JP2025501651A5 - - Google Patents
Info
- Publication number
- JP2025501651A5 JP2025501651A5 JP2024540589A JP2024540589A JP2025501651A5 JP 2025501651 A5 JP2025501651 A5 JP 2025501651A5 JP 2024540589 A JP2024540589 A JP 2024540589A JP 2024540589 A JP2024540589 A JP 2024540589A JP 2025501651 A5 JP2025501651 A5 JP 2025501651A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- donor
- manufacturing
- piezoelectric
- handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2200381 | 2022-01-17 | ||
| FR2200381A FR3131980B1 (fr) | 2022-01-17 | 2022-01-17 | Procédé de fabrication d’un substrat donneur pour le transfert d’une couche piézoélectrique et procédé de transfert d’une couche piézoélectrique sur un substrat support |
| PCT/EP2023/050567 WO2023135179A1 (fr) | 2022-01-17 | 2023-01-11 | Procédé de fabrication d'un substrat donneur pour le transfert d'une couche piézoélectrique et procédé de transfert d'une couche piézoélectrique sur un substrat support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025501651A JP2025501651A (ja) | 2025-01-22 |
| JP2025501651A5 true JP2025501651A5 (https=) | 2026-01-05 |
Family
ID=81581197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024540589A Pending JP2025501651A (ja) | 2022-01-17 | 2023-01-11 | 圧電層の移転のためのドナー基板の製造のためのプロセス及び支持基板への圧電層の移転のためのプロセス |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20250176431A1 (https=) |
| EP (1) | EP4466966B1 (https=) |
| JP (1) | JP2025501651A (https=) |
| KR (1) | KR20240135826A (https=) |
| CN (1) | CN118525618A (https=) |
| FR (1) | FR3131980B1 (https=) |
| TW (1) | TW202418979A (https=) |
| WO (1) | WO2023135179A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6372352B2 (ja) * | 2013-07-16 | 2018-08-15 | 東洋紡株式会社 | フレキシブル電子デバイスの製造方法 |
| JP6396853B2 (ja) * | 2015-06-02 | 2018-09-26 | 信越化学工業株式会社 | 酸化物単結晶薄膜を備えた複合ウェーハの製造方法 |
| WO2017052646A1 (en) * | 2015-09-25 | 2017-03-30 | Intel Corporation | Island transfer for optical, piezo and rf applications |
| FR3079346B1 (fr) | 2018-03-26 | 2020-05-29 | Soitec | Procede de fabrication d'un substrat donneur pour le transfert d'une couche piezoelectrique, et procede de transfert d'une telle couche piezoelectrique |
| EP3930429A1 (en) * | 2020-06-22 | 2021-12-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded component connected in cavity by anchored first and second polymers |
-
2022
- 2022-01-17 FR FR2200381A patent/FR3131980B1/fr active Active
- 2022-12-22 TW TW111149571A patent/TW202418979A/zh unknown
-
2023
- 2023-01-11 KR KR1020247027371A patent/KR20240135826A/ko active Pending
- 2023-01-11 WO PCT/EP2023/050567 patent/WO2023135179A1/fr not_active Ceased
- 2023-01-11 CN CN202380016766.6A patent/CN118525618A/zh active Pending
- 2023-01-11 EP EP23700212.6A patent/EP4466966B1/fr active Active
- 2023-01-11 JP JP2024540589A patent/JP2025501651A/ja active Pending
- 2023-01-11 US US18/729,023 patent/US20250176431A1/en active Pending
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