JP2025502957A5 - - Google Patents
Info
- Publication number
- JP2025502957A5 JP2025502957A5 JP2024540963A JP2024540963A JP2025502957A5 JP 2025502957 A5 JP2025502957 A5 JP 2025502957A5 JP 2024540963 A JP2024540963 A JP 2024540963A JP 2024540963 A JP2024540963 A JP 2024540963A JP 2025502957 A5 JP2025502957 A5 JP 2025502957A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist layer
- solder resist
- interconnects
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/579,434 US20230230908A1 (en) | 2022-01-19 | 2022-01-19 | Package comprising a substrate with post interconnects and a solder resist layer having a cavity |
| US17/579,434 | 2022-01-19 | ||
| PCT/US2023/010230 WO2023141021A1 (en) | 2022-01-19 | 2023-01-05 | Package comprising a substrate with post interconnects and a solder resist layer having a cavity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025502957A JP2025502957A (ja) | 2025-01-30 |
| JP2025502957A5 true JP2025502957A5 (enExample) | 2026-01-08 |
Family
ID=85222309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024540963A Pending JP2025502957A (ja) | 2022-01-19 | 2023-01-05 | ポスト相互接続部と、キャビティを有するはんだレジスト層とを有する基板を備えるパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230230908A1 (enExample) |
| EP (1) | EP4466735A1 (enExample) |
| JP (1) | JP2025502957A (enExample) |
| KR (1) | KR20240141163A (enExample) |
| CN (1) | CN118451548A (enExample) |
| TW (1) | TW202331958A (enExample) |
| WO (1) | WO2023141021A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230155901A (ko) * | 2022-05-04 | 2023-11-13 | 삼성전자주식회사 | 반도체 패키지 |
| US20250125234A1 (en) * | 2023-10-13 | 2025-04-17 | Qualcomm Incorporated | Interposer connection structures based on wire bonding |
| WO2025100914A1 (ko) * | 2023-11-06 | 2025-05-15 | 삼성전자 주식회사 | 인터포저 기판을 포함하는 전자 장치 |
| US20250191989A1 (en) * | 2023-12-07 | 2025-06-12 | Qualcomm Incorporated | Package comprising a substrate with cavity and an integrated device with a step back side |
| US20250253217A1 (en) * | 2024-02-01 | 2025-08-07 | Qualcomm Incorporated | Package comprising substrates with post interconnects |
| US20260033352A1 (en) * | 2024-07-23 | 2026-01-29 | Qualcomm Incorporated | Package comprising an integrated device with back side metallization interconnects |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2290682A3 (en) * | 2005-12-14 | 2011-10-05 | Shinko Electric Industries Co., Ltd. | Package with a chip embedded between two substrates and method of manufacturing the same |
| JP2015162660A (ja) * | 2014-02-28 | 2015-09-07 | イビデン株式会社 | プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ |
| JP2015170725A (ja) * | 2014-03-07 | 2015-09-28 | イビデン株式会社 | 複合基板 |
| US11164754B2 (en) * | 2018-09-28 | 2021-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fan-out packages and methods of forming the same |
| US11562936B2 (en) * | 2020-08-31 | 2023-01-24 | Amkor Technology Singapore Holding Pte. Ltd. | Electrionic devices with interposer and redistribution layer |
| KR102949945B1 (ko) * | 2021-05-03 | 2026-04-07 | 삼성전자주식회사 | 인터포저 기판을 갖는 반도체 패키지 구조체 및 이를 포함하는 적층형 반도체 패키지 구조체 |
-
2022
- 2022-01-19 US US17/579,434 patent/US20230230908A1/en active Pending
-
2023
- 2023-01-05 CN CN202380015125.9A patent/CN118451548A/zh active Pending
- 2023-01-05 EP EP23704492.0A patent/EP4466735A1/en active Pending
- 2023-01-05 KR KR1020247023143A patent/KR20240141163A/ko active Pending
- 2023-01-05 WO PCT/US2023/010230 patent/WO2023141021A1/en not_active Ceased
- 2023-01-05 JP JP2024540963A patent/JP2025502957A/ja active Pending
- 2023-01-05 TW TW112100372A patent/TW202331958A/zh unknown
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