JP2903013B2 - 金属基板を含む回路パッケージ及び実装方法 - Google Patents

金属基板を含む回路パッケージ及び実装方法

Info

Publication number
JP2903013B2
JP2903013B2 JP10003024A JP302498A JP2903013B2 JP 2903013 B2 JP2903013 B2 JP 2903013B2 JP 10003024 A JP10003024 A JP 10003024A JP 302498 A JP302498 A JP 302498A JP 2903013 B2 JP2903013 B2 JP 2903013B2
Authority
JP
Japan
Prior art keywords
chip
metal substrate
package
circuit
dielectric coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10003024A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10209332A (ja
Inventor
ステファン・ウェスレイ・マックワリィ
ウエイン・ラセル・ストー
ジェームズ・ウォーレン・ウィルソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/783,775 external-priority patent/US6150716A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH10209332A publication Critical patent/JPH10209332A/ja
Application granted granted Critical
Publication of JP2903013B2 publication Critical patent/JP2903013B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
JP10003024A 1997-01-15 1998-01-09 金属基板を含む回路パッケージ及び実装方法 Expired - Fee Related JP2903013B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/783775 1997-01-15
US08/783,775 US6150716A (en) 1995-01-25 1997-01-15 Metal substrate having an IC chip and carrier mounting

Publications (2)

Publication Number Publication Date
JPH10209332A JPH10209332A (ja) 1998-08-07
JP2903013B2 true JP2903013B2 (ja) 1999-06-07

Family

ID=25130356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10003024A Expired - Fee Related JP2903013B2 (ja) 1997-01-15 1998-01-09 金属基板を含む回路パッケージ及び実装方法

Country Status (10)

Country Link
JP (1) JP2903013B2 (ko)
KR (1) KR100259412B1 (ko)
CN (1) CN1132243C (ko)
CZ (1) CZ3498A3 (ko)
HU (1) HUP9701377A3 (ko)
MY (1) MY127468A (ko)
PL (1) PL324177A1 (ko)
RU (1) RU2191445C2 (ko)
SG (1) SG60170A1 (ko)
TW (1) TW473887B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2481754C1 (ru) * 2011-09-13 2013-05-10 Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") Печатная плата на металлической подложке и способ ее изготовления
JP5912058B2 (ja) 2012-03-30 2016-04-27 株式会社フジクラ 撮像モジュール、レンズ付き撮像モジュール、内視鏡、撮像モジュールの製造方法、フレキシブル配線基板成形装置
CN104882531A (zh) * 2015-06-08 2015-09-02 杨子龙 一种led集成发光模组
CN113097162A (zh) 2017-10-10 2021-07-09 北京比特大陆科技有限公司 散热片、芯片及电路板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
US5635762A (en) * 1993-05-18 1997-06-03 U.S. Philips Corporation Flip chip semiconductor device with dual purpose metallized ground conductor
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Also Published As

Publication number Publication date
HU9701377D0 (en) 1997-10-28
HUP9701377A3 (en) 2000-01-28
KR19980070016A (ko) 1998-10-26
JPH10209332A (ja) 1998-08-07
CN1188984A (zh) 1998-07-29
CN1132243C (zh) 2003-12-24
RU2191445C2 (ru) 2002-10-20
CZ3498A3 (cs) 1998-11-11
KR100259412B1 (ko) 2000-06-15
TW473887B (en) 2002-01-21
SG60170A1 (en) 1999-02-22
HUP9701377A2 (hu) 1998-08-28
PL324177A1 (en) 1998-07-20
MY127468A (en) 2006-12-29

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Legal Events

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