JP2520610Y2 - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JP2520610Y2
JP2520610Y2 JP1990029243U JP2924390U JP2520610Y2 JP 2520610 Y2 JP2520610 Y2 JP 2520610Y2 JP 1990029243 U JP1990029243 U JP 1990029243U JP 2924390 U JP2924390 U JP 2924390U JP 2520610 Y2 JP2520610 Y2 JP 2520610Y2
Authority
JP
Japan
Prior art keywords
guide hole
lead
plating
pin
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990029243U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03120047U (lt
Inventor
悟 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1990029243U priority Critical patent/JP2520610Y2/ja
Publication of JPH03120047U publication Critical patent/JPH03120047U/ja
Application granted granted Critical
Publication of JP2520610Y2 publication Critical patent/JP2520610Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990029243U 1990-03-22 1990-03-22 リードフレーム Expired - Fee Related JP2520610Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990029243U JP2520610Y2 (ja) 1990-03-22 1990-03-22 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990029243U JP2520610Y2 (ja) 1990-03-22 1990-03-22 リードフレーム

Publications (2)

Publication Number Publication Date
JPH03120047U JPH03120047U (lt) 1991-12-10
JP2520610Y2 true JP2520610Y2 (ja) 1996-12-18

Family

ID=31532014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990029243U Expired - Fee Related JP2520610Y2 (ja) 1990-03-22 1990-03-22 リードフレーム

Country Status (1)

Country Link
JP (1) JP2520610Y2 (lt)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050349B2 (ja) * 1980-07-09 1985-11-08 住友金属鉱山株式会社 リ−ドフレ−ムの製造方法
JPS62183154A (ja) * 1986-02-06 1987-08-11 Hitachi Cable Ltd 半導体装置用リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH03120047U (lt) 1991-12-10

Similar Documents

Publication Publication Date Title
DE19817128A1 (de) Zuleitungsrahmen, den Zuleitungsrahmen benutzende Halbleitervorrichtung und Verfahren zum Herstellen der Halbleitervorrichtung
EP0701280A2 (en) Lead frame and process of producing it
US5451813A (en) Semiconductor device with lead frame having different thicknesses
JP2520610Y2 (ja) リードフレーム
US6274822B1 (en) Manufacture of semiconductor connection components with frangible lead sections
JPS61170053A (ja) 半導体装置用リ−ドフレ−ム
JPS6248053A (ja) 半導体装置用リ−ドフレ−ムの製造方法
JP2524645B2 (ja) リ―ドフレ―ムおよびその製造方法
JPH0427148A (ja) 半導体装置用リードフレーム
JP2648354B2 (ja) リードフレームの製造方法
JPH0815191B2 (ja) リ−ドフレ−ムの製造方法
JP2784352B2 (ja) リードフレームの製造方法
JPH0444255A (ja) リードフレームの製造方法
JP2816757B2 (ja) 半導体装置の製造方法
JPH03283643A (ja) リードフレームの製造方法
DE102014117404A1 (de) Anschlussleiterloses Halbleitergehäuse mit optischer Überprüfungsmöglichkeit
JPH0821663B2 (ja) リードフレームの製造方法
JP2504860B2 (ja) リ―ドフレ―ムの製造方法
JPH04368157A (ja) 表面実装型半導体装置およびその製造方法
JPS61128552A (ja) リ−ドフレ−ムの製造方法
JPS6237887B2 (lt)
JPH0982869A (ja) ストライプめっき条体の製造方法
JPH05190719A (ja) 多ピンリードフレームの製造方法
JPH05275603A (ja) リードフレーム用金属板
JPS61150358A (ja) リ−ドフレ−ムおよびその製造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees