JP6775374B2 - 放熱ユニットの製造方法 - Google Patents
放熱ユニットの製造方法 Download PDFInfo
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- JP6775374B2 JP6775374B2 JP2016199003A JP2016199003A JP6775374B2 JP 6775374 B2 JP6775374 B2 JP 6775374B2 JP 2016199003 A JP2016199003 A JP 2016199003A JP 2016199003 A JP2016199003 A JP 2016199003A JP 6775374 B2 JP6775374 B2 JP 6775374B2
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- 230000017525 heat dissipation Effects 0.000 title claims description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 47
- 239000000463 material Substances 0.000 claims description 141
- 239000000758 substrate Substances 0.000 claims description 114
- 238000000034 method Methods 0.000 claims description 55
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 31
- 238000004080 punching Methods 0.000 claims description 31
- 238000005219 brazing Methods 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 description 26
- 239000002826 coolant Substances 0.000 description 15
- 239000012809 cooling fluid Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000000470 constituent Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/022—Making the fins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49945—Assembling or joining by driven force fit
Description
複数の貫通穴を有する基板用の第1板材の貫通穴にピンを通すことを含み、ピン用の第2板材から複数のピンを同時に打ち抜くことを特徴とする放熱ユニットの製造方法。
(14):基板
(15):フィン
(16):貫通穴
(17):ピン
(20);第1板材
(21):第1コイル
(22):第2板材
(23):第2コイル
(24):金型
(25):基板形成部
(26):ピン打ち抜き部
(27):ピン成形部
(31)(36):基板のろう材層
(41):ピンのろう材層
(46):貫通穴
(47):ピン
Claims (14)
- 複数の貫通穴が形成された基板と、基板の貫通穴に、長手方向両端側の一定長さ部分が貫通穴から突出するように通された状態で基板に固定されたピンからなり、ピンにおける貫通穴から突出した部分がフィンになっている放熱ユニットを製造する方法であって、
複数の貫通穴を有する基板用の第1板材の貫通穴にピンを通すことを含み、ピン用の第2板材から複数のピンを同時に打ち抜くことを特徴とする放熱ユニットの製造方法。 - 第1板材を用いて必要とされる数の貫通穴を有する基板をつくり、基板の貫通穴にピンを通すことを含む請求項1記載の放熱ユニットの製造方法。
- 第1板材に、1つの基板を形成する大きさの基板形成部が、第1板材の長手方向に並んで複数設けられており、第1板材の一端部の基板形成部に1つの基板に必要とされる数の貫通穴を形成した後、当該基板形成部の貫通穴にピンを通し、ついで貫通穴にピンが通された基板形成部を第1板材から切断して基板をつくることを含む請求項1記載の放熱ユニットの製造方法。
- 第2板材に、1つの基板に必要とされる数のピンを打ち抜くピン打ち抜き部が、第2板材の長手方向に並んで複数設けられており、第2板材の一端部のピン打ち抜き部に、第2板材の片面側に突出した複数の半抜き状ピン成形部を形成した後、当該ピン打ち抜き部のピン成形部を第2板材から打ち抜くことにより、複数のピンをつくるのと同時にピンを第1板材の前記一端部の基板形成部の貫通穴に通すことを含む請求項3記載の放熱ユニットの製造方法。
- 第1板材の基板形成部に貫通穴を形成する工程A、第2板材のピン打ち抜き部に半抜き加工を施して、第2板材の片面側に突出した半抜き状のピン成形部を形成する工程B、第2板材からピン成形部を打ち抜いてピンをつくるのと同時にピンを第1板材の前記一端部の基板形成部の貫通穴に通す工程C、および貫通穴にピンが通された基板形成部を第1板材から切断して基板をつくる工程Dを1つの金型を用いて行う請求項4記載の放熱ユニットの製造方法。
- 第2板材の一端部のピン打ち抜き部から複数のピンをつくった後、当該ピン打ち抜き部を第2板材から切断する工程Eを含み、工程Eを、工程A〜Dを実施する金型で行う請求項5記載の放熱ユニットの製造方法。
- 第1板材を巻き取った第1コイルと、第2板材を巻き取った第2コイルとを、両コイルからの両板材の繰り出し方向が平面から見て直交するように配置し、第1コイルから第1板材を間欠的に繰り出すとともに第2コイルから第2板材を間欠的に繰り出しながら、工程A〜Eを実施する請求項6記載の放熱ユニットの製造方法。
- 第2板材がJIS A1000系アルミニウムからなる請求項1〜7のうちのいずれかに記載の放熱ユニットの製造方法。
- 第2板材がJIS A6000系アルミニウムからなる請求項1〜7のうちのいずれかに記載の放熱ユニットの製造方法。
- ピンを第1板材の貫通穴に通す際に圧入する請求項1〜9のうちのいずれかに記載の放熱ユニットの製造方法。
- 第1板材の少なくとも片面にろう材層を設けておく請求項1〜9のうちのいずれかに記載の放熱ユニットの製造方法。
- 第2板材の少なくとも片面にろう材層を設けておく請求項1〜11のうちのいずれかに記載の放熱ユニットの製造方法。
- 打ち抜くピンの横断面形状が円形であり、当該ピンの長さLと直径Dとの比L/Dが1.7以下である請求項1〜12のうちのいずれかに記載の放熱ユニットの製造方法。
- 第1板材の貫通穴の形状が流線形であり、ピンの横断面形状が、円弧端および尖端が、それぞれ貫通穴の円弧端および尖端と同一方向を向いた流線形である請求項1〜13のうちのいずれかに記載の放熱ユニットの製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2016199003A JP6775374B2 (ja) | 2016-10-07 | 2016-10-07 | 放熱ユニットの製造方法 |
CN201780053158.7A CN109729740B (zh) | 2016-10-07 | 2017-09-11 | 散热单元的制造方法 |
PCT/JP2017/032648 WO2018066311A1 (ja) | 2016-10-07 | 2017-09-11 | 放熱ユニットの製造方法 |
US16/338,697 US11335623B2 (en) | 2016-10-07 | 2017-09-11 | Method of producing heat-dissipating unit |
DE112017005093.6T DE112017005093T5 (de) | 2016-10-07 | 2017-09-11 | Verfahren zum Herstellen einer wärmeableitenden Einheit |
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JP2016199003A JP6775374B2 (ja) | 2016-10-07 | 2016-10-07 | 放熱ユニットの製造方法 |
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JP2018060963A JP2018060963A (ja) | 2018-04-12 |
JP6775374B2 true JP6775374B2 (ja) | 2020-10-28 |
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Country Status (5)
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US (1) | US11335623B2 (ja) |
JP (1) | JP6775374B2 (ja) |
CN (1) | CN109729740B (ja) |
DE (1) | DE112017005093T5 (ja) |
WO (1) | WO2018066311A1 (ja) |
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US11297745B2 (en) * | 2018-03-28 | 2022-04-05 | The Board Of Trustees Of The University Of Illinois | Active thermal management system for electronic devices and method of achieving device-to-device isothermalization |
USD903610S1 (en) * | 2019-08-28 | 2020-12-01 | Carbice Corporation | Flexible heat sink |
USD906269S1 (en) * | 2019-08-28 | 2020-12-29 | Carbice Corporation | Flexible heat sink |
US20210063099A1 (en) | 2019-08-28 | 2021-03-04 | Carbice Corporation | Flexible and conformable polymer-based heat sinks and methods of making and using thereof |
USD904322S1 (en) * | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
CN114341586A (zh) * | 2019-09-06 | 2022-04-12 | 大日本印刷株式会社 | 蒸发室、电子设备、蒸发室用片、布置有多个蒸发室用中间体的片、卷绕布置有多个蒸发室用中间体的片而成的卷、以及蒸发室用中间体 |
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US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
JP3692437B2 (ja) * | 1997-05-21 | 2005-09-07 | 昭和電工株式会社 | ヒートシンクの製造方法 |
US6807059B1 (en) * | 1998-12-28 | 2004-10-19 | James L. Dale | Stud welded pin fin heat sink |
JP2005024107A (ja) * | 2003-06-30 | 2005-01-27 | Hitachi Cable Ltd | 熱交換器およびその製造方法 |
JP2009064908A (ja) * | 2007-09-05 | 2009-03-26 | Ibiden Co Ltd | 配線基板およびその製造方法 |
CN103402669B (zh) * | 2011-03-03 | 2015-07-01 | 昭和电工株式会社 | 锻造加工方法 |
JP5953206B2 (ja) * | 2011-11-11 | 2016-07-20 | 昭和電工株式会社 | 液冷式冷却装置およびその製造方法 |
US20130180688A1 (en) * | 2012-01-16 | 2013-07-18 | Cooler Master Co., Ltd. | Heat-dissipating module and method for manufacturing the same |
JP5838910B2 (ja) * | 2012-05-17 | 2016-01-06 | 株式会社豊田自動織機 | 冷却器及び冷却器の製造方法 |
JP5805838B1 (ja) * | 2014-09-29 | 2015-11-10 | 株式会社日立製作所 | 発熱体の冷却構造、電力変換器ユニットおよび電力変換装置 |
US10222125B2 (en) * | 2015-04-06 | 2019-03-05 | International Business Machines Corporation | Burst resistant thin wall heat sink |
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CN205503829U (zh) * | 2016-04-15 | 2016-08-24 | 王柚苹 | 具中空散热柱之制动结构 |
US10101097B2 (en) * | 2016-09-25 | 2018-10-16 | Cooler Master Co., Ltd. | Heat sink having thermal distortion compensation |
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2016
- 2016-10-07 JP JP2016199003A patent/JP6775374B2/ja active Active
-
2017
- 2017-09-11 US US16/338,697 patent/US11335623B2/en active Active
- 2017-09-11 CN CN201780053158.7A patent/CN109729740B/zh active Active
- 2017-09-11 DE DE112017005093.6T patent/DE112017005093T5/de active Pending
- 2017-09-11 WO PCT/JP2017/032648 patent/WO2018066311A1/ja active Application Filing
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Publication number | Publication date |
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DE112017005093T5 (de) | 2019-08-01 |
CN109729740A (zh) | 2019-05-07 |
WO2018066311A1 (ja) | 2018-04-12 |
US20190221501A1 (en) | 2019-07-18 |
US11335623B2 (en) | 2022-05-17 |
CN109729740B (zh) | 2023-04-04 |
JP2018060963A (ja) | 2018-04-12 |
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