JPH11214425A5 - - Google Patents
Info
- Publication number
- JPH11214425A5 JPH11214425A5 JP1998010926A JP1092698A JPH11214425A5 JP H11214425 A5 JPH11214425 A5 JP H11214425A5 JP 1998010926 A JP1998010926 A JP 1998010926A JP 1092698 A JP1092698 A JP 1092698A JP H11214425 A5 JPH11214425 A5 JP H11214425A5
- Authority
- JP
- Japan
- Prior art keywords
- gold
- semiconductor elements
- weight
- total
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01092698A JP3810200B2 (ja) | 1998-01-23 | 1998-01-23 | ワイヤボンディング用金合金線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01092698A JP3810200B2 (ja) | 1998-01-23 | 1998-01-23 | ワイヤボンディング用金合金線 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11214425A JPH11214425A (ja) | 1999-08-06 |
| JPH11214425A5 true JPH11214425A5 (enExample) | 2005-08-04 |
| JP3810200B2 JP3810200B2 (ja) | 2006-08-16 |
Family
ID=11763854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01092698A Expired - Fee Related JP3810200B2 (ja) | 1998-01-23 | 1998-01-23 | ワイヤボンディング用金合金線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3810200B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023029A (ja) * | 2001-07-09 | 2003-01-24 | Tanaka Electronics Ind Co Ltd | 半導体素子接続用金線及びその製造方法 |
| JP4513440B2 (ja) * | 2004-07-15 | 2010-07-28 | 住友ベークライト株式会社 | 半導体装置 |
| JP4596467B2 (ja) * | 2005-06-14 | 2010-12-08 | 田中電子工業株式会社 | 高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線 |
| JP4726206B2 (ja) * | 2005-06-14 | 2011-07-20 | 田中電子工業株式会社 | 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性、高い耐樹脂流れ性および低い比抵抗を有するボンディングワイヤ用金合金線 |
| JP4726205B2 (ja) | 2005-06-14 | 2011-07-20 | 田中電子工業株式会社 | 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線 |
-
1998
- 1998-01-23 JP JP01092698A patent/JP3810200B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200710232A (en) | Lead-free solder alloy | |
| DK1452613T3 (da) | Blyfri kobberlegering og anvendelse deraf | |
| JP2004001100A5 (enExample) | ||
| JP6389561B2 (ja) | 金とチタンの軽い貴金属合金、及びこのような金とチタンの軽い貴金属合金で作られた計時器又は宝飾類用の部品 | |
| JP4230218B2 (ja) | 硬質貴金属合金部材およびその製造方法 | |
| EP1705258A3 (en) | Composition, methods and devices for high temperature lead-free solder | |
| EP2578707A4 (en) | ALLOY ON COPPER BASE AND STRUCTURAL MATERIAL THEREWITH | |
| DK1323839T3 (da) | Aluminiumhårdlodlegering | |
| DE60105987D1 (de) | Goldlegierungen und Vorlegierungen zu deren Herstellung | |
| PL368350A1 (en) | Dental alloy with silver content | |
| JPH11214425A5 (enExample) | ||
| US20140212324A1 (en) | Fine crystallite high-function metal alloy member and method for manufacturing same | |
| JP2008240128A5 (enExample) | ||
| EP1383149A3 (en) | Alloy type thermal fuse and wire member for a thermal fuse element | |
| JP2023021941A5 (enExample) | ||
| JPH11126788A5 (ja) | 振動破断特性に優れたｉｃチップ接続用金合金線 | |
| JPH10303235A5 (enExample) | ||
| JPS6047903B2 (ja) | 黄金色を呈する鋳造用低カラツト金合金 | |
| TW200704788A (en) | Material for thin film formation, thin film formed therefrom and method of forming thin film | |
| JPH10303237A5 (enExample) | ||
| JP2003217415A5 (enExample) | ||
| TW200703532A (en) | Gold alloy wire for use as bonding wire exhibiting high initial bonding capability, high bonding reliability, high circularity of press bonded ball, high straight advancing property, high resin flow resistance and low specific resistance | |
| JP3435139B2 (ja) | 歯科鋳造用銀合金 | |
| WO2024238779A3 (en) | Braze alloys | |
| JPS60127092A (ja) | ろう材 |