JP3782753B2 - 半導体装置の製造方法および半導体装置 - Google Patents

半導体装置の製造方法および半導体装置 Download PDF

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Publication number
JP3782753B2
JP3782753B2 JP2002124475A JP2002124475A JP3782753B2 JP 3782753 B2 JP3782753 B2 JP 3782753B2 JP 2002124475 A JP2002124475 A JP 2002124475A JP 2002124475 A JP2002124475 A JP 2002124475A JP 3782753 B2 JP3782753 B2 JP 3782753B2
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JP
Japan
Prior art keywords
semiconductor
conductive paste
circuit board
intermediate connector
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002124475A
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English (en)
Japanese (ja)
Other versions
JP2003017529A (ja
JP2003017529A5 (https=
Inventor
秀樹 東谷
大蔵 安藤
禎志 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002124475A priority Critical patent/JP3782753B2/ja
Publication of JP2003017529A publication Critical patent/JP2003017529A/ja
Publication of JP2003017529A5 publication Critical patent/JP2003017529A5/ja
Application granted granted Critical
Publication of JP3782753B2 publication Critical patent/JP3782753B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2002124475A 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置 Expired - Fee Related JP3782753B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002124475A JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-127778 2001-04-25
JP2001127778 2001-04-25
JP2002124475A JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Publications (3)

Publication Number Publication Date
JP2003017529A JP2003017529A (ja) 2003-01-17
JP2003017529A5 JP2003017529A5 (https=) 2005-08-25
JP3782753B2 true JP3782753B2 (ja) 2006-06-07

Family

ID=26614200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002124475A Expired - Fee Related JP3782753B2 (ja) 2001-04-25 2002-04-25 半導体装置の製造方法および半導体装置

Country Status (1)

Country Link
JP (1) JP3782753B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012965A (ja) * 2005-07-01 2007-01-18 Nec Tokin Corp Ｉｃチップの実装方法
WO2007031298A1 (de) * 2005-09-14 2007-03-22 Htc Beteiligungs Gmbh Flip-chip-modul und verfahren zum erzeugen eines flip-chip-moduls
JP5119678B2 (ja) * 2007-02-20 2013-01-16 富士通株式会社 実装構造、接続部材の製造方法、および半導体装置
JP5104687B2 (ja) * 2008-09-19 2012-12-19 日本電気株式会社 接合シート及び電子回路装置並びに製造方法
JP6623941B2 (ja) * 2016-06-09 2019-12-25 株式会社デンソー 多層基板の製造方法
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法

Also Published As

Publication number Publication date
JP2003017529A (ja) 2003-01-17

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