JP2553342Y2 - 発光ダイオードランプ - Google Patents

発光ダイオードランプ

Info

Publication number
JP2553342Y2
JP2553342Y2 JP1989142390U JP14239089U JP2553342Y2 JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2 JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP 2553342 Y2 JP2553342 Y2 JP 2553342Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
lead frame
light
mold resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989142390U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0381652U (US08063081-20111122-C00102.png
Inventor
和幸 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989142390U priority Critical patent/JP2553342Y2/ja
Publication of JPH0381652U publication Critical patent/JPH0381652U/ja
Application granted granted Critical
Publication of JP2553342Y2 publication Critical patent/JP2553342Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1989142390U 1989-12-08 1989-12-08 発光ダイオードランプ Expired - Lifetime JP2553342Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH0381652U JPH0381652U (US08063081-20111122-C00102.png) 1991-08-21
JP2553342Y2 true JP2553342Y2 (ja) 1997-11-05

Family

ID=31689220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142390U Expired - Lifetime JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2553342Y2 (US08063081-20111122-C00102.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
JP3724498B2 (ja) * 2004-09-27 2005-12-07 日亜化学工業株式会社 発光ダイオード

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855652Y2 (ja) * 1977-03-14 1983-12-20 株式会社東芝 光半導体装置
JPS53151376U (US08063081-20111122-C00102.png) * 1977-05-04 1978-11-29
JPS59767Y2 (ja) * 1978-04-27 1984-01-10 サンケン電気株式会社 発光素子のリ−ドフレ−ム
JPS61156779A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 発光表示装置用電極部材の製造方法

Also Published As

Publication number Publication date
JPH0381652U (US08063081-20111122-C00102.png) 1991-08-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term