TW262583B - - Google Patents
Info
- Publication number
- TW262583B TW262583B TW81108390A TW81108390A TW262583B TW 262583 B TW262583 B TW 262583B TW 81108390 A TW81108390 A TW 81108390A TW 81108390 A TW81108390 A TW 81108390A TW 262583 B TW262583 B TW 262583B
- Authority
- TW
- Taiwan
Links
Classifications
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- H10W76/12—
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- H10W76/15—
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- H10W76/153—
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- H10W76/18—
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- H10W72/073—
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- H10W72/07337—
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- H10W72/354—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/552—
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- H10W74/00—
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- H10W90/756—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920000421A KR0157857B1 (ko) | 1992-01-14 | 1992-01-14 | 반도체 패키지 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW262583B true TW262583B (enExample) | 1995-11-11 |
Family
ID=19327846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW81108390A TW262583B (enExample) | 1992-01-14 | 1992-10-21 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5326932A (enExample) |
| JP (1) | JP3110174B2 (enExample) |
| KR (1) | KR0157857B1 (enExample) |
| DE (1) | DE4238438A1 (enExample) |
| TW (1) | TW262583B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19520676A1 (de) * | 1995-06-07 | 1996-12-12 | Deutsche Telekom Ag | Hybridschaltung und Verfahren zur Herstellung derselben |
| US5694344A (en) * | 1995-06-15 | 1997-12-02 | Motorola, Inc. | Method for electrically modeling a semiconductor package |
| KR100206910B1 (ko) * | 1996-06-14 | 1999-07-01 | 구본준 | 반도체 패키지의 디플래쉬 방법 |
| KR0179925B1 (ko) * | 1996-06-14 | 1999-03-20 | 문정환 | 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지 |
| KR0179924B1 (ko) * | 1996-06-14 | 1999-03-20 | 문정환 | 버텀리드 반도체 패키지 |
| US6335225B1 (en) | 1998-02-20 | 2002-01-01 | Micron Technology, Inc. | High density direct connect LOC assembly |
| US6133634A (en) * | 1998-08-05 | 2000-10-17 | Fairchild Semiconductor Corporation | High performance flip chip package |
| FR2819936B1 (fr) * | 2001-01-22 | 2003-05-30 | St Microelectronics Sa | Procede de fabrication d'un boitier semi-conducteur et boitier semi-conducteur a puces de circuits integres |
| US6981230B1 (en) | 2002-07-30 | 2005-12-27 | Apache Design Solutions, Inc. | On-chip power-ground inductance modeling using effective self-loop-inductance |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139968A (en) * | 1989-03-03 | 1992-08-18 | Mitsubishi Denki Kabushiki Kaisha | Method of producing a t-shaped gate electrode |
| JPH03227541A (ja) * | 1990-02-01 | 1991-10-08 | Hitachi Ltd | 半導体装置 |
| US5139969A (en) * | 1990-05-30 | 1992-08-18 | Mitsubishi Denki Kabushiki Kaisha | Method of making resin molded semiconductor device |
| US5153379A (en) * | 1990-10-09 | 1992-10-06 | Motorola, Inc. | Shielded low-profile electronic component assembly |
| US5136366A (en) * | 1990-11-05 | 1992-08-04 | Motorola, Inc. | Overmolded semiconductor package with anchoring means |
| US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
| US5166772A (en) * | 1991-02-22 | 1992-11-24 | Motorola, Inc. | Transfer molded semiconductor device package with integral shield |
| US5153385A (en) * | 1991-03-18 | 1992-10-06 | Motorola, Inc. | Transfer molded semiconductor package with improved adhesion |
| JPH05251513A (ja) * | 1991-05-28 | 1993-09-28 | Oki Electric Ind Co Ltd | 半導体装置 |
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1992
- 1992-01-14 KR KR1019920000421A patent/KR0157857B1/ko not_active Expired - Fee Related
- 1992-10-21 TW TW81108390A patent/TW262583B/zh not_active IP Right Cessation
- 1992-10-22 US US07/964,718 patent/US5326932A/en not_active Expired - Lifetime
- 1992-11-05 JP JP29615992A patent/JP3110174B2/ja not_active Expired - Fee Related
- 1992-11-13 DE DE19924238438 patent/DE4238438A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR930017154A (ko) | 1993-08-30 |
| US5326932A (en) | 1994-07-05 |
| KR0157857B1 (ko) | 1998-12-01 |
| JPH05343558A (ja) | 1993-12-24 |
| DE4238438A1 (en) | 1993-07-15 |
| JP3110174B2 (ja) | 2000-11-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |