JP2798578B2 - 積層板の製造過程において中間製品を構成するための装置 - Google Patents
積層板の製造過程において中間製品を構成するための装置Info
- Publication number
- JP2798578B2 JP2798578B2 JP5038201A JP3820193A JP2798578B2 JP 2798578 B2 JP2798578 B2 JP 2798578B2 JP 5038201 A JP5038201 A JP 5038201A JP 3820193 A JP3820193 A JP 3820193A JP 2798578 B2 JP2798578 B2 JP 2798578B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- processing station
- plate member
- copper sheet
- transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013067 intermediate product Substances 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 107
- 229910052802 copper Inorganic materials 0.000 claims description 107
- 239000010949 copper Substances 0.000 claims description 107
- 238000010030 laminating Methods 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 description 53
- 238000001311 chemical methods and process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B7/00—Presses characterised by a particular arrangement of the pressing members
- B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Veneer Processing And Manufacture Of Plywood (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4209466.6 | 1992-03-24 | ||
DE4209466A DE4209466C2 (de) | 1992-03-24 | 1992-03-24 | Anlage für den Aufbau von zumindest einem Vorprodukt im Zuge der Herstellung von Laminaten |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06246706A JPH06246706A (ja) | 1994-09-06 |
JP2798578B2 true JP2798578B2 (ja) | 1998-09-17 |
Family
ID=6454841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5038201A Expired - Fee Related JP2798578B2 (ja) | 1992-03-24 | 1993-02-26 | 積層板の製造過程において中間製品を構成するための装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2798578B2 (it) |
CA (1) | CA2092109C (it) |
DE (1) | DE4209466C2 (it) |
FI (1) | FI108416B (it) |
IT (1) | IT1272029B (it) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19731133C2 (de) * | 1997-07-19 | 2001-05-10 | Siempelkamp Gmbh & Co | Verfahren zum Herstellen von Laminaten, insbesondere von Industrielaminaten |
CN105984739B (zh) * | 2015-03-03 | 2017-12-22 | 昆山巨闳机械科技有限公司 | 多层复铜箔成形设备 |
CN112092118B (zh) * | 2020-09-10 | 2023-03-03 | 漳州鑫华成机械制造有限公司 | 一种覆膜板多层组胚热压成型一体自动化生产线 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2527034C3 (de) * | 1975-06-18 | 1979-09-27 | Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen | Anlage zur Herstellung von Schichtstoffplatten |
DE2852456C2 (de) * | 1978-12-04 | 1983-06-30 | Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen | Vorrichtung zum Ein- und Austafeln bei der Herstellung von Schichtstoffplatten |
DE2932845C2 (de) * | 1979-08-14 | 1981-04-09 | G. Siempelkamp Gmbh & Co, 4150 Krefeld | Vorrichtung zum Zusammenlegen von Pressgutpaketen bei der Herstellung von Laminatplatten |
DE3342678C2 (de) * | 1983-11-25 | 1995-08-31 | Held Kurt | Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate |
DE4006331A1 (de) * | 1990-03-01 | 1991-09-05 | Siempelkamp Gmbh & Co | Form- und beschickanlage fuer eine plattenpresse |
-
1992
- 1992-03-24 DE DE4209466A patent/DE4209466C2/de not_active Expired - Fee Related
-
1993
- 1993-02-26 JP JP5038201A patent/JP2798578B2/ja not_active Expired - Fee Related
- 1993-03-09 FI FI931037A patent/FI108416B/fi not_active IP Right Cessation
- 1993-03-15 IT ITMI930495A patent/IT1272029B/it active IP Right Grant
- 1993-03-22 CA CA002092109A patent/CA2092109C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2092109C (en) | 1999-06-29 |
DE4209466C2 (de) | 1996-02-22 |
FI931037A0 (fi) | 1993-03-09 |
ITMI930495A1 (it) | 1994-09-15 |
JPH06246706A (ja) | 1994-09-06 |
CA2092109A1 (en) | 1993-09-25 |
FI931037A (fi) | 1993-09-25 |
FI108416B (fi) | 2002-01-31 |
IT1272029B (it) | 1997-06-10 |
ITMI930495A0 (it) | 1993-03-15 |
DE4209466A1 (de) | 1993-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |