JP2554059Y2 - 半導体装置の実装構造 - Google Patents

半導体装置の実装構造

Info

Publication number
JP2554059Y2
JP2554059Y2 JP1988020470U JP2047088U JP2554059Y2 JP 2554059 Y2 JP2554059 Y2 JP 2554059Y2 JP 1988020470 U JP1988020470 U JP 1988020470U JP 2047088 U JP2047088 U JP 2047088U JP 2554059 Y2 JP2554059 Y2 JP 2554059Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring
wiring board
mounting structure
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988020470U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01125555U (enExample
Inventor
哲也 大西
未則 清田
和彦 橋本
節信 若本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1988020470U priority Critical patent/JP2554059Y2/ja
Publication of JPH01125555U publication Critical patent/JPH01125555U/ja
Application granted granted Critical
Publication of JP2554059Y2 publication Critical patent/JP2554059Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1988020470U 1988-02-18 1988-02-18 半導体装置の実装構造 Expired - Lifetime JP2554059Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020470U JP2554059Y2 (ja) 1988-02-18 1988-02-18 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020470U JP2554059Y2 (ja) 1988-02-18 1988-02-18 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPH01125555U JPH01125555U (enExample) 1989-08-28
JP2554059Y2 true JP2554059Y2 (ja) 1997-11-12

Family

ID=31236865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020470U Expired - Lifetime JP2554059Y2 (ja) 1988-02-18 1988-02-18 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JP2554059Y2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59132641U (ja) * 1983-02-25 1984-09-05 日本電気株式会社 半導体装置用基板
JPS60154543A (ja) * 1984-01-24 1985-08-14 Nec Corp 合成樹脂基板を用いた半導体装置
JPH0632419B2 (ja) * 1986-04-07 1994-04-27 日本電気株式会社 混成集積回路装置

Also Published As

Publication number Publication date
JPH01125555U (enExample) 1989-08-28

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