JP3226814U - 感光被膜及び感光被膜製品 - Google Patents
感光被膜及び感光被膜製品 Download PDFInfo
- Publication number
- JP3226814U JP3226814U JP2018600029U JP2018600029U JP3226814U JP 3226814 U JP3226814 U JP 3226814U JP 2018600029 U JP2018600029 U JP 2018600029U JP 2018600029 U JP2018600029 U JP 2018600029U JP 3226814 U JP3226814 U JP 3226814U
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- film
- photosensitive adhesive
- carrier film
- pigment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 30
- 239000011248 coating agent Substances 0.000 title claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 66
- 230000001681 protective effect Effects 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims description 53
- 230000001070 adhesive effect Effects 0.000 claims description 53
- 239000003795 chemical substances by application Substances 0.000 claims description 52
- 239000004925 Acrylic resin Substances 0.000 claims description 49
- 229920000178 Acrylic resin Polymers 0.000 claims description 49
- 239000010410 layer Substances 0.000 claims description 45
- 239000003085 diluting agent Substances 0.000 claims description 42
- 239000000945 filler Substances 0.000 claims description 40
- 229920006015 heat resistant resin Polymers 0.000 claims description 40
- 239000000049 pigment Substances 0.000 claims description 40
- 238000000498 ball milling Methods 0.000 claims description 37
- 239000003504 photosensitizing agent Substances 0.000 claims description 33
- 229920005575 poly(amic acid) Polymers 0.000 claims description 27
- 238000003756 stirring Methods 0.000 claims description 23
- 238000003801 milling Methods 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 229920006254 polymer film Polymers 0.000 claims description 12
- 239000002518 antifoaming agent Substances 0.000 claims description 9
- 239000001023 inorganic pigment Substances 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 9
- 238000002834 transmittance Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 6
- 150000004985 diamines Chemical class 0.000 claims description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 230000000379 polymerizing effect Effects 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 230000003254 anti-foaming effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 38
- 239000002585 base Substances 0.000 description 33
- 239000000976 ink Substances 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000000047 product Substances 0.000 description 9
- 230000032683 aging Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- -1 photoinitiator Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 241000951471 Citrus junos Species 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 241000482268 Zea mays subsp. mays Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710561448.4A CN107172804B (zh) | 2017-07-11 | 2017-07-11 | 一种感光覆盖膜及产品 |
| CN201710561448.4 | 2017-07-11 | ||
| PCT/CN2017/108903 WO2019010871A1 (zh) | 2017-07-11 | 2017-11-01 | 一种感光覆盖膜、其制备方法以及感光覆盖膜产品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3226814U true JP3226814U (ja) | 2020-07-27 |
Family
ID=59823657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018600029U Expired - Fee Related JP3226814U (ja) | 2017-07-11 | 2017-11-01 | 感光被膜及び感光被膜製品 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3226814U (zh) |
| CN (1) | CN107172804B (zh) |
| WO (1) | WO2019010871A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021006273A1 (de) | 2021-12-21 | 2023-06-22 | Lohmann Gmbh & Co. Kg | Indikatormischung |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172804B (zh) * | 2017-07-11 | 2023-12-26 | 昆山倬跃蓝天电子科技有限公司 | 一种感光覆盖膜及产品 |
| CN107360667A (zh) * | 2017-07-11 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | 一种感光覆盖膜及其制备方法 |
| CN108463060B (zh) * | 2018-02-28 | 2020-11-24 | 苏州城邦达益材料科技有限公司 | 感光覆盖膜的制备方法及感光覆盖膜 |
| CN108470687A (zh) * | 2018-03-22 | 2018-08-31 | 江西芯创光电有限公司 | 一种覆膜制板方法 |
| CN113604164B (zh) * | 2021-08-04 | 2023-01-31 | 苏州城邦达益材料科技有限公司 | 用于MiniLED的FPC感光覆盖膜 |
| CN115894083B (zh) * | 2022-07-29 | 2024-04-09 | 广东环波新材料有限责任公司 | 一种负性感光型黑色电子器件的制备方法和应用 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3808212B2 (ja) * | 1998-07-31 | 2006-08-09 | 日立化成工業株式会社 | 転写フィルム及び拡散反射板の製造法 |
| AU2001284499A1 (en) * | 2000-09-11 | 2002-03-26 | Showa Denko K K | Photosensitive composition, cured article thereof, and printed circuit board using the same |
| CN101836162B (zh) * | 2007-10-25 | 2012-11-14 | 可隆工业株式会社 | 薄膜型转印材料 |
| CN104710871B (zh) * | 2014-05-28 | 2017-08-29 | 广东丹邦科技有限公司 | Fpc用碱显影感光阻焊油墨、制备方法、用途及产品 |
| JP5882510B2 (ja) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
| CN204659111U (zh) * | 2015-03-27 | 2015-09-23 | 甄凯军 | 一种新型感光式阻焊干膜 |
| CN205061955U (zh) * | 2015-07-16 | 2016-03-02 | 新纶科技（常州）有限公司 | 一种底片保护膜 |
| CN105388703A (zh) * | 2015-12-10 | 2016-03-09 | 苏州城邦达力材料科技有限公司 | 一种用于制备感光性覆盖膜的感光组合物及fpc用感光性覆盖膜的制备方法和应用方法 |
| CN205439460U (zh) * | 2016-04-07 | 2016-08-10 | 湖北奥马电子科技有限公司 | 一种印刷线路板用白色覆盖膜 |
| CN207099425U (zh) * | 2017-07-11 | 2018-03-13 | 苏州城邦达力材料科技有限公司 | 一种感光覆盖膜及产品 |
| CN107172804B (zh) * | 2017-07-11 | 2023-12-26 | 昆山倬跃蓝天电子科技有限公司 | 一种感光覆盖膜及产品 |
-
2017
- 2017-07-11 CN CN201710561448.4A patent/CN107172804B/zh active Active
- 2017-11-01 WO PCT/CN2017/108903 patent/WO2019010871A1/zh active Application Filing
- 2017-11-01 JP JP2018600029U patent/JP3226814U/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021006273A1 (de) | 2021-12-21 | 2023-06-22 | Lohmann Gmbh & Co. Kg | Indikatormischung |
| DE102021006273B4 (de) | 2021-12-21 | 2024-06-13 | Lohmann Gmbh & Co. Kg | Indikatormischung |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019010871A1 (zh) | 2019-01-17 |
| CN107172804A (zh) | 2017-09-15 |
| CN107172804B (zh) | 2023-12-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180404 |
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| R150 | Certificate of patent or registration of utility model |
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| LAPS | Cancellation because of no payment of annual fees |