CN116964461A - 使用内嵌缺陷部分平均测试进行半导体自适应测试的系统及方法 - Google Patents

使用内嵌缺陷部分平均测试进行半导体自适应测试的系统及方法 Download PDF

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Publication number
CN116964461A
CN116964461A CN202280018925.1A CN202280018925A CN116964461A CN 116964461 A CN116964461 A CN 116964461A CN 202280018925 A CN202280018925 A CN 202280018925A CN 116964461 A CN116964461 A CN 116964461A
Authority
CN
China
Prior art keywords
pat
test
semiconductor die
adaptive
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280018925.1A
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English (en)
Chinese (zh)
Inventor
R·J·拉瑟
D·W·普利斯
C·伦诺克斯
O·唐泽拉
J·鲁滨逊
K·榭曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN116964461A publication Critical patent/CN116964461A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202280018925.1A 2021-05-06 2022-04-29 使用内嵌缺陷部分平均测试进行半导体自适应测试的系统及方法 Pending CN116964461A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163184793P 2021-05-06 2021-05-06
US63/184,793 2021-05-06
US17/333,770 US11798827B2 (en) 2021-05-06 2021-05-28 Systems and methods for semiconductor adaptive testing using inline defect part average testing
US17/333,770 2021-05-28
PCT/US2022/026850 WO2022235493A1 (en) 2021-05-06 2022-04-29 Systems and methods for semiconductor adaptive testing using inline defect part average testing

Publications (1)

Publication Number Publication Date
CN116964461A true CN116964461A (zh) 2023-10-27

Family

ID=83901649

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280018925.1A Pending CN116964461A (zh) 2021-05-06 2022-04-29 使用内嵌缺陷部分平均测试进行半导体自适应测试的系统及方法

Country Status (8)

Country Link
US (1) US11798827B2 (https=)
EP (1) EP4285128A4 (https=)
JP (1) JP7637791B2 (https=)
KR (1) KR102748448B1 (https=)
CN (1) CN116964461A (https=)
IL (1) IL305052B2 (https=)
TW (1) TWI885254B (https=)
WO (1) WO2022235493A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12137363B2 (en) * 2021-12-14 2024-11-05 Qualcomm Incorporated Techniques for measurement order for carrier aggregation
US20230297091A1 (en) * 2022-03-16 2023-09-21 Claritrics Inc d.b.a BUDDI AI System and method for predictive analytics for fitness of test plan
CN117148091B (zh) * 2023-11-01 2024-02-06 杭州高坤电子科技有限公司 一种半导体测试方法、系统、终端及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US20130007546A1 (en) * 2011-06-29 2013-01-03 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
KR20190123792A (ko) * 2017-03-23 2019-11-01 케이엘에이 코포레이션 인라인 부품 평균 테스팅 및 잠재 신뢰성 결함 검출을 위한 방법들 및 시스템들

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US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
US7485548B2 (en) * 2006-03-10 2009-02-03 Micron Technology, Inc. Die loss estimation using universal in-line metric (UILM)
JP2008028271A (ja) * 2006-07-25 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路装置のテスト方法、および半導体集積回路装置の検査装置
US8711346B2 (en) 2009-06-19 2014-04-29 Kla-Tencor Corporation Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
US8855959B2 (en) * 2010-08-30 2014-10-07 International Business Machines Corporation Integrated cross-tester analysis and real-time adaptive test
US10768230B2 (en) 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10867877B2 (en) 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
TWI828676B (zh) * 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
US20130007546A1 (en) * 2011-06-29 2013-01-03 International Business Machines Corporation Integrated circuit test optimization using adaptive test pattern sampling algorithm
KR20190123792A (ko) * 2017-03-23 2019-11-01 케이엘에이 코포레이션 인라인 부품 평균 테스팅 및 잠재 신뢰성 결함 검출을 위한 방법들 및 시스템들
CN110419099A (zh) * 2017-03-23 2019-11-05 科磊股份有限公司 用于线上部分平均测试及潜在可靠性缺陷检验的方法及系统

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOHN C. ROBINSON 等: "Inline Part Average Testing (I-PAT) for Automotive Die Reliability", 《PROCEEDINGS OF SPIE》, vol. 11325, 23 October 2020 (2020-10-23), pages 113250 *

Also Published As

Publication number Publication date
JP2024519648A (ja) 2024-05-21
WO2022235493A1 (en) 2022-11-10
KR20240004252A (ko) 2024-01-11
EP4285128A1 (en) 2023-12-06
JP7637791B2 (ja) 2025-02-28
EP4285128A4 (en) 2025-01-08
US11798827B2 (en) 2023-10-24
IL305052B2 (en) 2025-07-01
IL305052B1 (en) 2025-03-01
KR102748448B1 (ko) 2024-12-30
US20220359247A1 (en) 2022-11-10
IL305052A (en) 2023-10-01
TWI885254B (zh) 2025-06-01
TW202248659A (zh) 2022-12-16

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