JPH10303235A5 - - Google Patents
Info
- Publication number
- JPH10303235A5 JPH10303235A5 JP1997108961A JP10896197A JPH10303235A5 JP H10303235 A5 JPH10303235 A5 JP H10303235A5 JP 1997108961 A JP1997108961 A JP 1997108961A JP 10896197 A JP10896197 A JP 10896197A JP H10303235 A5 JPH10303235 A5 JP H10303235A5
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- weight
- weight ppm
- alloy wire
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10896197A JP3669809B2 (ja) | 1997-04-25 | 1997-04-25 | 半導体素子ボンディング用金合金線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10896197A JP3669809B2 (ja) | 1997-04-25 | 1997-04-25 | 半導体素子ボンディング用金合金線 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10303235A JPH10303235A (ja) | 1998-11-13 |
| JPH10303235A5 true JPH10303235A5 (enExample) | 2005-03-17 |
| JP3669809B2 JP3669809B2 (ja) | 2005-07-13 |
Family
ID=14498053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10896197A Expired - Fee Related JP3669809B2 (ja) | 1997-04-25 | 1997-04-25 | 半導体素子ボンディング用金合金線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3669809B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010073501A (ko) * | 2000-01-17 | 2001-08-01 | 강도원 | 인성을 향상시킨 반도체 패키지용 본딩 와이어 합금 |
| JP3323185B2 (ja) * | 2000-06-19 | 2002-09-09 | 田中電子工業株式会社 | 半導体素子接続用金線 |
| JP4513440B2 (ja) * | 2004-07-15 | 2010-07-28 | 住友ベークライト株式会社 | 半導体装置 |
| WO2006057230A1 (ja) * | 2004-11-26 | 2006-06-01 | Tanaka Denshi Kogyo K.K. | 半導体素子用Auボンディングワイヤ |
| JP4726205B2 (ja) * | 2005-06-14 | 2011-07-20 | 田中電子工業株式会社 | 高い初期接合性、高い接合信頼性、圧着ボールの高い真円性、高い直進性および高い耐樹脂流れ性を有するボンディングワイヤ用金合金線 |
| KR100801444B1 (ko) * | 2006-05-30 | 2008-02-11 | 엠케이전자 주식회사 | 반도체 패키지용 금-은 합금계 와이어 |
| JP4150752B1 (ja) * | 2007-11-06 | 2008-09-17 | 田中電子工業株式会社 | ボンディングワイヤ |
-
1997
- 1997-04-25 JP JP10896197A patent/JP3669809B2/ja not_active Expired - Fee Related
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