JP2798578B2 - 積層板の製造過程において中間製品を構成するための装置 - Google Patents

積層板の製造過程において中間製品を構成するための装置

Info

Publication number
JP2798578B2
JP2798578B2 JP5038201A JP3820193A JP2798578B2 JP 2798578 B2 JP2798578 B2 JP 2798578B2 JP 5038201 A JP5038201 A JP 5038201A JP 3820193 A JP3820193 A JP 3820193A JP 2798578 B2 JP2798578 B2 JP 2798578B2
Authority
JP
Japan
Prior art keywords
plate
processing station
plate member
copper sheet
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5038201A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06246706A (ja
Inventor
フリートハイム、ハーゲ−ヒュルスマン
Original Assignee
ゲー、ヂームペルカムプ、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ゲー、ヂームペルカムプ、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー filed Critical ゲー、ヂームペルカムプ、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング、ウント、コンパニー
Publication of JPH06246706A publication Critical patent/JPH06246706A/ja
Application granted granted Critical
Publication of JP2798578B2 publication Critical patent/JP2798578B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B7/00—Presses characterised by a particular arrangement of the pressing members
    • B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)
JP5038201A 1992-03-24 1993-02-26 積層板の製造過程において中間製品を構成するための装置 Expired - Fee Related JP2798578B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4209466A DE4209466C2 (de) 1992-03-24 1992-03-24 Anlage für den Aufbau von zumindest einem Vorprodukt im Zuge der Herstellung von Laminaten
DE4209466.6 1992-03-24

Publications (2)

Publication Number Publication Date
JPH06246706A JPH06246706A (ja) 1994-09-06
JP2798578B2 true JP2798578B2 (ja) 1998-09-17

Family

ID=6454841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5038201A Expired - Fee Related JP2798578B2 (ja) 1992-03-24 1993-02-26 積層板の製造過程において中間製品を構成するための装置

Country Status (5)

Country Link
JP (1) JP2798578B2 (de)
CA (1) CA2092109C (de)
DE (1) DE4209466C2 (de)
FI (1) FI108416B (de)
IT (1) IT1272029B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19731133C2 (de) * 1997-07-19 2001-05-10 Siempelkamp Gmbh & Co Verfahren zum Herstellen von Laminaten, insbesondere von Industrielaminaten
CN105984739B (zh) * 2015-03-03 2017-12-22 昆山巨闳机械科技有限公司 多层复铜箔成形设备
CN112092118B (zh) * 2020-09-10 2023-03-03 漳州鑫华成机械制造有限公司 一种覆膜板多层组胚热压成型一体自动化生产线

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2527034C3 (de) * 1975-06-18 1979-09-27 Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen Anlage zur Herstellung von Schichtstoffplatten
DE2852456C2 (de) * 1978-12-04 1983-06-30 Maschinenfabrik J. Dieffenbacher Gmbh & Co, 7519 Eppingen Vorrichtung zum Ein- und Austafeln bei der Herstellung von Schichtstoffplatten
DE2932845C2 (de) * 1979-08-14 1981-04-09 G. Siempelkamp Gmbh & Co, 4150 Krefeld Vorrichtung zum Zusammenlegen von Pressgutpaketen bei der Herstellung von Laminatplatten
DE3342678C2 (de) * 1983-11-25 1995-08-31 Held Kurt Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate
DE4006331A1 (de) * 1990-03-01 1991-09-05 Siempelkamp Gmbh & Co Form- und beschickanlage fuer eine plattenpresse

Also Published As

Publication number Publication date
JPH06246706A (ja) 1994-09-06
FI931037A (fi) 1993-09-25
CA2092109A1 (en) 1993-09-25
IT1272029B (it) 1997-06-10
DE4209466C2 (de) 1996-02-22
ITMI930495A0 (it) 1993-03-15
FI931037A0 (fi) 1993-03-09
CA2092109C (en) 1999-06-29
FI108416B (fi) 2002-01-31
ITMI930495A1 (it) 1994-09-15
DE4209466A1 (de) 1993-09-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees