CN107172804B - 一种感光覆盖膜及产品 - Google Patents
一种感光覆盖膜及产品 Download PDFInfo
- Publication number
- CN107172804B CN107172804B CN201710561448.4A CN201710561448A CN107172804B CN 107172804 B CN107172804 B CN 107172804B CN 201710561448 A CN201710561448 A CN 201710561448A CN 107172804 B CN107172804 B CN 107172804B
- Authority
- CN
- China
- Prior art keywords
- photosensitive
- film
- adhesive layer
- carrier film
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010408 film Substances 0.000 claims abstract description 155
- 230000001681 protective effect Effects 0.000 claims abstract description 63
- 239000012790 adhesive layer Substances 0.000 claims abstract description 62
- 239000013039 cover film Substances 0.000 claims abstract description 47
- 239000010410 layer Substances 0.000 claims description 35
- 229920005575 poly(amic acid) Polymers 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 238000002834 transmittance Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000000049 pigment Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- 239000003504 photosensitizing agent Substances 0.000 claims description 6
- -1 photoinitiator Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021485 fumed silica Inorganic materials 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 230000037452 priming Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 32
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000002829 reductive effect Effects 0.000 abstract description 6
- 239000000976 ink Substances 0.000 description 14
- 238000001723 curing Methods 0.000 description 10
- 238000003825 pressing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001023 inorganic pigment Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710561448.4A CN107172804B (zh) | 2017-07-11 | 2017-07-11 | 一种感光覆盖膜及产品 |
JP2018600029U JP3226814U (ja) | 2017-07-11 | 2017-11-01 | 感光被膜及び感光被膜製品 |
PCT/CN2017/108903 WO2019010871A1 (zh) | 2017-07-11 | 2017-11-01 | 一种感光覆盖膜、其制备方法以及感光覆盖膜产品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710561448.4A CN107172804B (zh) | 2017-07-11 | 2017-07-11 | 一种感光覆盖膜及产品 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107172804A CN107172804A (zh) | 2017-09-15 |
CN107172804B true CN107172804B (zh) | 2023-12-26 |
Family
ID=59823657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710561448.4A Active CN107172804B (zh) | 2017-07-11 | 2017-07-11 | 一种感光覆盖膜及产品 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3226814U (zh) |
CN (1) | CN107172804B (zh) |
WO (1) | WO2019010871A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107172804B (zh) * | 2017-07-11 | 2023-12-26 | 昆山倬跃蓝天电子科技有限公司 | 一种感光覆盖膜及产品 |
CN107360667A (zh) * | 2017-07-11 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | 一种感光覆盖膜及其制备方法 |
CN108463060B (zh) * | 2018-02-28 | 2020-11-24 | 苏州城邦达益材料科技有限公司 | 感光覆盖膜的制备方法及感光覆盖膜 |
CN108470687A (zh) * | 2018-03-22 | 2018-08-31 | 江西芯创光电有限公司 | 一种覆膜制板方法 |
CN113604164B (zh) * | 2021-08-04 | 2023-01-31 | 苏州城邦达益材料科技有限公司 | 用于MiniLED的FPC感光覆盖膜 |
DE102021006273B4 (de) | 2021-12-21 | 2024-06-13 | Lohmann Gmbh & Co. Kg | Indikatormischung |
CN115894083B (zh) * | 2022-07-29 | 2024-04-09 | 广东环波新材料有限责任公司 | 一种负性感光型黑色电子器件的制备方法和应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000047199A (ja) * | 1998-07-31 | 2000-02-18 | Hitachi Chem Co Ltd | 転写フィルム及び拡散反射板の製造法 |
CN101836162A (zh) * | 2007-10-25 | 2010-09-15 | 可隆工业株式会社 | 薄膜型转印材料 |
CN104710871A (zh) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Fpc用碱显影感光阻焊油墨、制备方法、用途及产品 |
CN204659111U (zh) * | 2015-03-27 | 2015-09-23 | 甄凯军 | 一种新型感光式阻焊干膜 |
CN105388703A (zh) * | 2015-12-10 | 2016-03-09 | 苏州城邦达力材料科技有限公司 | 一种用于制备感光性覆盖膜的感光组合物及fpc用感光性覆盖膜的制备方法和应用方法 |
CN207099425U (zh) * | 2017-07-11 | 2018-03-13 | 苏州城邦达力材料科技有限公司 | 一种感光覆盖膜及产品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001284499A1 (en) * | 2000-09-11 | 2002-03-26 | Showa Denko K K | Photosensitive composition, cured article thereof, and printed circuit board using the same |
JP5882510B2 (ja) * | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
CN205061955U (zh) * | 2015-07-16 | 2016-03-02 | 新纶科技(常州)有限公司 | 一种底片保护膜 |
CN205439460U (zh) * | 2016-04-07 | 2016-08-10 | 湖北奥马电子科技有限公司 | 一种印刷线路板用白色覆盖膜 |
CN107172804B (zh) * | 2017-07-11 | 2023-12-26 | 昆山倬跃蓝天电子科技有限公司 | 一种感光覆盖膜及产品 |
-
2017
- 2017-07-11 CN CN201710561448.4A patent/CN107172804B/zh active Active
- 2017-11-01 WO PCT/CN2017/108903 patent/WO2019010871A1/zh active Application Filing
- 2017-11-01 JP JP2018600029U patent/JP3226814U/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000047199A (ja) * | 1998-07-31 | 2000-02-18 | Hitachi Chem Co Ltd | 転写フィルム及び拡散反射板の製造法 |
CN101836162A (zh) * | 2007-10-25 | 2010-09-15 | 可隆工业株式会社 | 薄膜型转印材料 |
CN104710871A (zh) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Fpc用碱显影感光阻焊油墨、制备方法、用途及产品 |
CN204659111U (zh) * | 2015-03-27 | 2015-09-23 | 甄凯军 | 一种新型感光式阻焊干膜 |
CN105388703A (zh) * | 2015-12-10 | 2016-03-09 | 苏州城邦达力材料科技有限公司 | 一种用于制备感光性覆盖膜的感光组合物及fpc用感光性覆盖膜的制备方法和应用方法 |
CN207099425U (zh) * | 2017-07-11 | 2018-03-13 | 苏州城邦达力材料科技有限公司 | 一种感光覆盖膜及产品 |
Also Published As
Publication number | Publication date |
---|---|
WO2019010871A1 (zh) | 2019-01-17 |
JP3226814U (ja) | 2020-07-27 |
CN107172804A (zh) | 2017-09-15 |
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Address after: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 Dongping Road 399, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20231130 Address after: 215000 room 2, 399 Dongping Road, Baicheng Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: KUNSHAN ZHUOYUE LANTIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 215300 399 Dongping Road, Baicheng Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: Suzhou Chengbang Dayi Material Technology Co.,Ltd. |
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