JP3110174B2 - 半導体パッケージ - Google Patents

半導体パッケージ

Info

Publication number
JP3110174B2
JP3110174B2 JP29615992A JP29615992A JP3110174B2 JP 3110174 B2 JP3110174 B2 JP 3110174B2 JP 29615992 A JP29615992 A JP 29615992A JP 29615992 A JP29615992 A JP 29615992A JP 3110174 B2 JP3110174 B2 JP 3110174B2
Authority
JP
Japan
Prior art keywords
semiconductor package
semiconductor chip
cover plate
semiconductor
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29615992A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05343558A (ja
Inventor
珍成 劉
Original Assignee
エル・ジー・セミコン・カンパニー・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エル・ジー・セミコン・カンパニー・リミテッド filed Critical エル・ジー・セミコン・カンパニー・リミテッド
Publication of JPH05343558A publication Critical patent/JPH05343558A/ja
Application granted granted Critical
Publication of JP3110174B2 publication Critical patent/JP3110174B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W76/12—
    • H10W76/15—
    • H10W76/153—
    • H10W76/18—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP29615992A 1992-01-14 1992-11-05 半導体パッケージ Expired - Fee Related JP3110174B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR421 1992-01-14
KR1019920000421A KR0157857B1 (ko) 1992-01-14 1992-01-14 반도체 패키지

Publications (2)

Publication Number Publication Date
JPH05343558A JPH05343558A (ja) 1993-12-24
JP3110174B2 true JP3110174B2 (ja) 2000-11-20

Family

ID=19327846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29615992A Expired - Fee Related JP3110174B2 (ja) 1992-01-14 1992-11-05 半導体パッケージ

Country Status (5)

Country Link
US (1) US5326932A (enExample)
JP (1) JP3110174B2 (enExample)
KR (1) KR0157857B1 (enExample)
DE (1) DE4238438A1 (enExample)
TW (1) TW262583B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19520676A1 (de) * 1995-06-07 1996-12-12 Deutsche Telekom Ag Hybridschaltung und Verfahren zur Herstellung derselben
US5694344A (en) * 1995-06-15 1997-12-02 Motorola, Inc. Method for electrically modeling a semiconductor package
KR100206910B1 (ko) * 1996-06-14 1999-07-01 구본준 반도체 패키지의 디플래쉬 방법
KR0179925B1 (ko) * 1996-06-14 1999-03-20 문정환 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지
KR0179924B1 (ko) * 1996-06-14 1999-03-20 문정환 버텀리드 반도체 패키지
US6335225B1 (en) 1998-02-20 2002-01-01 Micron Technology, Inc. High density direct connect LOC assembly
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
FR2819936B1 (fr) * 2001-01-22 2003-05-30 St Microelectronics Sa Procede de fabrication d'un boitier semi-conducteur et boitier semi-conducteur a puces de circuits integres
US6981230B1 (en) 2002-07-30 2005-12-27 Apache Design Solutions, Inc. On-chip power-ground inductance modeling using effective self-loop-inductance

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139968A (en) * 1989-03-03 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of producing a t-shaped gate electrode
JPH03227541A (ja) * 1990-02-01 1991-10-08 Hitachi Ltd 半導体装置
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
US5153379A (en) * 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
US5136366A (en) * 1990-11-05 1992-08-04 Motorola, Inc. Overmolded semiconductor package with anchoring means
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
US5153385A (en) * 1991-03-18 1992-10-06 Motorola, Inc. Transfer molded semiconductor package with improved adhesion
JPH05251513A (ja) * 1991-05-28 1993-09-28 Oki Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
TW262583B (enExample) 1995-11-11
KR930017154A (ko) 1993-08-30
US5326932A (en) 1994-07-05
KR0157857B1 (ko) 1998-12-01
JPH05343558A (ja) 1993-12-24
DE4238438A1 (en) 1993-07-15

Similar Documents

Publication Publication Date Title
KR0179803B1 (ko) 리드노출형 반도체 패키지
US6043430A (en) Bottom lead semiconductor chip package
US5338971A (en) Electronic device structure with studs locating lead frame on backing plate
JP3066579B2 (ja) 半導体パッケージ
KR970010678B1 (ko) 리드 프레임 및 이를 이용한 반도체 패키지
US7208826B2 (en) Semiconductor device and method of manufacturing the same
JP3461720B2 (ja) 樹脂封止型半導体装置
JPH09246465A (ja) Ｌｏｃ型半導体チップの積層チップパッケージ
JPH11219420A (ja) Ｉｃカードモジュール、ｉｃカード及びそれらの製造方法
JPH05109975A (ja) 樹脂封止型半導体装置
JP2007521643A (ja) 受動デバイスを有するリードフレーム
JP3110174B2 (ja) 半導体パッケージ
JPH03112688A (ja) Ｉｃカード
US6084299A (en) Integrated circuit package including a heat sink and an adhesive
US20010002320A1 (en) Extended lead package
JPH0418694B2 (enExample)
US6181003B1 (en) Semiconductor device packaged in plastic package
JP2001015677A (ja) 半導体装置
JPH0358537B2 (enExample)
JP2944586B2 (ja) Ｂｇａ型半導体装置及びその製造方法
KR100256305B1 (ko) 칩 스케일 패키지
JPH1079401A (ja) 半導体装置およびその製造方法
JP2000277559A (ja) 半導体パッケージ及びその製造方法
JPS6334281Y2 (enExample)
JPH07273275A (ja) 半導体装置

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20000822

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080914

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080914

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090914

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100914

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110914

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120914

Year of fee payment: 12

LAPS Cancellation because of no payment of annual fees