JPH11214425A5 - - Google Patents

Info

Publication number
JPH11214425A5
JPH11214425A5 JP1998010926A JP1092698A JPH11214425A5 JP H11214425 A5 JPH11214425 A5 JP H11214425A5 JP 1998010926 A JP1998010926 A JP 1998010926A JP 1092698 A JP1092698 A JP 1092698A JP H11214425 A5 JPH11214425 A5 JP H11214425A5
Authority
JP
Japan
Prior art keywords
gold
semiconductor elements
weight
total
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998010926A
Other languages
English (en)
Japanese (ja)
Other versions
JP3810200B2 (ja
JPH11214425A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP01092698A priority Critical patent/JP3810200B2/ja
Priority claimed from JP01092698A external-priority patent/JP3810200B2/ja
Publication of JPH11214425A publication Critical patent/JPH11214425A/ja
Publication of JPH11214425A5 publication Critical patent/JPH11214425A5/ja
Application granted granted Critical
Publication of JP3810200B2 publication Critical patent/JP3810200B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP01092698A 1998-01-23 1998-01-23 ワイヤボンディング用金合金線 Expired - Fee Related JP3810200B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP01092698A JP3810200B2 (ja) 1998-01-23 1998-01-23 ワイヤボンディング用金合金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01092698A JP3810200B2 (ja) 1998-01-23 1998-01-23 ワイヤボンディング用金合金線

Publications (3)

Publication Number Publication Date
JPH11214425A JPH11214425A (ja) 1999-08-06
JPH11214425A5 true JPH11214425A5 (enExample) 2005-08-04
JP3810200B2 JP3810200B2 (ja) 2006-08-16

Family

ID=11763854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP01092698A Expired - Fee Related JP3810200B2 (ja) 1998-01-23 1998-01-23 ワイヤボンディング用金合金線

Country Status (1)

Country Link
JP (1) JP3810200B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003023029A (ja) * 2001-07-09 2003-01-24 Tanaka Electronics Ind Co Ltd 半導体素子接続用金線及びその製造方法
JP4513440B2 (ja) * 2004-07-15 2010-07-28 住友ベークライト株式会社 半導体装置
JP4726206B2 (ja) * 2005-06-14 2011-07-20 田中電子工業株式会社 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性、高い耐樹脂流れ性および低い比抵抗を有するボンディングワイヤ用金合金線
JP4726205B2 (ja) * 2005-06-14 2011-07-20 田中電子工業株式会社 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線
JP4596467B2 (ja) * 2005-06-14 2010-12-08 田中電子工業株式会社 高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線

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