JP3613724B2 - リン含有エポキシ樹脂組成物 - Google Patents
リン含有エポキシ樹脂組成物 Download PDFInfo
- Publication number
- JP3613724B2 JP3613724B2 JP24825698A JP24825698A JP3613724B2 JP 3613724 B2 JP3613724 B2 JP 3613724B2 JP 24825698 A JP24825698 A JP 24825698A JP 24825698 A JP24825698 A JP 24825698A JP 3613724 B2 JP3613724 B2 JP 3613724B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- phosphorus
- weight
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 110
- 229920000647 polyepoxide Polymers 0.000 title claims description 110
- 229910052698 phosphorus Inorganic materials 0.000 title claims description 39
- 239000011574 phosphorus Substances 0.000 title claims description 38
- 239000000203 mixture Substances 0.000 title claims description 28
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 22
- 229920003986 novolac Polymers 0.000 claims description 24
- -1 phosphorus compound Chemical class 0.000 claims description 18
- 239000003566 sealing material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 238000010125 resin casting Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 24
- 230000015572 biosynthetic process Effects 0.000 description 17
- 238000003786 synthesis reaction Methods 0.000 description 17
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 14
- 230000000704 physical effect Effects 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000002966 varnish Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004843 novolac epoxy resin Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 6
- 239000012778 molding material Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- BYLSIPUARIZAHZ-UHFFFAOYSA-N 2,4,6-tris(1-phenylethyl)phenol Chemical compound C=1C(C(C)C=2C=CC=CC=2)=C(O)C(C(C)C=2C=CC=CC=2)=CC=1C(C)C1=CC=CC=C1 BYLSIPUARIZAHZ-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- GELSOTNVVKOYAW-UHFFFAOYSA-N ethyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 GELSOTNVVKOYAW-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- CMLWFCUAXGSMBB-UHFFFAOYSA-N tris(2,6-dimethoxyphenyl)phosphane Chemical compound COC1=CC=CC(OC)=C1P(C=1C(=CC=CC=1OC)OC)C1=C(OC)C=CC=C1OC CMLWFCUAXGSMBB-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24825698A JP3613724B2 (ja) | 1997-09-09 | 1998-09-02 | リン含有エポキシ樹脂組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-244207 | 1997-09-09 | ||
| JP24420797 | 1997-09-09 | ||
| JP24825698A JP3613724B2 (ja) | 1997-09-09 | 1998-09-02 | リン含有エポキシ樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11166035A JPH11166035A (ja) | 1999-06-22 |
| JP3613724B2 true JP3613724B2 (ja) | 2005-01-26 |
| JPH11166035A5 JPH11166035A5 (enExample) | 2005-04-14 |
Family
ID=26536621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24825698A Expired - Lifetime JP3613724B2 (ja) | 1997-09-09 | 1998-09-02 | リン含有エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3613724B2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1975700A2 (en) | 2007-03-26 | 2008-10-01 | Nitto Denko Corporation | Method of manufacturing wiring circuit board |
| WO2010106698A1 (ja) | 2009-03-18 | 2010-09-23 | Dic株式会社 | リン原子含有フェノール類の製造方法、新規リン原子含有フェノール類、硬化性樹脂組成物、その硬化物、プリント配線基板、及び半導体封止材料 |
| CN102449018A (zh) * | 2009-06-01 | 2012-05-09 | 三菱丽阳株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
| KR20140128360A (ko) | 2012-03-29 | 2014-11-05 | 디아이씨 가부시끼가이샤 | 경화성 수지 조성물, 그 경화물, 프린트 배선 기판용 수지 조성물, 및 프린트 배선 기판 |
| WO2015083584A1 (ja) | 2013-12-04 | 2015-06-11 | 日東電工株式会社 | 光導波路および光・電気混載基板 |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3611435B2 (ja) * | 1997-10-22 | 2005-01-19 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
| JP4535214B2 (ja) * | 1999-10-08 | 2010-09-01 | 新日鐵化学株式会社 | 難燃性液状エポキシ樹脂組成物 |
| KR100721697B1 (ko) * | 1999-12-13 | 2007-05-28 | 다우 글로벌 테크놀로지스 인크. | 난연성 인 원소 함유 에폭시 수지 조성물 |
| JP4434427B2 (ja) * | 2000-04-27 | 2010-03-17 | 東都化成株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム |
| JP4530187B2 (ja) * | 2000-06-21 | 2010-08-25 | 新日鐵化学株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物 |
| US7109286B2 (en) * | 2000-06-29 | 2006-09-19 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| TW498084B (en) * | 2000-07-19 | 2002-08-11 | Chang Chun Plastics Co Ltd | Flame-retardant resin and flame retardant composition containing the same |
| JP2002047334A (ja) * | 2000-08-02 | 2002-02-12 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物及び電気積層板 |
| JP4955856B2 (ja) * | 2001-01-26 | 2012-06-20 | パナソニック株式会社 | リン含有エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、接着シート、積層板、多層板、塗工用リン含有エポキシ樹脂ワニス、リン含有エポキシ樹脂封止材、リン含有エポキシ樹脂注型材、含浸用リン含有エポキシ樹脂ワニス |
| KR100529577B1 (ko) * | 2001-11-22 | 2005-11-17 | 미쓰이 가가쿠 가부시키가이샤 | 감광성 수지조성물, 드라이필름 및 그것을 이용한 가공부품 |
| CN100384903C (zh) | 2002-05-29 | 2008-04-30 | 日本化学工业株式会社 | 含磷环氧树脂和树脂组合物及其制造方法,以及密封材料和层积板 |
| US8062750B2 (en) | 2004-11-30 | 2011-11-22 | Matsushita Electric Works, Ltd. | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board |
| JP4244975B2 (ja) * | 2005-08-26 | 2009-03-25 | パナソニック電工株式会社 | プリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板 |
| KR100804767B1 (ko) * | 2006-11-28 | 2008-02-19 | 마츠시다 덴코 가부시키가이샤 | 프리프레그용 에폭시 수지 조성물 및 프리프레그, 다층프린트 배선판 |
| JP5334373B2 (ja) * | 2007-03-05 | 2013-11-06 | 新日鉄住金化学株式会社 | 新規なリン含有エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及びその硬化物 |
| JP2008231126A (ja) * | 2007-03-16 | 2008-10-02 | Nan Ya Plastics Corp | 高ガラス転移温度の積層板用エポキシ樹脂ワニス組成物 |
| KR100882540B1 (ko) | 2007-12-31 | 2009-02-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
| JP5339146B2 (ja) * | 2009-07-13 | 2013-11-13 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、その硬化物、回路基板、ビルドアップ材料、及び半導体封止材料 |
| EP2690121B1 (en) | 2011-03-22 | 2020-06-10 | Mitsubishi Chemical Corporation | Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment |
| CN109293881B (zh) | 2012-06-15 | 2021-04-13 | 日铁化学材料株式会社 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
| KR102267524B1 (ko) | 2013-11-29 | 2021-06-18 | 시코쿠가세이고교가부시키가이샤 | 머캅토알킬글리콜우릴류와 그 용도 |
| JP6369892B2 (ja) * | 2014-04-23 | 2018-08-08 | 三光株式会社 | リン含有難燃性エポキシ樹脂 |
| KR102346197B1 (ko) | 2015-01-29 | 2021-12-30 | 가부시키가이샤 아데카 | 난연성 에폭시 수지 조성물, 그것을 사용하여 이루어지는 프리프레그 및 적층판 |
| CN112585189B (zh) | 2018-08-27 | 2023-08-01 | 日铁化学材料株式会社 | 环氧树脂组合物、预浸体、层叠板、电路基板用材料、硬化物及含磷环氧树脂的制造方法 |
| JP2020122034A (ja) | 2019-01-29 | 2020-08-13 | 日鉄ケミカル＆マテリアル株式会社 | エポキシ樹脂組成物及びその硬化物 |
| JP7387413B2 (ja) | 2019-12-04 | 2023-11-28 | 日鉄ケミカル＆マテリアル株式会社 | エポキシ樹脂組成物、それを使用した積層板及びプリント回路基板 |
| CN116875151A (zh) * | 2023-08-10 | 2023-10-13 | 江苏云湖新材料科技有限公司 | 一种电池包壳体用无卤阻燃环氧防火涂料及其制备方法 |
-
1998
- 1998-09-02 JP JP24825698A patent/JP3613724B2/ja not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1975700A2 (en) | 2007-03-26 | 2008-10-01 | Nitto Denko Corporation | Method of manufacturing wiring circuit board |
| WO2010106698A1 (ja) | 2009-03-18 | 2010-09-23 | Dic株式会社 | リン原子含有フェノール類の製造方法、新規リン原子含有フェノール類、硬化性樹脂組成物、その硬化物、プリント配線基板、及び半導体封止材料 |
| CN102449018A (zh) * | 2009-06-01 | 2012-05-09 | 三菱丽阳株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
| CN102449018B (zh) * | 2009-06-01 | 2014-04-09 | 三菱丽阳株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
| KR20140128360A (ko) | 2012-03-29 | 2014-11-05 | 디아이씨 가부시끼가이샤 | 경화성 수지 조성물, 그 경화물, 프린트 배선 기판용 수지 조성물, 및 프린트 배선 기판 |
| WO2015083584A1 (ja) | 2013-12-04 | 2015-06-11 | 日東電工株式会社 | 光導波路および光・電気混載基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11166035A (ja) | 1999-06-22 |
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