JP3692437B2 - ヒートシンクの製造方法 - Google Patents

ヒートシンクの製造方法 Download PDF

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Publication number
JP3692437B2
JP3692437B2 JP13059897A JP13059897A JP3692437B2 JP 3692437 B2 JP3692437 B2 JP 3692437B2 JP 13059897 A JP13059897 A JP 13059897A JP 13059897 A JP13059897 A JP 13059897A JP 3692437 B2 JP3692437 B2 JP 3692437B2
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JP
Japan
Prior art keywords
pin
substrate material
shaped
heat sink
manufacturing
Prior art date
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Expired - Fee Related
Application number
JP13059897A
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English (en)
Japanese (ja)
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JPH10321774A (ja
JPH10321774A5 (enExample
Inventor
茂利 成願
涼 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP13059897A priority Critical patent/JP3692437B2/ja
Publication of JPH10321774A publication Critical patent/JPH10321774A/ja
Publication of JPH10321774A5 publication Critical patent/JPH10321774A5/ja
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Publication of JP3692437B2 publication Critical patent/JP3692437B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP13059897A 1997-05-21 1997-05-21 ヒートシンクの製造方法 Expired - Fee Related JP3692437B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13059897A JP3692437B2 (ja) 1997-05-21 1997-05-21 ヒートシンクの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13059897A JP3692437B2 (ja) 1997-05-21 1997-05-21 ヒートシンクの製造方法

Publications (3)

Publication Number Publication Date
JPH10321774A JPH10321774A (ja) 1998-12-04
JPH10321774A5 JPH10321774A5 (enExample) 2005-04-07
JP3692437B2 true JP3692437B2 (ja) 2005-09-07

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ID=15038048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13059897A Expired - Fee Related JP3692437B2 (ja) 1997-05-21 1997-05-21 ヒートシンクの製造方法

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JP (1) JP3692437B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6591897B1 (en) * 2002-02-20 2003-07-15 Delphi Technologies, Inc. High performance pin fin heat sink for electronics cooling
JP5028147B2 (ja) * 2007-05-29 2012-09-19 株式会社アライドマテリアル 半導体装置用ヒートスプレッダとその製造方法
KR100877400B1 (ko) 2007-08-17 2009-01-07 최동철 히트싱크 조립장치
KR100888646B1 (ko) 2007-08-17 2009-03-17 최동철 히트싱크 조립장치
CN102183161A (zh) * 2011-01-25 2011-09-14 国研高能（北京）稳态传热传质技术研究院有限公司 一种均热板
JP6064191B2 (ja) * 2012-08-30 2017-01-25 太陽工業株式会社 ヒートシンク及びヒートシンクの製造方法
CN104124331A (zh) * 2014-07-04 2014-10-29 张逸兴 一种led的散热装置
JP6775374B2 (ja) 2016-10-07 2020-10-28 昭和電工株式会社 放熱ユニットの製造方法
JP7243262B2 (ja) 2019-02-15 2023-03-22 富士電機株式会社 半導体モジュール、車両および製造方法
WO2021045211A1 (ja) * 2019-09-06 2021-03-11 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体

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Publication number Publication date
JPH10321774A (ja) 1998-12-04

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