JP3691833B2 - 薄膜磁気ヘッド用基板およびその製造方法 - Google Patents
薄膜磁気ヘッド用基板およびその製造方法 Download PDFInfo
- Publication number
- JP3691833B2 JP3691833B2 JP2004096323A JP2004096323A JP3691833B2 JP 3691833 B2 JP3691833 B2 JP 3691833B2 JP 2004096323 A JP2004096323 A JP 2004096323A JP 2004096323 A JP2004096323 A JP 2004096323A JP 3691833 B2 JP3691833 B2 JP 3691833B2
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- JP
- Japan
- Prior art keywords
- magnetic head
- thin film
- intermediate layer
- substrate
- film magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 118
- 239000010409 thin film Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010408 film Substances 0.000 claims description 134
- 239000000919 ceramic Substances 0.000 claims description 54
- 238000004544 sputter deposition Methods 0.000 claims description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 18
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 description 14
- 238000010292 electrical insulation Methods 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 12
- 239000000523 sample Substances 0.000 description 12
- 229910003077 Ti−O Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 229910016570 AlCu Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Description
これは、従来の構造において、導電性のAl−Ti−O化合物が生成している場合であっても、アンダーコート膜3が十分に厚くなれば、導電性のAl−Ti−O化合物の影響が無視できるようになるからである。したがって、アンダーコート膜3の厚さが10nmから0.4μmの範囲において、中間層2を設けることによる電気的絶縁特性の改善効果が顕著であるといえる。
2 中間層
3、13 アンダーコート膜
14 書き込み素子
16 読み込み素子
Claims (12)
- セラミックス基板と、アルミニウム酸化物からなるアンダーコート膜と、前記セラミックス基板および前記アンダーコート膜に挟まれており、金属膜またはSi膜からなる中間層とを備え、
前記アンダーコート膜の厚さは10nmから1μmの範囲内にある薄膜磁気ヘッド用基板。 - 前記中間層の厚さは1nmから1μmの範囲の値である請求項1に記載の薄膜磁気ヘッド用基板。
- 前記中間層はCu、Cr、Si、Cuを含む合金、またはCrを含む合金のいずれかである請求項1または2に記載の薄膜磁気ヘッド用基板。
- 前記アンダーコート膜の厚さは10nmから0.4μmの範囲の値である請求項1から3のいずれかに記載の薄膜磁気ヘッド用基板。
- 前記セラミックス基板は、24〜75mol%のα−Al2O3と、2mol%以下の添加剤とを含むアルミナ系セラミックス材料からなる請求項1から4のいずれかに記載の薄膜磁気ヘッド用基板。
- 前記セラミックス基板は、さらに金属の炭化物または金属の炭酸窒化物を含む請求項5に記載の薄膜磁気ヘッド用基板。
- 請求項1から6のいずれかに記載の薄膜磁気ヘッド用基板と、前記薄膜磁気ヘッド用基板に保持された書き込み素子および読み込み素子とを備えた薄膜磁気ヘッドスライダー。
- 請求項7に記載の薄膜磁気ヘッドスライダーを備えるハードディスクドライブ装置。
- セラミックス基板上に、スパッタ法により、金属膜またはSi膜からなる中間層を形成する工程と、
前記中間層上にスパッタ法により、10nmから1μmの範囲内の厚さを有し、アルミニウム酸化物からなるアンダーコート膜を形成する工程と、
を包含する薄膜磁気ヘッド用基板の製造方法。 - 前記中間層を形成する工程をバイアスを印加しないスパッタ法により行う請求項9に記載の薄膜磁気ヘッド用基板の製造方法。
- 前記アンダーコート膜を形成する工程をバイアスを印加したスパッタ法により行う請求項9または10に記載の薄膜磁気ヘッド用基板の製造方法。
- セラミックス基板と、中間層とアンダーコート膜とを備えた請求項1から6のいずれかに記載の薄膜磁気ヘッド用基板を用意する工程と、
前記アンダーコート膜上に書き込み素子および読み取り素子を配置する工程と、
を包含する薄膜磁気ヘッドスライダーの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004096323A JP3691833B2 (ja) | 2003-07-28 | 2004-03-29 | 薄膜磁気ヘッド用基板およびその製造方法 |
US10/885,313 US7675708B2 (en) | 2003-07-28 | 2004-07-07 | Substrate for thin-film magnetic head |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003280675 | 2003-07-28 | ||
JP2003280675 | 2003-07-28 | ||
JP2004096323A JP3691833B2 (ja) | 2003-07-28 | 2004-03-29 | 薄膜磁気ヘッド用基板およびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004287285A Division JP2005063656A (ja) | 2003-07-28 | 2004-09-30 | 薄膜磁気ヘッド用基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005063632A JP2005063632A (ja) | 2005-03-10 |
JP3691833B2 true JP3691833B2 (ja) | 2005-09-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004096323A Expired - Lifetime JP3691833B2 (ja) | 2003-07-28 | 2004-03-29 | 薄膜磁気ヘッド用基板およびその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7675708B2 (ja) |
JP (1) | JP3691833B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2420002B (en) * | 2004-05-17 | 2008-12-10 | Neomax Co Ltd | Substrate for thin film magnetic head and method for manufacturing same |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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US3799796A (en) * | 1970-10-06 | 1974-03-26 | Matthey Bishop Inc | Preparation of structures with a coating of al2o3/sio2 fibers bonded to al2o3 for use as catalyst substrates |
US4454014A (en) * | 1980-12-03 | 1984-06-12 | Memorex Corporation | Etched article |
JPS6050905A (ja) * | 1983-08-30 | 1985-03-22 | Hitachi Metals Ltd | 薄膜磁気ヘッド用セラミックス基板 |
JPS6066403A (ja) * | 1983-09-21 | 1985-04-16 | Hitachi Metals Ltd | 薄膜磁気ヘッド用セラミックス基板 |
JPS6284905A (ja) * | 1985-10-09 | 1987-04-18 | Mitsubishi Metal Corp | 表面被覆セラミツクス工具の製造法 |
GB2185437B (en) * | 1985-12-26 | 1989-12-06 | Hitachi Chemical Co Ltd | Ceramic coated laminate and process for producing the same |
JPH0622053B2 (ja) | 1986-04-23 | 1994-03-23 | 住友特殊金属株式会社 | 基板材料 |
JPS62278164A (ja) | 1986-05-26 | 1987-12-03 | 住友特殊金属株式会社 | 磁気ヘツド・スライダ用材料 |
US4902651A (en) * | 1986-06-20 | 1990-02-20 | Sumitomo Special Metals, Co. | Material for magnetic head substrate member |
DE3772671D1 (de) * | 1986-08-11 | 1991-10-10 | Sumitomo Electric Industries | Aluminiumoxyd, beschichtet mit diamant. |
US5165981A (en) * | 1987-03-20 | 1992-11-24 | Sumitomo Electric Industries, Ltd. | Ceramic substrate and preparation of the same |
US5326429A (en) * | 1992-07-21 | 1994-07-05 | Seagate Technology, Inc. | Process for making studless thin film magnetic head |
US5609948A (en) * | 1992-08-21 | 1997-03-11 | Minnesota Mining And Manufacturing Company | Laminate containing diamond-like carbon and thin-film magnetic head assembly formed thereon |
JP3463759B2 (ja) * | 1993-12-29 | 2003-11-05 | ソニー株式会社 | 磁気ヘッド及びその製造方法 |
JP3039909B2 (ja) * | 1994-05-14 | 2000-05-08 | 住友特殊金属株式会社 | 磁気ヘッド用基板材料 |
JP3039908B2 (ja) * | 1994-05-14 | 2000-05-08 | 住友特殊金属株式会社 | 低浮上性を有する磁気ヘッド用基板材料 |
DE19601730A1 (de) * | 1995-01-23 | 1996-07-25 | Fujitsu Ltd | Nichtmagnetisches Substrat, magnetisches Aufzeichnungsmedium, magnetisches Aufzeichnungslaufwerk, Verfahren zum Herstellen derselben und Verfahren zum Umwandeln einer Oberfläche einer Schicht in eine rauhe Oberfläche |
US6198607B1 (en) * | 1995-12-22 | 2001-03-06 | Censtor Corporation | Contact planar magnetoresistive head |
SG55435A1 (en) * | 1996-12-25 | 1998-12-21 | Hitachi Ltd | Thin film magnetic head and recording reproducing separate type magnetic head and magnetic recording reproducing apparatus using them |
US5843537A (en) * | 1997-03-07 | 1998-12-01 | Quantum Corporation | Insulator cure process for giant magnetoresistive heads |
JP3450178B2 (ja) | 1998-03-31 | 2003-09-22 | 京セラ株式会社 | 薄膜磁気ヘッド用基板の製造方法 |
JPH11339229A (ja) | 1998-05-25 | 1999-12-10 | Kyocera Corp | 薄膜磁気ヘッド用基板およびこれを用いた薄膜磁気ヘッド |
JP3674347B2 (ja) * | 1998-09-28 | 2005-07-20 | 富士通株式会社 | 負圧ヘッドスライダ |
JP3357313B2 (ja) * | 1999-03-11 | 2002-12-16 | 住友特殊金属株式会社 | 薄膜磁気ヘッド、薄膜磁気ヘッド用基板、および薄膜磁気ヘッド用基板の製造方法 |
US7154696B2 (en) * | 2004-02-11 | 2006-12-26 | Hitachi Global Storage Technologies Netherlands B.V. | Tunable fly height using magnetomechanical effect in a magnetic head |
-
2004
- 2004-03-29 JP JP2004096323A patent/JP3691833B2/ja not_active Expired - Lifetime
- 2004-07-07 US US10/885,313 patent/US7675708B2/en active Active
Also Published As
Publication number | Publication date |
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JP2005063632A (ja) | 2005-03-10 |
US7675708B2 (en) | 2010-03-09 |
US20050024772A1 (en) | 2005-02-03 |
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