IL305052B2 - Systems and methods for adaptive testing of a semiconductor using average line defect fraction testing - Google Patents

Systems and methods for adaptive testing of a semiconductor using average line defect fraction testing

Info

Publication number
IL305052B2
IL305052B2 IL305052A IL30505223A IL305052B2 IL 305052 B2 IL305052 B2 IL 305052B2 IL 305052 A IL305052 A IL 305052A IL 30505223 A IL30505223 A IL 30505223A IL 305052 B2 IL305052 B2 IL 305052B2
Authority
IL
Israel
Prior art keywords
pat
semiconductor die
test
semiconductor
adaptive
Prior art date
Application number
IL305052A
Other languages
English (en)
Hebrew (he)
Other versions
IL305052B1 (en
IL305052A (en
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL305052A publication Critical patent/IL305052A/en
Publication of IL305052B1 publication Critical patent/IL305052B1/en
Publication of IL305052B2 publication Critical patent/IL305052B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL305052A 2021-05-06 2022-04-28 Systems and methods for adaptive testing of a semiconductor using average line defect fraction testing IL305052B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163184793P 2021-05-06 2021-05-06
US17/333,770 US11798827B2 (en) 2021-05-06 2021-05-28 Systems and methods for semiconductor adaptive testing using inline defect part average testing
PCT/US2022/026850 WO2022235493A1 (en) 2021-05-06 2022-04-29 Systems and methods for semiconductor adaptive testing using inline defect part average testing

Publications (3)

Publication Number Publication Date
IL305052A IL305052A (en) 2023-10-01
IL305052B1 IL305052B1 (en) 2025-03-01
IL305052B2 true IL305052B2 (en) 2025-07-01

Family

ID=83901649

Family Applications (1)

Application Number Title Priority Date Filing Date
IL305052A IL305052B2 (en) 2021-05-06 2022-04-28 Systems and methods for adaptive testing of a semiconductor using average line defect fraction testing

Country Status (8)

Country Link
US (1) US11798827B2 (https=)
EP (1) EP4285128A4 (https=)
JP (1) JP7637791B2 (https=)
KR (1) KR102748448B1 (https=)
CN (1) CN116964461A (https=)
IL (1) IL305052B2 (https=)
TW (1) TWI885254B (https=)
WO (1) WO2022235493A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12137363B2 (en) * 2021-12-14 2024-11-05 Qualcomm Incorporated Techniques for measurement order for carrier aggregation
US20230297091A1 (en) * 2022-03-16 2023-09-21 Claritrics Inc d.b.a BUDDI AI System and method for predictive analytics for fitness of test plan
CN117148091B (zh) * 2023-11-01 2024-02-06 杭州高坤电子科技有限公司 一种半导体测试方法、系统、终端及存储介质

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
JP2008028271A (ja) * 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US8711346B2 (en) 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US8855959B2 (en) * 2010-08-30 2014-10-07 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US8689066B2 (en) 2011-06-29 2014-04-01 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
US10768230B2 (en) 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10867877B2 (en) 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
TWI828676B (zh) * 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品

Also Published As

Publication number Publication date
JP2024519648A (ja) 2024-05-21
WO2022235493A1 (en) 2022-11-10
KR20240004252A (ko) 2024-01-11
EP4285128A1 (en) 2023-12-06
JP7637791B2 (ja) 2025-02-28
EP4285128A4 (en) 2025-01-08
US11798827B2 (en) 2023-10-24
CN116964461A (zh) 2023-10-27
IL305052B1 (en) 2025-03-01
KR102748448B1 (ko) 2024-12-30
US20220359247A1 (en) 2022-11-10
IL305052A (en) 2023-10-01
TWI885254B (zh) 2025-06-01
TW202248659A (zh) 2022-12-16

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