JP2520527Y2 - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JP2520527Y2
JP2520527Y2 JP1990102383U JP10238390U JP2520527Y2 JP 2520527 Y2 JP2520527 Y2 JP 2520527Y2 JP 1990102383 U JP1990102383 U JP 1990102383U JP 10238390 U JP10238390 U JP 10238390U JP 2520527 Y2 JP2520527 Y2 JP 2520527Y2
Authority
JP
Japan
Prior art keywords
island
bonding
lead frame
suspension
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990102383U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459956U (en, 2012
Inventor
裕仁 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Priority to JP1990102383U priority Critical patent/JP2520527Y2/ja
Publication of JPH0459956U publication Critical patent/JPH0459956U/ja
Application granted granted Critical
Publication of JP2520527Y2 publication Critical patent/JP2520527Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990102383U 1990-09-29 1990-09-29 リードフレーム Expired - Lifetime JP2520527Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990102383U JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990102383U JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Publications (2)

Publication Number Publication Date
JPH0459956U JPH0459956U (en, 2012) 1992-05-22
JP2520527Y2 true JP2520527Y2 (ja) 1996-12-18

Family

ID=31846594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990102383U Expired - Lifetime JP2520527Y2 (ja) 1990-09-29 1990-09-29 リードフレーム

Country Status (1)

Country Link
JP (1) JP2520527Y2 (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2735509B2 (ja) * 1994-08-29 1998-04-02 アナログ デバイセス インコーポレーテッド 改善された熱放散を備えたｉｃパッケージ
JP4590961B2 (ja) * 2004-07-20 2010-12-01 株式会社デンソー 電子装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910249A (ja) * 1982-07-09 1984-01-19 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6070755A (ja) * 1983-09-28 1985-04-22 Hitachi Micro Comput Eng Ltd 半導体装置
JPS60105747A (ja) * 1983-11-14 1985-06-11 株式会社イナックス タイルパネル構成体を利用した吊天井構造
JPS60123046A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS60119756U (ja) * 1984-01-20 1985-08-13 三洋電機株式会社 リ−ドフレ−ム
JPS639149U (en, 2012) * 1986-07-03 1988-01-21
JP2539611B2 (ja) * 1986-10-27 1996-10-02 ロ−ム株式会社 半導体装置の製造方法
JPH01143246A (ja) * 1987-11-30 1989-06-05 Nec Corp 半導体装置
JPH01244654A (ja) * 1988-03-25 1989-09-29 Nec Kyushu Ltd リードフレーム
JPH02174254A (ja) * 1988-12-27 1990-07-05 Nec Corp Ｉｃパッケージ

Also Published As

Publication number Publication date
JPH0459956U (en, 2012) 1992-05-22

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term