TWI885254B - 使用內嵌缺陷部分平均測試用於半導體適應測試之系統及方法 - Google Patents

使用內嵌缺陷部分平均測試用於半導體適應測試之系統及方法 Download PDF

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Publication number
TWI885254B
TWI885254B TW111112738A TW111112738A TWI885254B TW I885254 B TWI885254 B TW I885254B TW 111112738 A TW111112738 A TW 111112738A TW 111112738 A TW111112738 A TW 111112738A TW I885254 B TWI885254 B TW I885254B
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TW
Taiwan
Prior art keywords
pat
test
semiconductor
semiconductor die
adaptive
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TW111112738A
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English (en)
Chinese (zh)
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TW202248659A (zh
Inventor
羅伯 J 拉瑟
大衛 W 普利斯
切特 Ｖ 萊諾克斯
歐艾斯特 唐賽拉
卡拉 L 榭曼
約翰 羅賓森
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美商科磊股份有限公司
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Publication of TW202248659A publication Critical patent/TW202248659A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW111112738A 2021-05-06 2022-04-01 使用內嵌缺陷部分平均測試用於半導體適應測試之系統及方法 TWI885254B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163184793P 2021-05-06 2021-05-06
US63/184,793 2021-05-06
US17/333,770 US11798827B2 (en) 2021-05-06 2021-05-28 Systems and methods for semiconductor adaptive testing using inline defect part average testing
US17/333,770 2021-05-28

Publications (2)

Publication Number Publication Date
TW202248659A TW202248659A (zh) 2022-12-16
TWI885254B true TWI885254B (zh) 2025-06-01

Family

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TW111112738A TWI885254B (zh) 2021-05-06 2022-04-01 使用內嵌缺陷部分平均測試用於半導體適應測試之系統及方法

Country Status (8)

Country Link
US (1) US11798827B2 (https=)
EP (1) EP4285128A4 (https=)
JP (1) JP7637791B2 (https=)
KR (1) KR102748448B1 (https=)
CN (1) CN116964461A (https=)
IL (1) IL305052B2 (https=)
TW (1) TWI885254B (https=)
WO (1) WO2022235493A1 (https=)

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* Cited by examiner, † Cited by third party
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US12137363B2 (en) * 2021-12-14 2024-11-05 Qualcomm Incorporated Techniques for measurement order for carrier aggregation
US20230297091A1 (en) * 2022-03-16 2023-09-21 Claritrics Inc d.b.a BUDDI AI System and method for predictive analytics for fitness of test plan
CN117148091B (zh) * 2023-11-01 2024-02-06 杭州高坤电子科技有限公司 一种半导体测试方法、系统、终端及存储介质

Citations (7)

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US20070212798A1 (en) * 2006-03-10 2007-09-13 Purnima Deshmukh Die loss estimation using universal in-line metric (uilm)
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US20130007546A1 (en) * 2011-06-29 2013-01-03 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
US8711346B2 (en) * 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US20180275189A1 (en) * 2017-03-23 2018-09-27 Kla-Tencor Corporation Methods and Systems for Inline Parts Average Testing and Latent Reliability Defect Detection
US20190295908A1 (en) * 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data
TW201945923A (zh) * 2018-04-16 2019-12-01 以色列商普騰泰克斯有限公司 積體電路剖析及異常檢測

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US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
JP2008028271A (ja) * 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US8855959B2 (en) * 2010-08-30 2014-10-07 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US10768230B2 (en) 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US20070212798A1 (en) * 2006-03-10 2007-09-13 Purnima Deshmukh Die loss estimation using universal in-line metric (uilm)
US8711346B2 (en) * 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US20130007546A1 (en) * 2011-06-29 2013-01-03 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
US20180275189A1 (en) * 2017-03-23 2018-09-27 Kla-Tencor Corporation Methods and Systems for Inline Parts Average Testing and Latent Reliability Defect Detection
TW201903925A (zh) * 2017-03-23 2019-01-16 美商克萊譚克公司 用於線上部分平均測試及潛在可靠性缺陷偵測之方法及系統
KR20190123792A (ko) * 2017-03-23 2019-11-01 케이엘에이 코포레이션 인라인 부품 평균 테스팅 및 잠재 신뢰성 결함 검출을 위한 방법들 및 시스템들
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US20190295908A1 (en) * 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data
TW201945923A (zh) * 2018-04-16 2019-12-01 以色列商普騰泰克斯有限公司 積體電路剖析及異常檢測

Also Published As

Publication number Publication date
JP2024519648A (ja) 2024-05-21
WO2022235493A1 (en) 2022-11-10
KR20240004252A (ko) 2024-01-11
EP4285128A1 (en) 2023-12-06
JP7637791B2 (ja) 2025-02-28
EP4285128A4 (en) 2025-01-08
US11798827B2 (en) 2023-10-24
IL305052B2 (en) 2025-07-01
CN116964461A (zh) 2023-10-27
IL305052B1 (en) 2025-03-01
KR102748448B1 (ko) 2024-12-30
US20220359247A1 (en) 2022-11-10
IL305052A (en) 2023-10-01
TW202248659A (zh) 2022-12-16

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