JP3773751B2 - 粘着テープ貼付装置及び部品実装機とディスプレイパネル - Google Patents

粘着テープ貼付装置及び部品実装機とディスプレイパネル Download PDF

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Publication number
JP3773751B2
JP3773751B2 JP2000109874A JP2000109874A JP3773751B2 JP 3773751 B2 JP3773751 B2 JP 3773751B2 JP 2000109874 A JP2000109874 A JP 2000109874A JP 2000109874 A JP2000109874 A JP 2000109874A JP 3773751 B2 JP3773751 B2 JP 3773751B2
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JP
Japan
Prior art keywords
release paper
adhesive tape
release
attached
pressure
Prior art date
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Expired - Fee Related
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JP2000109874A
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English (en)
Japanese (ja)
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JP2001294361A (ja
JP2001294361A5 (enExample
Inventor
慎治郎 辻
智隆 西本
雅也 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000109874A priority Critical patent/JP3773751B2/ja
Publication of JP2001294361A publication Critical patent/JP2001294361A/ja
Publication of JP2001294361A5 publication Critical patent/JP2001294361A5/ja
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Publication of JP3773751B2 publication Critical patent/JP3773751B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2000109874A 2000-04-11 2000-04-11 粘着テープ貼付装置及び部品実装機とディスプレイパネル Expired - Fee Related JP3773751B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000109874A JP3773751B2 (ja) 2000-04-11 2000-04-11 粘着テープ貼付装置及び部品実装機とディスプレイパネル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000109874A JP3773751B2 (ja) 2000-04-11 2000-04-11 粘着テープ貼付装置及び部品実装機とディスプレイパネル

Publications (3)

Publication Number Publication Date
JP2001294361A JP2001294361A (ja) 2001-10-23
JP2001294361A5 JP2001294361A5 (enExample) 2005-10-20
JP3773751B2 true JP3773751B2 (ja) 2006-05-10

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JP2000109874A Expired - Fee Related JP3773751B2 (ja) 2000-04-11 2000-04-11 粘着テープ貼付装置及び部品実装機とディスプレイパネル

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JP (1) JP3773751B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7076867B2 (en) 2001-12-28 2006-07-18 Matsushita Electric Industrial Co., Ltd. Pressurizing method
JP2011014790A (ja) * 2009-07-03 2011-01-20 Hitachi High-Technologies Corp Ａｃｆ貼付装置及び貼付方法
JP5563349B2 (ja) * 2010-03-30 2014-07-30 日本板硝子株式会社 転写体の製造方法
JP2012004336A (ja) 2010-06-17 2012-01-05 Panasonic Corp テープ貼付け装置およびテープ貼付け方法
JP5273128B2 (ja) 2010-11-15 2013-08-28 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP5605215B2 (ja) 2010-12-24 2014-10-15 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP6577915B2 (ja) * 2015-07-07 2019-09-18 芝浦メカトロニクス株式会社 粘着テープの貼着装置
JP6967933B2 (ja) * 2017-10-04 2021-11-17 フォイト パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングVOITH PATENT GmbH 貼付け装置及び貼付け方法
JP7459482B2 (ja) * 2019-11-01 2024-04-02 Ｔｏｐｐａｎホールディングス株式会社 転写体製造装置及び転写体製造方法
KR102686698B1 (ko) * 2023-12-14 2024-07-19 주식회사 제이스에이티에스 카메라모듈 acf 본딩장치

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JP2001294361A (ja) 2001-10-23

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