JP2016141015A - 両面金属張積層板及びその製造方法 - Google Patents
両面金属張積層板及びその製造方法 Download PDFInfo
- Publication number
- JP2016141015A JP2016141015A JP2015017684A JP2015017684A JP2016141015A JP 2016141015 A JP2016141015 A JP 2016141015A JP 2015017684 A JP2015017684 A JP 2015017684A JP 2015017684 A JP2015017684 A JP 2015017684A JP 2016141015 A JP2016141015 A JP 2016141015A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- resin
- double
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000010410 layer Substances 0.000 claims abstract description 310
- 229910052751 metal Inorganic materials 0.000 claims abstract description 184
- 239000002184 metal Substances 0.000 claims abstract description 184
- 229920005989 resin Polymers 0.000 claims abstract description 145
- 239000011347 resin Substances 0.000 claims abstract description 145
- 239000004962 Polyamide-imide Substances 0.000 claims abstract description 45
- 229920002312 polyamide-imide Polymers 0.000 claims abstract description 45
- 239000002356 single layer Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims description 102
- 239000000203 mixture Substances 0.000 claims description 68
- 238000010438 heat treatment Methods 0.000 claims description 61
- 239000007788 liquid Substances 0.000 claims description 59
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 21
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 19
- 239000002904 solvent Substances 0.000 claims description 19
- 230000009477 glass transition Effects 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 claims description 3
- GSXOWIRCKMSAQK-UHFFFAOYSA-N CC(C)(CC(CC)C)C.C1(C=CC(N1)=O)=O Chemical compound CC(C)(CC(CC)C)C.C1(C=CC(N1)=O)=O GSXOWIRCKMSAQK-UHFFFAOYSA-N 0.000 claims 1
- 239000000470 constituent Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 239000011162 core material Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000000377 silicon dioxide Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical group C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000007607 die coating method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920006259 thermoplastic polyimide Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000001341 alkaline earth metal compounds Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000004305 biphenyl Chemical group 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
無水トリメリット酸(ナカライテスク株式会社製)192g、4,4’−ジイソシアナ−ト−3,3’−ジメチルビフェニル250.8g、2,4―ジイソシアン酸トリレン8.7g、ジアザビシクロウンデセン(サンアプロ株式会社製)1g、及びN,N−ジメチルアセトアミド(DMAC、ナカライテスク株式会社製)2558.5gを配合することで、ポリマー濃度15質量%の混合物を得た。この混合物を加熱することで1時間かけて100℃まで昇温させ、続いて混合物を100℃のまま6時間維持することで、反応を進行させた。
実施例1において、ポリアミドイミド樹脂を合成するための無水トリメリット酸、4,4’−ジイソシアナ−ト−3,3’−ジメチルビフェニル、及び2,4―ジイソシアン酸トリレンの配合モル比、液状組成物の組成、一次加熱及び二次加熱における加熱温度を、後掲の表に示すように変更した。
第一の金属箔として、厚み12μmであり、Rz=1μmの面を備える銅箔を用意した。この第一の金属箔におけるRz=1μmである面上に、実施例1の場合と同じ組成の液状組成物をコンマコータで塗布し、続いてこの液状組成物に200℃で4分間加熱してから、250℃で10分間加熱した。これにより、第一の金属箔上に厚み10μmの第一の樹脂層を形成した。
実施例1において、第一の樹脂層を形成するための一次加熱の条件を180℃、4分間とし、二次加熱は行わなかった。第二の樹脂層を形成するための一次加熱の条件も180℃、4分間とし、二次加熱は行わなかった。
実施例1において、第一の樹脂層を形成するための一次加熱の条件を200℃、4分間とし、二次加熱の条件を350℃、10分間とした。第二の樹脂層を形成するための一次加熱の条件を200℃、4分間とし、二次加熱の条件を350℃、10分間とした。
熱可塑性ポリイミドワニス(新日本理化株式会社製、品番PN−20)をN−メチル−2−ピロリドンで2倍に希釈することで、液状組成物を得た。
比較例3において、第一の樹脂層及び第二の樹脂層を形成するための一次加熱の条件を200℃、2分として、二次加熱の条件を220℃、15分とした。
(1)密着性評価
両面金属張積層板における銅箔を90°方向に引き剥がしたときの引き剥がし強度を測定した。
両面金属張積層板を288℃の半田浴に浸漬してから、両面金属張積層板にふくれ、はがれ等の外観異常が発生するまでに要した時間を計測した。この時間が1分未満である場合を「C]、1分以上2分未満である場合を「B」、2分以上である場合を「A」と評価した。
JIS C6471 7.5に従って、両面金属張積層板にエッチング処理を施すことで試料を作製し、この試料の電気容量を測定した。
両面金属張積層板における両面の銅箔をエッチングにより除去してから、絶縁層のガラス転移点、及びガラス転移点における絶縁層の弾性率を、動的粘弾性測定装置(エスアイアイ・ナノテクノロジー株式会社製)を用いて測定した。尚、動的粘弾性測定装置で得られたtanδのピークをガラス転移点とした。
21 第一の金属層
22 第二の金属層
3 絶縁層
41 第一の金属箔
42 第二の金属箔
5 樹脂層
51 第一の樹脂層
52 第二の樹脂層
Claims (11)
- 第一の金属層と、第二の金属層と、前記第一の金属層と前記第二の金属層との間に介在すると共に前記第一の金属層及び前記第二の金属層の各々に直接接する絶縁層とを備え、
前記絶縁層は、下記構造式(1)に示す第一の構成単位と下記構造式(2)に示す第二の構成単位とのうち少なくとも一方を備えるポリアミドイミド樹脂を含有する単一の層である
両面金属張積層板。
- 前記ポリアミドイミド樹脂は、前記第一の構成単位と前記第二の構成単位とを共に備え、前記第一の構成単位と前記第二の構成単位との合計に対して前記第二の構成単位が5〜35モル%の範囲内である
請求項1に記載の両面金属張積層板。 - 前記絶縁層は、更にビスマレイミドを含有する
請求項1又は2に記載の両面金属張積層板。 - 前記ポリアミドイミド樹脂に対して前記ビスマレイミドは3〜30質量%の範囲内である
請求項3に記載の両面金属張積層板。 - 前記ビスマレイミドは、4,4’−ジフェニルメタンビスマレイミド、ビスフェノールAジフェニルエーテルビスマレイミド、3,3’−ジメチル−5,5’−ジエチル−4,4’−ジフェニルメタンビスマレイミド、及び1,6’−ビスマレイミド−(2,2,4−トリメチル)ヘキサンからなる群から選択される一種以上の成分を含有する
請求項3又は4に記載の両面金属張積層板。 - 前記絶縁層のガラス転移点が300〜350℃の範囲内であり、前記絶縁層の前記ガラス転移点における弾性率が0.1〜1.0GPaの範囲内である
請求項1乃至5のいずれか一項に記載の両面金属張積層板。 - 0.2nF/cm2以上の電気容量を有する
請求項1乃至6のいずれか一項に記載の両面金属張積層板。 - 第一の金属箔の一面に前記ポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから200℃以上300℃未満の範囲内の最高温度で加熱することで、樹脂層を形成し、
前記樹脂層と第二の金属箔とを重ねた状態で、前記樹脂層を300℃以上350℃以下の範囲内の温度で加熱することで、前記絶縁層を形成することにより製造される
請求項1乃至7のいずれか一項に記載の両面金属張積層板。 - 第一の金属箔の一面に前記ポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから200℃以上300℃未満の範囲内の最高温度で加熱することで、第一の樹脂層を形成し、
第二の金属箔の一面に前記ポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから200℃以上300℃未満の範囲内の最高温度で加熱することで、第二の樹脂層を形成し、
前記第一の樹脂層と前記第二の樹脂層とを重ねた状態で、前記第一の樹脂層及び前記第二の樹脂層を300℃以上350℃以下の範囲内の最高温度で加熱することで、前記絶縁層を形成することにより製造される
請求項1乃至7のいずれか一項に記載の両面金属張積層板。 - 第一の金属箔の一面に下記構造式(1)に示す第一の構成単位と下記構造式(2)に示す第二の構成単位とのうち少なくとも一方を備えるポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから200℃以上300℃未満の範囲内の最高温度で加熱することで、前記第一の金属箔上に樹脂層を形成し、
前記樹脂層と第二の金属箔とを重ねた状態で、前記樹脂層を300℃以上350℃以下の範囲内の最高温度で加熱することで、絶縁層を形成することを含む
両面金属張積層板の製造方法。
- 第一の金属箔の一面に下記構造式(1)に示す第一の構成単位と下記構造式(2)に示す第二の構成単位とのうち少なくとも一方を備えるポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから、200℃以上300℃未満の範囲内の最高温度で加熱することで、前記第一の金属箔上に第一の樹脂層を形成し、
第二の金属箔の一面に下記構造式(1)に示す第一の構成単位と下記構造式(2)に示す第二の構成単位とのうち少なくとも一方を備えるポリアミドイミド樹脂及び溶剤を含有する液状組成物を塗布してから200℃以上300℃未満の範囲内の最高温度で加熱することで、前記第二の金属箔上に第二の樹脂層を形成し、
前記第一の樹脂層と前記第二の樹脂層とを重ねた状態で、前記第一の樹脂層及び前記第二の樹脂層を300℃以上350℃以下の範囲内の最高温度で加熱することで、絶縁層を形成することを含む
両面金属張積層板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015017684A JP2016141015A (ja) | 2015-01-30 | 2015-01-30 | 両面金属張積層板及びその製造方法 |
PCT/JP2016/000419 WO2016121392A1 (ja) | 2015-01-30 | 2016-01-28 | 両面金属張積層板及びその製造方法 |
CN201680005891.7A CN107107558A (zh) | 2015-01-30 | 2016-01-28 | 双面覆金属层叠板及其制造方法 |
US15/537,552 US20180141311A1 (en) | 2015-01-30 | 2016-01-28 | Double-sided metal-clad laminate board and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015017684A JP2016141015A (ja) | 2015-01-30 | 2015-01-30 | 両面金属張積層板及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016141015A true JP2016141015A (ja) | 2016-08-08 |
Family
ID=56543014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015017684A Pending JP2016141015A (ja) | 2015-01-30 | 2015-01-30 | 両面金属張積層板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20180141311A1 (ja) |
JP (1) | JP2016141015A (ja) |
CN (1) | CN107107558A (ja) |
WO (1) | WO2016121392A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201810064PA (en) * | 2016-05-18 | 2018-12-28 | Isola Usa Corp | Method of manufacturing circuit boards |
US11419213B2 (en) * | 2019-03-26 | 2022-08-16 | Western Digital Technologies, Inc. | Multilayer flex circuit with non-plated outer metal layer |
CN110054985B (zh) * | 2019-04-25 | 2021-07-09 | 住井科技(深圳)有限公司 | 自润滑聚酰胺酰亚胺清漆、绝缘皮膜、绝缘电线、线圈及电动机 |
GB2619148A (en) * | 2022-03-29 | 2023-11-29 | Merck Patent Gmbh | Dielectric materials based on reversed imide-extended bismaleimides |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013077397A1 (ja) * | 2011-11-22 | 2013-05-30 | パナソニック株式会社 | フレキシブル金属張基材、フレキシブル金属張基材の製造方法、プリント配線板、多層フレキシブルプリント配線板、及びフレックスリジッドプリント配線板 |
WO2014171345A1 (ja) * | 2013-04-16 | 2014-10-23 | 東洋紡株式会社 | 金属箔積層体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03133634A (ja) * | 1989-10-19 | 1991-06-06 | Toyobo Co Ltd | 耐熱性積層体およびその製法 |
JP4560697B2 (ja) * | 1999-08-04 | 2010-10-13 | 東洋紡績株式会社 | フレキシブル金属積層体及びその製造方法 |
JP4640409B2 (ja) * | 2003-09-01 | 2011-03-02 | 東洋紡績株式会社 | 金属張積層体 |
KR101441990B1 (ko) * | 2006-10-04 | 2014-09-18 | 히타치가세이가부시끼가이샤 | 폴리아미드이미드 수지, 접착제, 플렉시블 기판 재료, 플렉시블 적층판 및 플렉시블 인쇄배선판 |
JP6041204B2 (ja) * | 2012-11-22 | 2016-12-07 | パナソニックIpマネジメント株式会社 | フレキシブルプリント配線板製造用基材、フレキシブルプリント配線板、及びフレックス・リジッドプリント配線板 |
JP2014150133A (ja) * | 2013-01-31 | 2014-08-21 | Panasonic Corp | 樹脂付き金属箔、プリント配線板、及びプリント配線板の製造方法 |
-
2015
- 2015-01-30 JP JP2015017684A patent/JP2016141015A/ja active Pending
-
2016
- 2016-01-28 WO PCT/JP2016/000419 patent/WO2016121392A1/ja active Application Filing
- 2016-01-28 US US15/537,552 patent/US20180141311A1/en not_active Abandoned
- 2016-01-28 CN CN201680005891.7A patent/CN107107558A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013077397A1 (ja) * | 2011-11-22 | 2013-05-30 | パナソニック株式会社 | フレキシブル金属張基材、フレキシブル金属張基材の製造方法、プリント配線板、多層フレキシブルプリント配線板、及びフレックスリジッドプリント配線板 |
WO2014171345A1 (ja) * | 2013-04-16 | 2014-10-23 | 東洋紡株式会社 | 金属箔積層体 |
Also Published As
Publication number | Publication date |
---|---|
US20180141311A1 (en) | 2018-05-24 |
WO2016121392A1 (ja) | 2016-08-04 |
CN107107558A (zh) | 2017-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI777950B (zh) | 聚醯亞胺、聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂之銅箔、覆銅積層板及印刷線路板、以及多層線路板及其製造方法 | |
TWI754668B (zh) | 可撓性印刷線路板用覆銅積層板及可撓性印刷線路板 | |
JP6593649B2 (ja) | 接着剤組成物、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、フレキシブル銅張積層板、プリント配線板、フレキシブルプリント配線板、多層配線板、プリント回路板、及びフレキシブルプリント回路板 | |
TWI795394B (zh) | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 | |
JP5524475B2 (ja) | 2層両面フレキシブル金属積層板及びその製造方法 | |
TWI774674B (zh) | 接著薄膜、樹脂組成物、預浸體、印刷配線板及半導體裝置 | |
US20040176526A1 (en) | Resin composition | |
TW201619292A (zh) | 聚醯亞胺樹脂組成物、黏著劑組成物、底漆組成物、積層體及附有樹脂之銅箔 | |
CN108690552B (zh) | 胶粘剂、胶粘材料、胶粘层、胶粘片、铜箔、覆铜层叠板、布线板及制造方法 | |
JP2006037083A (ja) | 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物 | |
TW202219124A (zh) | 聚醯亞胺、黏著劑、薄膜狀黏著材料、黏著層、黏著片、附有樹脂之銅箔、覆銅積層板、印刷線路板、以及多層線路板及其製造方法 | |
US20080032103A1 (en) | Multilayer Printed Circuit Board | |
JP2017119865A (ja) | ポリイミド系接着剤 | |
JP2017059779A (ja) | プリント配線板の製造方法 | |
JP2007169454A (ja) | 変性ポリイミド樹脂を含有するプリプレグ | |
WO2016121392A1 (ja) | 両面金属張積層板及びその製造方法 | |
JP6620457B2 (ja) | 樹脂組成物 | |
KR20090071774A (ko) | 접착제용 수지 조성물 및 이의 이용 | |
JP2013036042A (ja) | 多層プリント配線板の層間絶縁材用熱硬化性樹脂組成物 | |
JP2020172663A (ja) | 樹脂組成物 | |
JP5577837B2 (ja) | 金属箔張り積層板及びその製造方法、並びにこれを用いたプリント配線板 | |
WO2017130947A1 (ja) | 樹脂付き金属箔、フレキシブルプリント配線板 | |
TW202239821A (zh) | 接著劑組成物、硬化物、接著片材、附樹脂之銅箔、覆銅積層板、印刷配線板 | |
TW202233416A (zh) | 聚醯亞胺樹脂組成物、接著劑組成物、膜狀接著材料、接著片材、附樹脂之銅箔、覆銅積層板、印刷配線板及聚醯亞胺膜 | |
KR20170038740A (ko) | 수지 조성물, 접착제, 필름형 접착 기재, 접착 시트, 다층 배선판, 수지 부착 동박, 동장 적층판, 프린트 배선판 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20160512 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20170208 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171214 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190129 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190723 |