TW202418979A - 用於製作移轉壓電層用供體底材的方法和將壓電層移轉到支撐底材的方法 - Google Patents

用於製作移轉壓電層用供體底材的方法和將壓電層移轉到支撐底材的方法 Download PDF

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Publication number
TW202418979A
TW202418979A TW111149571A TW111149571A TW202418979A TW 202418979 A TW202418979 A TW 202418979A TW 111149571 A TW111149571 A TW 111149571A TW 111149571 A TW111149571 A TW 111149571A TW 202418979 A TW202418979 A TW 202418979A
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TW
Taiwan
Prior art keywords
substrate
piezoelectric
polymer layer
stage
layer
Prior art date
Application number
TW111149571A
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English (en)
Chinese (zh)
Inventor
阿弗雷德 塞德里克 查爾斯
摩根 洛基歐
席利 巴瞿
馬賽爾 伯克卡特
路西那 卡佩羅
Original Assignee
法商索泰克公司
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Publication date
Application filed by 法商索泰克公司 filed Critical 法商索泰克公司
Publication of TW202418979A publication Critical patent/TW202418979A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Laminated Bodies (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
TW111149571A 2022-01-17 2022-12-22 用於製作移轉壓電層用供體底材的方法和將壓電層移轉到支撐底材的方法 TW202418979A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FRFR2200381 2022-01-17
FR2200381A FR3131980B1 (fr) 2022-01-17 2022-01-17 Procédé de fabrication d’un substrat donneur pour le transfert d’une couche piézoélectrique et procédé de transfert d’une couche piézoélectrique sur un substrat support

Publications (1)

Publication Number Publication Date
TW202418979A true TW202418979A (zh) 2024-05-01

Family

ID=81581197

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111149571A TW202418979A (zh) 2022-01-17 2022-12-22 用於製作移轉壓電層用供體底材的方法和將壓電層移轉到支撐底材的方法

Country Status (8)

Country Link
US (1) US20250176431A1 (https=)
EP (1) EP4466966B1 (https=)
JP (1) JP2025501651A (https=)
KR (1) KR20240135826A (https=)
CN (1) CN118525618A (https=)
FR (1) FR3131980B1 (https=)
TW (1) TW202418979A (https=)
WO (1) WO2023135179A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6372352B2 (ja) * 2013-07-16 2018-08-15 東洋紡株式会社 フレキシブル電子デバイスの製造方法
JP6396853B2 (ja) * 2015-06-02 2018-09-26 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法
WO2017052646A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Island transfer for optical, piezo and rf applications
FR3079346B1 (fr) 2018-03-26 2020-05-29 Soitec Procede de fabrication d'un substrat donneur pour le transfert d'une couche piezoelectrique, et procede de transfert d'une telle couche piezoelectrique
EP3930429A1 (en) * 2020-06-22 2021-12-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded component connected in cavity by anchored first and second polymers

Also Published As

Publication number Publication date
CN118525618A (zh) 2024-08-20
FR3131980B1 (fr) 2024-01-12
WO2023135179A1 (fr) 2023-07-20
FR3131980A1 (fr) 2023-07-21
JP2025501651A (ja) 2025-01-22
US20250176431A1 (en) 2025-05-29
EP4466966A1 (fr) 2024-11-27
KR20240135826A (ko) 2024-09-12
EP4466966C0 (fr) 2025-12-03
EP4466966B1 (fr) 2025-12-03

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