用治具によりハンドリングする状態となったウエハを裏面側から見た平面図、図13(b)は図13(a)におけるA−A矢視断面図である。
次に、本発明に係る第8の実施形態の製造装置を図14,図15に基づいて説明する。図14(a)は従来方法における静電チャックを用いたプロセス中のウエハ保持状態をウエハ裏面側から見た平面図、図14(b)は図14(a)におけるA−A矢視断面図であり、図14(c)は従来方法における真空チャックを用いたプロセス中のウエハ保持状態をウエハ裏面側から見た平面図、図14(b)は図14(a)におけるA−A矢視断面図である。図15(a)は第8の実施形態におけるウエハガイドリングにウエハを装着した状態を示す平面図、図15(b)は図15(a)におけるA−A矢視断面図である。
10 バックシール酸化膜
11 BTBAS−SiN膜
Claims (3)
- 半導体基板上にサイドウォール用もしくはライナー用のBTBAS−SiN膜を形成することと同時に前記半導体基板の裏面側にBTBAS−SiN膜を形成する工程と、
ウエハハンドラーとして静電チャックもしくは真空チャックを用いて前記半導体基板のプロセスもしくは搬送において前記半導体基板をハンドリングする工程と、
前記半導体基板の裏面をスクラバー洗浄する工程とを含み、
前記静電チャックもしくは真空チャックを用いてハンドリングする工程後、前記スクラバー洗浄する工程前の、前記半導体基板を一定方向で所定の間隔をおいて並ぶように複数枚装着できるカセットに対して、前記半導体基板とダミーの基板とを交互に装着することを特徴とする半導体装置の製造方法。 - 前記ウエハハンドラーは前記半導体基板の4隅を支持して常圧搬送することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記半導体基板のプロセスもしくは搬送に用いるウエハサセプターとウエハハンドラーとを備え、
前記ウエハサセプターとウエハハンドラーは、ウエハとほぼ同じ形状の凹部を形成したウエハガイドリングを設置することを特徴とする請求項1記載の半導体装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003389262A JP3811697B2 (ja) | 2003-11-19 | 2003-11-19 | 半導体装置の製造方法 |
TW093134416A TWI248642B (en) | 2003-11-19 | 2004-11-11 | Method and apparatus for fabricating semiconductor device |
US10/989,385 US20050121705A1 (en) | 2003-11-19 | 2004-11-17 | Method and apparatus for fabricating semiconductor device |
CNB2004100949342A CN1316561C (zh) | 2003-11-19 | 2004-11-18 | 制造半导体器件的方法和装置 |
KR1020040095220A KR100689740B1 (ko) | 2003-11-19 | 2004-11-19 | 반도체 장치의 제조 방법 및 그 제조 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003389262A JP3811697B2 (ja) | 2003-11-19 | 2003-11-19 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005150597A JP2005150597A (ja) | 2005-06-09 |
JP3811697B2 true JP3811697B2 (ja) | 2006-08-23 |
Family
ID=34631402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003389262A Expired - Fee Related JP3811697B2 (ja) | 2003-11-19 | 2003-11-19 | 半導体装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050121705A1 (ja) |
JP (1) | JP3811697B2 (ja) |
KR (1) | KR100689740B1 (ja) |
CN (1) | CN1316561C (ja) |
TW (1) | TWI248642B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100640963B1 (ko) * | 2004-12-30 | 2006-11-02 | 동부일렉트로닉스 주식회사 | 반도체 소자의 제조방법 |
CN101165862B (zh) * | 2006-10-16 | 2011-04-20 | 联华电子股份有限公司 | 高压应力薄膜与应变硅金属氧化物半导体晶体管及其制法 |
US8206605B2 (en) | 2006-11-01 | 2012-06-26 | Tokyo Electron Limited | Substrate processing method and substrate processing system |
US7902082B2 (en) * | 2007-09-20 | 2011-03-08 | Samsung Electronics Co., Ltd. | Method of forming field effect transistors using diluted hydrofluoric acid to remove sacrificial nitride spacers |
JP5264834B2 (ja) * | 2010-06-29 | 2013-08-14 | 東京エレクトロン株式会社 | エッチング方法及び装置、半導体装置の製造方法 |
US8486814B2 (en) * | 2011-07-21 | 2013-07-16 | International Business Machines Corporation | Wafer backside defectivity clean-up utilizing selective removal of substrate material |
CN105097930A (zh) * | 2014-05-22 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制作方法及半导体器件 |
CN112201577B (zh) * | 2020-09-16 | 2023-02-03 | 上海华力集成电路制造有限公司 | 防止晶背污染的方法及晶背保护层 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5976991A (en) * | 1998-06-11 | 1999-11-02 | Air Products And Chemicals, Inc. | Deposition of silicon dioxide and silicon oxynitride using bis(tertiarybutylamino) silane |
JP3819660B2 (ja) * | 2000-02-15 | 2006-09-13 | 株式会社日立国際電気 | 半導体装置の製造方法および半導体製造装置 |
KR100398035B1 (ko) * | 2000-12-29 | 2003-09-19 | 주식회사 하이닉스반도체 | 반도체 소자의 트랜지스터 제조 방법 |
JP3482201B2 (ja) * | 2001-03-15 | 2003-12-22 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP2002289665A (ja) * | 2001-03-26 | 2002-10-04 | Denso Corp | ウェハハンドリング装置 |
KR20030003378A (ko) * | 2001-06-30 | 2003-01-10 | 주식회사 하이닉스반도체 | 샐리사이드 형성 방법 |
-
2003
- 2003-11-19 JP JP2003389262A patent/JP3811697B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-11 TW TW093134416A patent/TWI248642B/zh not_active IP Right Cessation
- 2004-11-17 US US10/989,385 patent/US20050121705A1/en not_active Abandoned
- 2004-11-18 CN CNB2004100949342A patent/CN1316561C/zh not_active Expired - Fee Related
- 2004-11-19 KR KR1020040095220A patent/KR100689740B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1630028A (zh) | 2005-06-22 |
CN1316561C (zh) | 2007-05-16 |
TW200525624A (en) | 2005-08-01 |
KR20050048532A (ko) | 2005-05-24 |
TWI248642B (en) | 2006-02-01 |
US20050121705A1 (en) | 2005-06-09 |
KR100689740B1 (ko) | 2007-03-09 |
JP2005150597A (ja) | 2005-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3811697B2 (ja) | 半導体装置の製造方法 | |
TW201735099A (zh) | 積體電路的製造方法與半導體元件 | |
US20040063263A1 (en) | Manufacturing method of semiconductor devices | |
US20060105541A1 (en) | Trench isolation method for semiconductor devices | |
KR20000047991A (ko) | 웨이퍼 에지상에 흑색 실리콘이 형성되는 것을 방지하기위한 방법 및 장치 | |
CN110752213A (zh) | 半导体结构的制作方法 | |
US7601605B2 (en) | Method for manufacturing semiconductor device, method for forming alignment mark, and semiconductor device | |
JPH11121621A (ja) | 自己整列コンタクトホール形成方法 | |
US20120264302A1 (en) | Chemical mechanical polishing process | |
JP2008016499A (ja) | 半導体装置およびその製造方法 | |
JP5168935B2 (ja) | 半導体装置の製造方法 | |
JP3994856B2 (ja) | 半導体装置の製造方法 | |
TWI717637B (zh) | 半導體結構中的凹槽的製作方法 | |
EP1104936A1 (en) | Method of manufacturing a semiconductor device, and semiconductor device manufactured thereby | |
US10109474B1 (en) | Method for fabricating handling wafer | |
JP2007012697A (ja) | 半導体素子の製造方法 | |
US20090081847A1 (en) | Method of manufacturing nonvolatile semiconductor memory device | |
JP2004179301A (ja) | 半導体集積回路装置の製造方法 | |
US7358197B2 (en) | Method for avoiding polysilicon film over etch abnormal | |
JP4651172B2 (ja) | 半導体装置の製造方法 | |
CN111883418B (zh) | 半导体结构的制造方法 | |
US11257711B1 (en) | Fabricating method of transistors without dishing occurred during CMP process | |
JP2011054818A (ja) | 半導体装置の製造方法 | |
KR100992631B1 (ko) | 반도체 소자의 제조방법 | |
JP5458547B2 (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060216 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060221 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060419 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060516 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060529 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100602 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100602 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110602 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120602 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120602 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130602 Year of fee payment: 7 |
|
LAPS | Cancellation because of no payment of annual fees |