JPH10303237A5 - - Google Patents

Info

Publication number
JPH10303237A5
JPH10303237A5 JP1997109073A JP10907397A JPH10303237A5 JP H10303237 A5 JPH10303237 A5 JP H10303237A5 JP 1997109073 A JP1997109073 A JP 1997109073A JP 10907397 A JP10907397 A JP 10907397A JP H10303237 A5 JPH10303237 A5 JP H10303237A5
Authority
JP
Japan
Prior art keywords
ppm
weight
gold
indium
remainder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997109073A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10303237A (ja
JP3669811B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10907397A priority Critical patent/JP3669811B2/ja
Priority claimed from JP10907397A external-priority patent/JP3669811B2/ja
Publication of JPH10303237A publication Critical patent/JPH10303237A/ja
Publication of JPH10303237A5 publication Critical patent/JPH10303237A5/ja
Application granted granted Critical
Publication of JP3669811B2 publication Critical patent/JP3669811B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP10907397A 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線 Expired - Fee Related JP3669811B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10907397A JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10907397A JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

Publications (3)

Publication Number Publication Date
JPH10303237A JPH10303237A (ja) 1998-11-13
JPH10303237A5 true JPH10303237A5 (enExample) 2005-03-17
JP3669811B2 JP3669811B2 (ja) 2005-07-13

Family

ID=14500928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10907397A Expired - Fee Related JP3669811B2 (ja) 1997-04-25 1997-04-25 半導体素子ボンディング用金合金線

Country Status (1)

Country Link
JP (1) JP3669811B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4134261B1 (ja) * 2007-10-24 2008-08-20 田中電子工業株式会社 ボールボンディング用金合金線
JP4150752B1 (ja) * 2007-11-06 2008-09-17 田中電子工業株式会社 ボンディングワイヤ

Similar Documents

Publication Publication Date Title
JP2004528992A5 (enExample)
WO1995018696A1 (en) Soldering composition
ES2194728T3 (es) Aleacion de aluminio-magnesio resistente a la exfoliacion.
CA2100114A1 (en) Copper-Bismuth Alloys
JP2008503055A5 (enExample)
RU2003114304A (ru) Бессвинцовый припой (варианты)
ATE278045T1 (de) Goldlegierungen und vorlegierungen zu deren herstellung
DE59501412D1 (de) Gleitlagerlegierung
JP2006066903A5 (enExample)
WO2002076669A8 (en) Brazing filler metal
JPH10303235A5 (enExample)
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
WO2006045995A8 (en) Improvements in or relating to solders
JPH11214425A5 (enExample)
BR0005867A (pt) Materiais de mancal
WO2007001598A3 (en) Lead-free semiconductor package
JPH11126788A5 (ja) 振動破断特性に優れたｉｃチップ接続用金合金線
JP2002060934A5 (ja) スパッタリングターゲットとそれを用いたバリア層および電子デバイス
CA2122376A1 (en) Solder alloy having decreased fatigue rupture occurring on soldered joints exposed to heat cycle stress
MXPA05006299A (es) Producto de chapa para broncesoldar y metodo para su fabricacion.
RU2002113827A (ru) Припой для низкотемпературной пайки
JPS54103764A (en) Brazing material
JP2003217415A5 (enExample)
JP2003257294A5 (enExample)
RU97112949A (ru) Сплав на основе золота