JP2024519648A5 - - Google Patents

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Publication number
JP2024519648A5
JP2024519648A5 JP2023555677A JP2023555677A JP2024519648A5 JP 2024519648 A5 JP2024519648 A5 JP 2024519648A5 JP 2023555677 A JP2023555677 A JP 2023555677A JP 2023555677 A JP2023555677 A JP 2023555677A JP 2024519648 A5 JP2024519648 A5 JP 2024519648A5
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JP
Japan
Prior art keywords
pat
semiconductor die
adaptive
defect rate
test
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JP2023555677A
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English (en)
Japanese (ja)
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JP2024519648A (ja
JP7637791B2 (ja
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Priority claimed from US17/333,770 external-priority patent/US11798827B2/en
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Publication of JP2024519648A publication Critical patent/JP2024519648A/ja
Publication of JP2024519648A5 publication Critical patent/JP2024519648A5/ja
Application granted granted Critical
Publication of JP7637791B2 publication Critical patent/JP7637791B2/ja
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JP2023555677A 2021-05-06 2022-04-29 インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法 Active JP7637791B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163184793P 2021-05-06 2021-05-06
US63/184,793 2021-05-06
US17/333,770 US11798827B2 (en) 2021-05-06 2021-05-28 Systems and methods for semiconductor adaptive testing using inline defect part average testing
US17/333,770 2021-05-28
PCT/US2022/026850 WO2022235493A1 (en) 2021-05-06 2022-04-29 Systems and methods for semiconductor adaptive testing using inline defect part average testing

Publications (3)

Publication Number Publication Date
JP2024519648A JP2024519648A (ja) 2024-05-21
JP2024519648A5 true JP2024519648A5 (https=) 2024-11-14
JP7637791B2 JP7637791B2 (ja) 2025-02-28

Family

ID=83901649

Family Applications (1)

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JP2023555677A Active JP7637791B2 (ja) 2021-05-06 2022-04-29 インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法

Country Status (8)

Country Link
US (1) US11798827B2 (https=)
EP (1) EP4285128A4 (https=)
JP (1) JP7637791B2 (https=)
KR (1) KR102748448B1 (https=)
CN (1) CN116964461A (https=)
IL (1) IL305052B2 (https=)
TW (1) TWI885254B (https=)
WO (1) WO2022235493A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12137363B2 (en) * 2021-12-14 2024-11-05 Qualcomm Incorporated Techniques for measurement order for carrier aggregation
US20230297091A1 (en) * 2022-03-16 2023-09-21 Claritrics Inc d.b.a BUDDI AI System and method for predictive analytics for fitness of test plan
CN117148091B (zh) * 2023-11-01 2024-02-06 杭州高坤电子科技有限公司 一种半导体测试方法、系统、终端及存储介质

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
JP2008028271A (ja) * 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US8711346B2 (en) 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US8855959B2 (en) * 2010-08-30 2014-10-07 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US8689066B2 (en) 2011-06-29 2014-04-01 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
US10768230B2 (en) 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10867877B2 (en) 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
TWI828676B (zh) * 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品

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