JP3669811B2 - 半導体素子ボンディング用金合金線 - Google Patents

半導体素子ボンディング用金合金線 Download PDF

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Publication number
JP3669811B2
JP3669811B2 JP10907397A JP10907397A JP3669811B2 JP 3669811 B2 JP3669811 B2 JP 3669811B2 JP 10907397 A JP10907397 A JP 10907397A JP 10907397 A JP10907397 A JP 10907397A JP 3669811 B2 JP3669811 B2 JP 3669811B2
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Japan
Prior art keywords
weight
ppm
gold
alloy wire
predetermined amount
Prior art date
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Expired - Fee Related
Application number
JP10907397A
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English (en)
Japanese (ja)
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JPH10303237A (ja
JPH10303237A5 (enExample
Inventor
和彦 安原
信一 花田
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Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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Priority to JP10907397A priority Critical patent/JP3669811B2/ja
Publication of JPH10303237A publication Critical patent/JPH10303237A/ja
Publication of JPH10303237A5 publication Critical patent/JPH10303237A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
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    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP10907397A 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線 Expired - Fee Related JP3669811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10907397A JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

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Application Number Priority Date Filing Date Title
JP10907397A JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

Publications (3)

Publication Number Publication Date
JPH10303237A JPH10303237A (ja) 1998-11-13
JPH10303237A5 JPH10303237A5 (enExample) 2005-03-17
JP3669811B2 true JP3669811B2 (ja) 2005-07-13

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JP10907397A Expired - Fee Related JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

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Publication number Priority date Publication date Assignee Title
JP4134261B1 (ja) * 2007-10-24 2008-08-20 田中電子工業株式会社 ボールボンディング用金合金線
JP4150752B1 (ja) * 2007-11-06 2008-09-17 田中電子工業株式会社 ボンディングワイヤ

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