KR100348838B1 - 제품에박막피복을제공하기위한장치및방법 - Google Patents

제품에박막피복을제공하기위한장치및방법 Download PDF

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Publication number
KR100348838B1
KR100348838B1 KR1019960702124A KR19960702124A KR100348838B1 KR 100348838 B1 KR100348838 B1 KR 100348838B1 KR 1019960702124 A KR1019960702124 A KR 1019960702124A KR 19960702124 A KR19960702124 A KR 19960702124A KR 100348838 B1 KR100348838 B1 KR 100348838B1
Authority
KR
South Korea
Prior art keywords
crt
zone
deposition
surface portion
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960702124A
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English (en)
Korean (ko)
Inventor
에릭 제이. 뵤나드
에릭 더블유. 컬맨
데브라 엠. 스테펜하겐
Original Assignee
비라텍 틴 필름스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 비라텍 틴 필름스, 인크. filed Critical 비라텍 틴 필름스, 인크.
Application granted granted Critical
Publication of KR100348838B1 publication Critical patent/KR100348838B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1019960702124A 1993-10-25 1994-10-24 제품에박막피복을제공하기위한장치및방법 Expired - Fee Related KR100348838B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8/142638 1993-10-25
US08/142,638 US5489369A (en) 1993-10-25 1993-10-25 Method and apparatus for thin film coating an article

Publications (1)

Publication Number Publication Date
KR100348838B1 true KR100348838B1 (ko) 2003-01-06

Family

ID=22500689

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960702124A Expired - Fee Related KR100348838B1 (ko) 1993-10-25 1994-10-24 제품에박막피복을제공하기위한장치및방법

Country Status (7)

Country Link
US (4) US5489369A (enExample)
JP (1) JP3532208B2 (enExample)
KR (1) KR100348838B1 (enExample)
CN (1) CN1125189C (enExample)
AU (1) AU1084695A (enExample)
TW (1) TW289124B (enExample)
WO (1) WO1995012007A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200032006A (ko) * 2018-09-17 2020-03-25 에이에스엠 넥스 인코포레이티드 진공 분리를 가지는 일괄 처리 시스템

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962085A (en) * 1991-02-25 1999-10-05 Symetrix Corporation Misted precursor deposition apparatus and method with improved mist and mist flow
US5489369A (en) * 1993-10-25 1996-02-06 Viratec Thin Films, Inc. Method and apparatus for thin film coating an article
US5688328A (en) * 1995-09-13 1997-11-18 Chunghwa Picture Tubes, Ltd. Apparatus for improved coating of a CRT display screen
US5772861A (en) * 1995-10-16 1998-06-30 Viratec Thin Films, Inc. System for evaluating thin film coatings
GB9600210D0 (en) 1996-01-05 1996-03-06 Vanderstraeten E Bvba Improved sputtering targets and method for the preparation thereof
WO1997039160A1 (en) * 1996-04-18 1997-10-23 Kabushiki Kaisha Toshiba Method of producing a cathode-ray tube and apparatus therefor
EP0992605A3 (en) * 1998-10-02 2002-11-13 Sumitomo Special Metals Co., Ltd. Support member, holder, process, and apparatus in the field of surface-treatment
US6365010B1 (en) 1998-11-06 2002-04-02 Scivac Sputtering apparatus and process for high rate coatings
GB9916558D0 (en) * 1999-07-14 1999-09-15 Dormer Tools Sheffield Ltd Method and means for drill production
KR20010087664A (ko) * 2000-03-08 2001-09-21 손명호 전자파 차폐막 코팅방법 및 그 장치
EA003148B1 (ru) * 2000-07-05 2003-02-27 Владимир Яковлевич ШИРИПОВ Вакуумный модуль (его варианты) и система модулей для нанесения покрытий на подложку
US6587097B1 (en) 2000-11-28 2003-07-01 3M Innovative Properties Co. Display system
US6623662B2 (en) 2001-05-23 2003-09-23 Chunghwa Picture Tubes, Ltd. Carbon black coating for CRT display screen with uniform light absorption
US6746530B2 (en) 2001-08-02 2004-06-08 Chunghwa Pictures Tubes, Ltd. High contrast, moisture resistant antistatic/antireflective coating for CRT display screen
US6521346B1 (en) 2001-09-27 2003-02-18 Chunghwa Picture Tubes, Ltd. Antistatic/antireflective coating for video display screen with improved refractivity
US6797108B2 (en) * 2001-10-05 2004-09-28 Applied Materials, Inc. Apparatus and method for evenly flowing processing gas onto a semiconductor wafer
US6620252B2 (en) * 2001-10-29 2003-09-16 Thomson Licensing S.A. Metallization module for cathode-ray tube (CRT) applications
US6764580B2 (en) * 2001-11-15 2004-07-20 Chungwa Picture Tubes, Ltd. Application of multi-layer antistatic/antireflective coating to video display screen by sputtering
US6656331B2 (en) * 2002-04-30 2003-12-02 Chunghwa Picture Tubes, Ltd. Application of antistatic/antireflective coating to a video display screen
CN100412230C (zh) * 2002-05-24 2008-08-20 肖特股份公司 用于等离子涂层的多位涂层装置和方法
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
DE10352143B4 (de) * 2003-11-04 2009-06-25 Von Ardenne Anlagentechnik Gmbh Längserstreckte Vakuumanlage zur ein- oder beidseitigen Beschichtung flacher Substrate
DE10352144B8 (de) * 2003-11-04 2008-11-13 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage zum Beschichten von längserstreckten Substraten
CA2550331A1 (en) 2003-12-22 2005-07-14 Cardinal Cg Compagny Graded photocatalytic coatings
DE102004008598B4 (de) * 2004-02-21 2006-12-28 Applied Films Gmbh & Co. Kg Verfahren für den Betrieb einer Inline-Beschichtungsanlage
KR20050093230A (ko) * 2004-03-18 2005-09-23 엘지.필립스 엘시디 주식회사 스퍼터링 장비
WO2006017349A1 (en) 2004-07-12 2006-02-16 Cardinal Cg Company Low-maintenance coatings
US8092660B2 (en) 2004-12-03 2012-01-10 Cardinal Cg Company Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films
US7923114B2 (en) 2004-12-03 2011-04-12 Cardinal Cg Company Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films
DE102005016405A1 (de) * 2005-04-08 2006-10-12 Von Ardenne Anlagentechnik Gmbh Vorrichtung zur Vakuumbeschichtung von Substraten unterschiedlicher Größe
KR101229153B1 (ko) 2005-07-18 2013-02-01 블라디미르 쉬리포브 기판에 코팅을 피복하기 위한 진공 클러스터
WO2007067031A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating products, and a product obtained with such a system and method
JP2009534563A (ja) 2006-04-19 2009-09-24 日本板硝子株式会社 同等の単独の表面反射率を有する対向機能コーティング
US20080011599A1 (en) 2006-07-12 2008-01-17 Brabender Dennis M Sputtering apparatus including novel target mounting and/or control
KR101512166B1 (ko) * 2007-09-14 2015-04-14 카디날 씨지 컴퍼니 관리가 용이한 코팅 기술
KR20110056392A (ko) * 2008-08-25 2011-05-27 어플라이드 머티어리얼스, 인코포레이티드 이동식 쉴드를 구비한 코팅 챔버
US20100044213A1 (en) * 2008-08-25 2010-02-25 Applied Materials, Inc. Coating chamber with a moveable shield
US9751254B2 (en) * 2008-10-09 2017-09-05 Bobst Manchester Ltd Apparatus for treating substrates
DE102008053394A1 (de) * 2008-10-27 2010-04-29 Mtu Aero Engines Gmbh Vorrichtung zum partiellen Abdecken einer Bauteilzone
JP5192993B2 (ja) * 2008-11-13 2013-05-08 昭和電工株式会社 磁性層の形成方法
CN101994097B (zh) * 2009-08-25 2013-08-21 鸿富锦精密工业（深圳）有限公司 镀膜装置
TWI564427B (zh) * 2009-12-18 2017-01-01 財團法人工業技術研究院 聚對二甲苯薄膜的形成方法
CN102330073B (zh) * 2010-07-13 2014-07-16 北京北方微电子基地设备工艺研究中心有限责任公司 薄膜加工设备的下极板及应用该下极板的等离子体加工设备
DE102010056157A1 (de) * 2010-12-28 2012-06-28 Oerlikon Trading Ag, Trübbach Halterung für Bohrkopfbeschichtung
US9525099B2 (en) 2012-04-19 2016-12-20 Intevac, Inc. Dual-mask arrangement for solar cell fabrication
PT2852469T (pt) 2012-04-26 2019-07-31 Intevac Inc Arquitetura de sistema para processamento sob vácuo
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
WO2014075729A1 (en) 2012-11-15 2014-05-22 Applied Materials, Inc. Method and system for maintaining an edge exclusion shield
CN105026611B (zh) * 2013-02-25 2018-11-27 应用材料公司 具有相邻溅射阴极的装置及其操作方法
CZ305643B6 (cs) * 2013-12-03 2016-01-20 Bodycote Ht S.R.O. Způsob izolace části povrchu součástky při její povrchové úpravě plynným médiem
JP6607923B2 (ja) 2014-08-05 2019-11-20 インテヴァック インコーポレイテッド 注入マスク及びアライメント
WO2017005290A1 (en) * 2015-07-06 2017-01-12 Applied Materials, Inc. Carrier for supporting at least one substrate during a sputter deposition process, apparatus for sputter deposition on at least one substrate, and method for sputter deposition on at least one substrate
RU2653897C2 (ru) * 2016-10-18 2018-05-15 Публичное акционерное общество "Сатурн" (ПАО "Сатурн") Устройство для напыления просветляющего покрытия фотопреобразователя
WO2018093985A1 (en) 2016-11-17 2018-05-24 Cardinal Cg Company Static-dissipative coating technology
CN109913848A (zh) * 2017-12-13 2019-06-21 湘潭宏大真空技术股份有限公司 双银low-e玻璃真空镀膜溅射生产线
CN109913847A (zh) * 2017-12-13 2019-06-21 湘潭宏大真空技术股份有限公司 Low-e玻璃真空磁控溅射镀膜生产线
KR20230033053A (ko) * 2021-08-26 2023-03-08 삼성디스플레이 주식회사 스퍼터링 장치
KR20230139894A (ko) * 2022-03-25 2023-10-06 삼성디스플레이 주식회사 파티클 포집 장치 및 그것을 포함하는 증착 장치

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2093699A (en) * 1932-03-08 1937-09-21 Farnsworth Television Inc Cathode ray tube
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere
US3679451A (en) * 1970-02-13 1972-07-25 Marks Polarized Corp Nonglare coating for surfaces of tv tubes and the like and such coated surfaces
US3940511A (en) * 1973-06-25 1976-02-24 Rca Corporation Method for preparing haze-resistant lithium-silicate glare-reducing coating
US3945911A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Cathodes for sputter-coating glass sheets or other substrates
US3945903A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Sputter-coating of glass sheets or other substrates
FR2324755A1 (fr) * 1975-09-19 1977-04-15 Anvar Dispositif de pulverisation cathodique de grande vitesse de depot
US4274936A (en) * 1979-04-30 1981-06-23 Advanced Coating Technology, Inc. Vacuum deposition system and method
DE3306870A1 (de) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung
EP0122092A3 (en) * 1983-04-06 1985-07-10 General Engineering Radcliffe Limited Vacuum coating apparatus
US4533449A (en) * 1984-04-16 1985-08-06 The Perkin-Elmer Corporation Rapid surface figuring by selective deposition
US4915057A (en) * 1985-10-23 1990-04-10 Gte Products Corporation Apparatus and method for registration of shadow masked thin-film patterns
NO872943L (no) * 1986-07-21 1988-01-22 Mitsui Toatsu Chemicals Filter for katodestraaleroerskjerm.
JP2590101B2 (ja) * 1987-05-15 1997-03-12 株式会社日立製作所 陰極線管の製造方法および装置
JPH01146627A (ja) * 1987-12-02 1989-06-08 Toshiba Corp ブラウン管用パレット
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
US5209690A (en) * 1988-09-08 1993-05-11 U.S. Philips Corporation Method of vapor depositing an interference filter layer on the inside of a display window, a display window, a projection cathode ray tube and a projection television apparatus
US5122709A (en) * 1989-03-20 1992-06-16 Hitachi, Ltd. Antistatic cathode ray tube with lobe like projections and high gloss and hardness
US4982695A (en) * 1989-04-20 1991-01-08 North American Philips Corporation Method and apparatus for controlling the thickness distribution of an interference filter
JP2948842B2 (ja) * 1989-11-24 1999-09-13 日本真空技術株式会社 インライン型ｃｖｄ装置
JPH03196451A (ja) * 1989-12-26 1991-08-27 Pioneer Electron Corp 表示装置用フィルタおよびその製造方法
DE4036339C2 (de) * 1990-11-15 1993-10-21 Leybold Ag Vorrichtung für den Transport von Substraten
JPH05132770A (ja) * 1991-11-11 1993-05-28 Canon Inc スパツタ装置
US5382126A (en) * 1992-03-30 1995-01-17 Leybold Ag Multichamber coating apparatus
US5489369A (en) * 1993-10-25 1996-02-06 Viratec Thin Films, Inc. Method and apparatus for thin film coating an article

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200032006A (ko) * 2018-09-17 2020-03-25 에이에스엠 넥스 인코포레이티드 진공 분리를 가지는 일괄 처리 시스템
KR102335300B1 (ko) 2018-09-17 2021-12-06 에이에스엠 넥스 인코포레이티드 진공 분리를 가지는 일괄 처리 시스템

Also Published As

Publication number Publication date
AU1084695A (en) 1995-05-22
US5688389A (en) 1997-11-18
US5489369A (en) 1996-02-06
TW289124B (enExample) 1996-10-21
US5620572A (en) 1997-04-15
JPH09504575A (ja) 1997-05-06
JP3532208B2 (ja) 2004-05-31
WO1995012007A1 (en) 1995-05-04
CN1125189C (zh) 2003-10-22
US6068738A (en) 2000-05-30
CN1139957A (zh) 1997-01-08

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