JP3532208B2 - 物品を薄膜コーティングするための方法および装置 - Google Patents
物品を薄膜コーティングするための方法および装置Info
- Publication number
- JP3532208B2 JP3532208B2 JP51285095A JP51285095A JP3532208B2 JP 3532208 B2 JP3532208 B2 JP 3532208B2 JP 51285095 A JP51285095 A JP 51285095A JP 51285095 A JP51285095 A JP 51285095A JP 3532208 B2 JP3532208 B2 JP 3532208B2
- Authority
- JP
- Japan
- Prior art keywords
- deposition
- crt
- article
- area
- exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 63
- 239000010409 thin film Substances 0.000 title claims description 20
- 238000009501 film coating Methods 0.000 title claims description 17
- 238000000151 deposition Methods 0.000 claims description 75
- 230000008021 deposition Effects 0.000 claims description 73
- 238000000576 coating method Methods 0.000 claims description 72
- 230000004888 barrier function Effects 0.000 claims description 69
- 239000011248 coating agent Substances 0.000 claims description 55
- 238000012545 processing Methods 0.000 claims description 32
- 239000000969 carrier Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 238000000427 thin-film deposition Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 241000255777 Lepidoptera Species 0.000 claims 1
- 239000007789 gas Substances 0.000 description 28
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000002955 isolation Methods 0.000 description 8
- 238000010943 off-gassing Methods 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 239000006117 anti-reflective coating Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 230000004313 glare Effects 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 210000005069 ears Anatomy 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000000313 electron-beam-induced deposition Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000007736 thin film deposition technique Methods 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/142,638 US5489369A (en) | 1993-10-25 | 1993-10-25 | Method and apparatus for thin film coating an article |
| US08/142,638 | 1993-10-25 | ||
| PCT/US1994/012380 WO1995012007A1 (en) | 1993-10-25 | 1994-10-24 | Method and apparatus for thin film coating an article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09504575A JPH09504575A (ja) | 1997-05-06 |
| JP3532208B2 true JP3532208B2 (ja) | 2004-05-31 |
Family
ID=22500689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51285095A Expired - Fee Related JP3532208B2 (ja) | 1993-10-25 | 1994-10-24 | 物品を薄膜コーティングするための方法および装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US5489369A (enExample) |
| JP (1) | JP3532208B2 (enExample) |
| KR (1) | KR100348838B1 (enExample) |
| CN (1) | CN1125189C (enExample) |
| AU (1) | AU1084695A (enExample) |
| TW (1) | TW289124B (enExample) |
| WO (1) | WO1995012007A1 (enExample) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962085A (en) * | 1991-02-25 | 1999-10-05 | Symetrix Corporation | Misted precursor deposition apparatus and method with improved mist and mist flow |
| US5489369A (en) * | 1993-10-25 | 1996-02-06 | Viratec Thin Films, Inc. | Method and apparatus for thin film coating an article |
| US5688328A (en) * | 1995-09-13 | 1997-11-18 | Chunghwa Picture Tubes, Ltd. | Apparatus for improved coating of a CRT display screen |
| US5772861A (en) * | 1995-10-16 | 1998-06-30 | Viratec Thin Films, Inc. | System for evaluating thin film coatings |
| GB9600210D0 (en) | 1996-01-05 | 1996-03-06 | Vanderstraeten E Bvba | Improved sputtering targets and method for the preparation thereof |
| WO1997039160A1 (en) * | 1996-04-18 | 1997-10-23 | Kabushiki Kaisha Toshiba | Method of producing a cathode-ray tube and apparatus therefor |
| EP0992605A3 (en) * | 1998-10-02 | 2002-11-13 | Sumitomo Special Metals Co., Ltd. | Support member, holder, process, and apparatus in the field of surface-treatment |
| US6365010B1 (en) | 1998-11-06 | 2002-04-02 | Scivac | Sputtering apparatus and process for high rate coatings |
| GB9916558D0 (en) * | 1999-07-14 | 1999-09-15 | Dormer Tools Sheffield Ltd | Method and means for drill production |
| KR20010087664A (ko) * | 2000-03-08 | 2001-09-21 | 손명호 | 전자파 차폐막 코팅방법 및 그 장치 |
| EA003148B1 (ru) * | 2000-07-05 | 2003-02-27 | Владимир Яковлевич ШИРИПОВ | Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку |
| US6587097B1 (en) | 2000-11-28 | 2003-07-01 | 3M Innovative Properties Co. | Display system |
| US6623662B2 (en) | 2001-05-23 | 2003-09-23 | Chunghwa Picture Tubes, Ltd. | Carbon black coating for CRT display screen with uniform light absorption |
| US6746530B2 (en) | 2001-08-02 | 2004-06-08 | Chunghwa Pictures Tubes, Ltd. | High contrast, moisture resistant antistatic/antireflective coating for CRT display screen |
| US6521346B1 (en) | 2001-09-27 | 2003-02-18 | Chunghwa Picture Tubes, Ltd. | Antistatic/antireflective coating for video display screen with improved refractivity |
| US6797108B2 (en) * | 2001-10-05 | 2004-09-28 | Applied Materials, Inc. | Apparatus and method for evenly flowing processing gas onto a semiconductor wafer |
| US6620252B2 (en) * | 2001-10-29 | 2003-09-16 | Thomson Licensing S.A. | Metallization module for cathode-ray tube (CRT) applications |
| US6764580B2 (en) * | 2001-11-15 | 2004-07-20 | Chungwa Picture Tubes, Ltd. | Application of multi-layer antistatic/antireflective coating to video display screen by sputtering |
| US6656331B2 (en) * | 2002-04-30 | 2003-12-02 | Chunghwa Picture Tubes, Ltd. | Application of antistatic/antireflective coating to a video display screen |
| EP1507887B1 (de) * | 2002-05-24 | 2008-07-09 | Schott Ag | Mehrplatz-beschichtungsvorrichtung und verfahren zur plasmabeschichtung |
| US7032287B1 (en) * | 2002-07-19 | 2006-04-25 | Nanometrics Incorporated | Edge grip chuck |
| DE10352144B8 (de) * | 2003-11-04 | 2008-11-13 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsanlage zum Beschichten von längserstreckten Substraten |
| DE10362259B4 (de) * | 2003-11-04 | 2011-03-17 | Von Ardenne Anlagentechnik Gmbh | Längserstreckte Vakuumanlage zur ein- oder beidseitigen Beschichtung flacher Substrate |
| CA2550331A1 (en) | 2003-12-22 | 2005-07-14 | Cardinal Cg Compagny | Graded photocatalytic coatings |
| DE102004008598B4 (de) * | 2004-02-21 | 2006-12-28 | Applied Films Gmbh & Co. Kg | Verfahren für den Betrieb einer Inline-Beschichtungsanlage |
| KR20050093230A (ko) * | 2004-03-18 | 2005-09-23 | 엘지.필립스 엘시디 주식회사 | 스퍼터링 장비 |
| WO2006017311A1 (en) | 2004-07-12 | 2006-02-16 | Cardinal Cg Company | Low-maintenance coatings |
| US8092660B2 (en) | 2004-12-03 | 2012-01-10 | Cardinal Cg Company | Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films |
| US7923114B2 (en) | 2004-12-03 | 2011-04-12 | Cardinal Cg Company | Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films |
| DE102005016405A1 (de) * | 2005-04-08 | 2006-10-12 | Von Ardenne Anlagentechnik Gmbh | Vorrichtung zur Vakuumbeschichtung von Substraten unterschiedlicher Größe |
| KR101229153B1 (ko) | 2005-07-18 | 2013-02-01 | 블라디미르 쉬리포브 | 기판에 코팅을 피복하기 위한 진공 클러스터 |
| WO2007067031A1 (en) * | 2005-12-07 | 2007-06-14 | Otb Group B.V. | System and method for coating products, and a product obtained with such a system and method |
| JP2009534563A (ja) | 2006-04-19 | 2009-09-24 | 日本板硝子株式会社 | 同等の単独の表面反射率を有する対向機能コーティング |
| US20080011599A1 (en) | 2006-07-12 | 2008-01-17 | Brabender Dennis M | Sputtering apparatus including novel target mounting and/or control |
| JP5474796B2 (ja) * | 2007-09-14 | 2014-04-16 | 日本板硝子株式会社 | 低保守コーティングおよび低保守コーティングの製造方法 |
| KR20110056392A (ko) * | 2008-08-25 | 2011-05-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 이동식 쉴드를 구비한 코팅 챔버 |
| US20100044213A1 (en) * | 2008-08-25 | 2010-02-25 | Applied Materials, Inc. | Coating chamber with a moveable shield |
| US9751254B2 (en) * | 2008-10-09 | 2017-09-05 | Bobst Manchester Ltd | Apparatus for treating substrates |
| DE102008053394A1 (de) * | 2008-10-27 | 2010-04-29 | Mtu Aero Engines Gmbh | Vorrichtung zum partiellen Abdecken einer Bauteilzone |
| JP5192993B2 (ja) * | 2008-11-13 | 2013-05-08 | 昭和電工株式会社 | 磁性層の形成方法 |
| CN101994097B (zh) * | 2009-08-25 | 2013-08-21 | 鸿富锦精密工业（深圳）有限公司 | 镀膜装置 |
| TWI564427B (zh) * | 2009-12-18 | 2017-01-01 | 財團法人工業技術研究院 | 聚對二甲苯薄膜的形成方法 |
| CN102330073B (zh) * | 2010-07-13 | 2014-07-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 薄膜加工设备的下极板及应用该下极板的等离子体加工设备 |
| DE102010056157A1 (de) * | 2010-12-28 | 2012-06-28 | Oerlikon Trading Ag, Trübbach | Halterung für Bohrkopfbeschichtung |
| US9525099B2 (en) | 2012-04-19 | 2016-12-20 | Intevac, Inc. | Dual-mask arrangement for solar cell fabrication |
| US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
| WO2013163622A1 (en) | 2012-04-26 | 2013-10-31 | Intevac, Inc. | System architecture for vacuum processing |
| JP6080027B2 (ja) * | 2012-11-15 | 2017-02-15 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | エッジ除外シールドを整備するための方法及びシステム |
| US20160002770A1 (en) * | 2013-02-25 | 2016-01-07 | Fabio PIERALISI | Apparatus with neighboring sputter cathodes and method of operation thereof |
| CZ305643B6 (cs) * | 2013-12-03 | 2016-01-20 | Bodycote Ht S.R.O. | Způsob izolace části povrchu součástky při její povrchové úpravě plynným médiem |
| SG11201700675UA (en) | 2014-08-05 | 2017-02-27 | Intevac Inc | Implant masking and alignment |
| US20180171466A1 (en) * | 2015-07-06 | 2018-06-21 | Applied Materials, Inc. | Carrier for supporting at least one substrate during a sputter deposition process, apparatus for sputter deposition on at least one substrate, and method for sputter deposition on at least one substrate |
| RU2653897C2 (ru) * | 2016-10-18 | 2018-05-15 | Публичное акционерное общество "Сатурн" (ПАО "Сатурн") | Устройство для напыления просветляющего покрытия фотопреобразователя |
| EP3541762B1 (en) | 2016-11-17 | 2022-03-02 | Cardinal CG Company | Static-dissipative coating technology |
| CN109913847A (zh) * | 2017-12-13 | 2019-06-21 | 湘潭宏大真空技术股份有限公司 | Low-e玻璃真空磁控溅射镀膜生产线 |
| CN109913848A (zh) * | 2017-12-13 | 2019-06-21 | 湘潭宏大真空技术股份有限公司 | 双银low-e玻璃真空镀膜溅射生产线 |
| CN114277353B (zh) * | 2018-09-17 | 2024-06-18 | 先进尼克斯有限公司 | 真空隔离的批处理系统 |
| KR20230033053A (ko) * | 2021-08-26 | 2023-03-08 | 삼성디스플레이 주식회사 | 스퍼터링 장치 |
| KR20230139894A (ko) * | 2022-03-25 | 2023-10-06 | 삼성디스플레이 주식회사 | 파티클 포집 장치 및 그것을 포함하는 증착 장치 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3945903A (en) | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Sputter-coating of glass sheets or other substrates |
| US4982695A (en) | 1989-04-20 | 1991-01-08 | North American Philips Corporation | Method and apparatus for controlling the thickness distribution of an interference filter |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2093699A (en) * | 1932-03-08 | 1937-09-21 | Farnsworth Television Inc | Cathode ray tube |
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| US3945911A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Cathodes for sputter-coating glass sheets or other substrates |
| FR2324755A1 (fr) * | 1975-09-19 | 1977-04-15 | Anvar | Dispositif de pulverisation cathodique de grande vitesse de depot |
| US4274936A (en) * | 1979-04-30 | 1981-06-23 | Advanced Coating Technology, Inc. | Vacuum deposition system and method |
| DE3306870A1 (de) * | 1983-02-26 | 1984-08-30 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung |
| EP0122092A3 (en) * | 1983-04-06 | 1985-07-10 | General Engineering Radcliffe Limited | Vacuum coating apparatus |
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-
1993
- 1993-10-25 US US08/142,638 patent/US5489369A/en not_active Expired - Fee Related
-
1994
- 1994-10-24 CN CN94194626A patent/CN1125189C/zh not_active Expired - Fee Related
- 1994-10-24 TW TW083109830A patent/TW289124B/zh active
- 1994-10-24 WO PCT/US1994/012380 patent/WO1995012007A1/en not_active Ceased
- 1994-10-24 JP JP51285095A patent/JP3532208B2/ja not_active Expired - Fee Related
- 1994-10-24 AU AU10846/95A patent/AU1084695A/en not_active Abandoned
- 1994-10-24 KR KR1019960702124A patent/KR100348838B1/ko not_active Expired - Fee Related
-
1995
- 1995-06-07 US US08/476,091 patent/US5620572A/en not_active Expired - Lifetime
- 1995-06-07 US US08/485,214 patent/US5688389A/en not_active Expired - Lifetime
-
1997
- 1997-11-13 US US08/970,177 patent/US6068738A/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3945903A (en) | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Sputter-coating of glass sheets or other substrates |
| US4982695A (en) | 1989-04-20 | 1991-01-08 | North American Philips Corporation | Method and apparatus for controlling the thickness distribution of an interference filter |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100348838B1 (ko) | 2003-01-06 |
| TW289124B (enExample) | 1996-10-21 |
| JPH09504575A (ja) | 1997-05-06 |
| WO1995012007A1 (en) | 1995-05-04 |
| US5688389A (en) | 1997-11-18 |
| AU1084695A (en) | 1995-05-22 |
| CN1139957A (zh) | 1997-01-08 |
| US6068738A (en) | 2000-05-30 |
| US5620572A (en) | 1997-04-15 |
| US5489369A (en) | 1996-02-06 |
| CN1125189C (zh) | 2003-10-22 |
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