JP3792508B2 - 貼り合わせ脆性基板の分断方法 - Google Patents

貼り合わせ脆性基板の分断方法 Download PDF

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Publication number
JP3792508B2
JP3792508B2 JP2000385140A JP2000385140A JP3792508B2 JP 3792508 B2 JP3792508 B2 JP 3792508B2 JP 2000385140 A JP2000385140 A JP 2000385140A JP 2000385140 A JP2000385140 A JP 2000385140A JP 3792508 B2 JP3792508 B2 JP 3792508B2
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JP
Japan
Prior art keywords
break
liquid crystal
crystal panel
scribe line
brittle substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000385140A
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English (en)
Japanese (ja)
Other versions
JP2002187098A (ja
Inventor
治雄 若山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2000385140A priority Critical patent/JP3792508B2/ja
Priority to TW090131201A priority patent/TW561134B/zh
Priority to KR1020010079901A priority patent/KR20020050116A/ko
Priority to CNB011437561A priority patent/CN1231335C/zh
Publication of JP2002187098A publication Critical patent/JP2002187098A/ja
Priority to HK03100519.9A priority patent/HK1048454A1/zh
Priority to KR1020050115309A priority patent/KR100645499B1/ko
Application granted granted Critical
Publication of JP3792508B2 publication Critical patent/JP3792508B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
JP2000385140A 2000-12-19 2000-12-19 貼り合わせ脆性基板の分断方法 Expired - Fee Related JP3792508B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000385140A JP3792508B2 (ja) 2000-12-19 2000-12-19 貼り合わせ脆性基板の分断方法
TW090131201A TW561134B (en) 2000-12-19 2001-12-17 Device for cutting brittle substrate, cutting method using the same, cutting system
KR1020010079901A KR20020050116A (ko) 2000-12-19 2001-12-17 취성기판의 절단방법 및 그 장치
CNB011437561A CN1231335C (zh) 2000-12-19 2001-12-19 脆性基板的分割方法及其装置
HK03100519.9A HK1048454A1 (zh) 2000-12-19 2003-01-21 脆性基板的分割方法及其裝置
KR1020050115309A KR100645499B1 (ko) 2000-12-19 2005-11-30 취성기판의 절단방법 및 그 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000385140A JP3792508B2 (ja) 2000-12-19 2000-12-19 貼り合わせ脆性基板の分断方法

Publications (2)

Publication Number Publication Date
JP2002187098A JP2002187098A (ja) 2002-07-02
JP3792508B2 true JP3792508B2 (ja) 2006-07-05

Family

ID=18852460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000385140A Expired - Fee Related JP3792508B2 (ja) 2000-12-19 2000-12-19 貼り合わせ脆性基板の分断方法

Country Status (5)

Country Link
JP (1) JP3792508B2 (ko)
KR (2) KR20020050116A (ko)
CN (1) CN1231335C (ko)
HK (1) HK1048454A1 (ko)
TW (1) TW561134B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2147899A1 (en) 2008-07-18 2010-01-27 Mitsuboshi Diamond Industrial Co., Ltd. Method for processing terminal in bonded substrate

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE527091T1 (de) * 2002-11-22 2011-10-15 Mitsuboshi Diamond Ind Co Ltd Verfahren zum teilen eines substrats und ein verfahren zur herstellung eines panels
US20070214925A1 (en) * 2003-09-24 2007-09-20 Mitsubishi Diamond Industrial Co., Ltd Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method
CN101823215B (zh) * 2004-02-18 2013-02-27 川崎重工业株式会社 板材的立式加工生产线
JP2008195571A (ja) * 2007-02-13 2008-08-28 Shiraitekku:Kk 基板の分断装置
KR100890764B1 (ko) 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 가공 테이블 일체형 유리 기판 브레이킹 장치
KR101171875B1 (ko) * 2008-02-29 2012-08-07 미쓰보시 다이야몬도 고교 가부시키가이샤 평면표시패널용 머더기판의 분리장치 및 분리방법
JP5284726B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5284725B2 (ja) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 脆性材料ブレーク装置
JP5310278B2 (ja) * 2009-06-05 2013-10-09 三星ダイヤモンド工業株式会社 ブレイクバー
KR101146642B1 (ko) * 2010-08-04 2012-05-16 (주)큐엠씨 곡면 밀착을 이용한 대상물 브레이킹장치
CN102219368B (zh) * 2011-04-12 2012-12-19 深圳市晶向科技有限公司 Tft-lcd玻璃切割机的刀轮压力控制系统及方法
JP5981791B2 (ja) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
KR102026822B1 (ko) * 2012-07-23 2019-10-01 삼성디스플레이 주식회사 표시 장치 셀 절단 장치 및 표시 장치 제조 방법
JP6115438B2 (ja) * 2013-10-16 2017-04-19 三星ダイヤモンド工業株式会社 破断装置及び分断方法
JP6287548B2 (ja) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離方法及び端材分離装置
JP6256178B2 (ja) * 2014-04-28 2018-01-10 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP6387695B2 (ja) 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP6413694B2 (ja) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
JP6627326B2 (ja) 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 ブレイク装置
CN105538521A (zh) * 2016-01-12 2016-05-04 田宇科技股份有限公司 硬脆材料基板的切割方法
WO2019160709A1 (en) * 2018-02-13 2019-08-22 Corning Incorporated Glass separation systems and glass manufacturing apparatuses comprising the same
CN108658444A (zh) * 2018-07-26 2018-10-16 深圳大宇精雕科技有限公司 二次切割裂片线
CN110054406A (zh) * 2019-03-13 2019-07-26 昆山国显光电有限公司 裂片设备及裂片方法
JP2020151929A (ja) * 2019-03-20 2020-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置およびブレイク方法
CN112876055B (zh) * 2021-02-03 2022-07-12 甘肃旭盛显示科技有限公司 玻璃基板切割设备及其切割方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2147899A1 (en) 2008-07-18 2010-01-27 Mitsuboshi Diamond Industrial Co., Ltd. Method for processing terminal in bonded substrate

Also Published As

Publication number Publication date
KR20020050116A (ko) 2002-06-26
JP2002187098A (ja) 2002-07-02
TW561134B (en) 2003-11-11
CN1359784A (zh) 2002-07-24
KR20050118148A (ko) 2005-12-15
HK1048454A1 (zh) 2003-04-04
KR100645499B1 (ko) 2006-11-14
CN1231335C (zh) 2005-12-14

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