JP7637791B2 - インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法 - Google Patents

インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法 Download PDF

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JP7637791B2
JP7637791B2 JP2023555677A JP2023555677A JP7637791B2 JP 7637791 B2 JP7637791 B2 JP 7637791B2 JP 2023555677 A JP2023555677 A JP 2023555677A JP 2023555677 A JP2023555677 A JP 2023555677A JP 7637791 B2 JP7637791 B2 JP 7637791B2
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semiconductor die
adaptive
test
semiconductor
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Japanese (ja)
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JP2024519648A5 (https=
JP2024519648A (ja
Inventor
ロバート ジェイ ラザート
デビッド ダブリュー プライス
チェット レノックス
オレステ ドンゼッラ
ジョン ロビンソン
カーラ シャーマン
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KLA Corp
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KLA Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2023555677A 2021-05-06 2022-04-29 インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法 Active JP7637791B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163184793P 2021-05-06 2021-05-06
US63/184,793 2021-05-06
US17/333,770 US11798827B2 (en) 2021-05-06 2021-05-28 Systems and methods for semiconductor adaptive testing using inline defect part average testing
US17/333,770 2021-05-28
PCT/US2022/026850 WO2022235493A1 (en) 2021-05-06 2022-04-29 Systems and methods for semiconductor adaptive testing using inline defect part average testing

Publications (3)

Publication Number Publication Date
JP2024519648A JP2024519648A (ja) 2024-05-21
JP2024519648A5 JP2024519648A5 (https=) 2024-11-14
JP7637791B2 true JP7637791B2 (ja) 2025-02-28

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JP2023555677A Active JP7637791B2 (ja) 2021-05-06 2022-04-29 インライン欠陥部分平均試験を使用する適応的半導体試験のためのシステムおよび方法

Country Status (8)

Country Link
US (1) US11798827B2 (https=)
EP (1) EP4285128A4 (https=)
JP (1) JP7637791B2 (https=)
KR (1) KR102748448B1 (https=)
CN (1) CN116964461A (https=)
IL (1) IL305052B2 (https=)
TW (1) TWI885254B (https=)
WO (1) WO2022235493A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12137363B2 (en) * 2021-12-14 2024-11-05 Qualcomm Incorporated Techniques for measurement order for carrier aggregation
US20230297091A1 (en) * 2022-03-16 2023-09-21 Claritrics Inc d.b.a BUDDI AI System and method for predictive analytics for fitness of test plan
CN117148091B (zh) * 2023-11-01 2024-02-06 杭州高坤电子科技有限公司 一种半导体测试方法、系统、终端及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008500737A (ja) 2004-05-25 2008-01-10 インターナショナル・ビジネス・マシーンズ・コーポレーション プローブ再試験データ解析を使用するウェハ試験での生産性向上
JP2008028271A (ja) 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US20120049881A1 (en) 2010-08-30 2012-03-01 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US20190295908A1 (en) 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
US8711346B2 (en) 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US8689066B2 (en) 2011-06-29 2014-04-01 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
US10768230B2 (en) 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
TWI828676B (zh) * 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008500737A (ja) 2004-05-25 2008-01-10 インターナショナル・ビジネス・マシーンズ・コーポレーション プローブ再試験データ解析を使用するウェハ試験での生産性向上
JP2008028271A (ja) 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US20120049881A1 (en) 2010-08-30 2012-03-01 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US20120330593A1 (en) 2010-08-30 2012-12-27 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US20190295908A1 (en) 2018-03-20 2019-09-26 Kla-Tencor Corporation Targeted Recall of Semiconductor Devices Based on Manufacturing Data

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
John C. Robinson et al.，Inline Part Average Testing (I-PAT) for Automotive Die Reliability，Proceedings of SPIE，2020年03月20日，Vol.11325，113250D-1 - 113250D-10

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Publication number Publication date
JP2024519648A (ja) 2024-05-21
WO2022235493A1 (en) 2022-11-10
KR20240004252A (ko) 2024-01-11
EP4285128A1 (en) 2023-12-06
EP4285128A4 (en) 2025-01-08
US11798827B2 (en) 2023-10-24
IL305052B2 (en) 2025-07-01
CN116964461A (zh) 2023-10-27
IL305052B1 (en) 2025-03-01
KR102748448B1 (ko) 2024-12-30
US20220359247A1 (en) 2022-11-10
IL305052A (en) 2023-10-01
TWI885254B (zh) 2025-06-01
TW202248659A (zh) 2022-12-16

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