JP3811248B2 - 半導体素子の基板への接合方法及び実装方法 - Google Patents

半導体素子の基板への接合方法及び実装方法 Download PDF

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Publication number
JP3811248B2
JP3811248B2 JP05502597A JP5502597A JP3811248B2 JP 3811248 B2 JP3811248 B2 JP 3811248B2 JP 05502597 A JP05502597 A JP 05502597A JP 5502597 A JP5502597 A JP 5502597A JP 3811248 B2 JP3811248 B2 JP 3811248B2
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Japan
Prior art keywords
bonding
semiconductor element
layer
substrate
bump
Prior art date
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Expired - Fee Related
Application number
JP05502597A
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English (en)
Japanese (ja)
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JPH10256309A5 (enExample
JPH10256309A (ja
Inventor
英信 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP05502597A priority Critical patent/JP3811248B2/ja
Publication of JPH10256309A publication Critical patent/JPH10256309A/ja
Publication of JPH10256309A5 publication Critical patent/JPH10256309A5/ja
Application granted granted Critical
Publication of JP3811248B2 publication Critical patent/JP3811248B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP05502597A 1997-03-10 1997-03-10 半導体素子の基板への接合方法及び実装方法 Expired - Fee Related JP3811248B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05502597A JP3811248B2 (ja) 1997-03-10 1997-03-10 半導体素子の基板への接合方法及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05502597A JP3811248B2 (ja) 1997-03-10 1997-03-10 半導体素子の基板への接合方法及び実装方法

Publications (3)

Publication Number Publication Date
JPH10256309A JPH10256309A (ja) 1998-09-25
JPH10256309A5 JPH10256309A5 (enExample) 2005-02-17
JP3811248B2 true JP3811248B2 (ja) 2006-08-16

Family

ID=12987137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05502597A Expired - Fee Related JP3811248B2 (ja) 1997-03-10 1997-03-10 半導体素子の基板への接合方法及び実装方法

Country Status (1)

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JP (1) JP3811248B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4304717B2 (ja) * 2003-06-26 2009-07-29 日本電気株式会社 光モジュールおよびその製造方法
JP4630629B2 (ja) * 2004-10-29 2011-02-09 豊田合成株式会社 発光装置の製造方法
US7417220B2 (en) 2004-09-09 2008-08-26 Toyoda Gosei Co., Ltd. Solid state device and light-emitting element
JP4810393B2 (ja) 2006-10-27 2011-11-09 富士通株式会社 光モジュール製造方法及び製造装置
JP2009038402A (ja) * 2008-11-10 2009-02-19 Panasonic Corp 部品の実装装置

Also Published As

Publication number Publication date
JPH10256309A (ja) 1998-09-25

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